A system and methods for operating a cardboard processing machine, the method comprising creating a pre-processing crease at a location on the cardboard where it is required to process the cardboard; and processing the cardboard along the pre-process crease.

A method for processing a workpiece with a laser cutting machine includes reading out a machine parameter and a material parameter and outputting a process parameter recommendation. The process parameter recommendation is created by a process parameter algorithm with at least one data aggregation routine based on a plurality of cut edge quality features. The method further includes generating a cut edge by laser processing the workpiece.

A laser apparatus with synchronous light path delay comprises a laser path adjustment unit and a gantry-type machine. The gantry-type machine drives a machining head to move two-dimensionally or three-dimensionally which will induce a light path length change defined by the total moving distance of the machining head. The laser path adjustment unit synchronously adjusts the traveling distance of a laser beam traveling to the machining head according to the total moving distance of the machining head. In this way, the focus spot size of the laser beam inputted from the machining head remains unchanged and the focus spot remains on a flat surface.

A laser processing method comprises generating a laser beam comprising laser pulses having a duration less than 1000 ps, focussing the laser beam to form a focal region inside a transparent material and varying the position of at least one of the focal region and the transparent material so as to provide a pulse-to-pulse overlap of between 45% and 99%, thereby to form a smooth material modification inside the transparent material.

A laser processing device configured to generally vertically irradiate a laser beam to a workpiece, and having a function for reducing an adverse effect due to a reflected laser beam from the workpiece. The laser processing device includes: a light condensing point moving part configured to move a focal point in an optical axis direction while irradiating the laser beam, by moving at least one of a processing head, an optical component of a light condense optical system, and a workpiece; and a light condensing point distance setting part configured to set a light condensing point distance between the light condensing point and a workpiece surface when the laser beam is started to be irradiated, wherein the light condensing point distance is set so that an amount of the reflected laser beam returned to the processing head through the optical system is not more than an allowable value.

A three-dimensional laser machine includes a machine head, a controller for positioning the machine head and controlling an orientation of a nozzle, and a sensor for detecting a distance between a workpiece and the nozzle. The controller is capable of performing a profile control of correcting the position of the machine head based on the detected distance. When the machine head has reached a predetermined position part way through an approach process of moving the machine head from an approach start position to a machining start position while controlling the pose of the nozzle, the controller performs the profile control to move the machine head to the machining start position.

Embodiments of present disclosure discloses system and method for performing laser marking. Initially, a first image of a region to be laser marked may be captured and compared with a predefined image of a predefined pattern to be laser marked on the region. By the comparison, a first score may be computed. The first score may indicate marking present in the region to be laser marked, in relation to the predefined image. Further, a co-ordinate data of a configuration file, relating to the predefined pattern, in the laser marking system may be modified based on the first score, for performing the laser marking on the region.

Provided is a welding method enabling enhancement of quality of welding between an upper plate and a lower plate. One aspect of the present disclosure is the welding method including welding the upper plate and the lower plate overlapped with the upper plate by irradiating a surface of the upper plate with a laser beam. The welding includes: forming an auxiliary welding path that is continuous and includes a reciprocating or circling path; and forming a main welding path that intersects a welding advancing direction and that includes turning points, after formation of the auxiliary welding path.

Vision correction and tracking systems may be used in laser machining systems and methods to improve the accuracy of the machining. The laser machining systems and methods may be used to scribe one or more lines in large flat workpieces such as solar panels. In particular, laser machining systems and methods may be used to scribe lines in thin film photovoltaic (PV) solar panels with accuracy, high speed and reduced cost. The vision correction and/or tracking systems may be used to provide scribe line alignment and uniformity based on detected parameters of the scribe lines and/or changes in the workpiece.

Vision correction and tracking systems may be used in laser machining systems and methods to improve the accuracy of the machining. The laser machining systems and methods may be used to scribe one or more lines in large flat workpieces such as solar panels. In particular, laser machining systems and methods may be used to scribe lines in thin film photovoltaic (PV) solar panels with accuracy, high speed and reduced cost. The vision correction and/or tracking systems may be used to provide scribe line alignment and uniformity based on detected parameters of the scribe lines and/or changes in the workpiece.