A laser processing system herein includes a laser oscillator, a laser optical path that guides laser beam from a laser beam emission port of the laser oscillator to a workpiece, an impure gas adsorbent for adsorbing impure gases that influence the propagation of the laser beam, and a shutter that exposes the impure gas adsorbent in the laser optical path.

A laser processing system herein includes a laser oscillator, a laser optical path that guides laser beam from the laser oscillator to a workpiece, a purge gas supply line for supplying a purge gas into the laser optical path, oxygen sensor and an impure gas sensor which detects an impure gas influencing the propagation of the laser beam that are installed in the laser optical path, and an impure gas sensor output value correction unit. The impure gas sensor output value correction unit corrects an output value of the impure gas sensor based on an output value of the oxygen sensor.

A laser irradiation apparatus which is provided with: an environment isolation container, which houses a laser oscillator and is disposed in water; a laser irradiation head, which collects laser beams and irradiates a part to be machined with the laser beams; a light guide section which transmits the laser beams from the laser oscillator to the laser irradiation head; a power supply apparatus which supplies the laser oscillator with power; a cooling water supplying apparatus, which supplies the laser oscillator with cooling water through a cooling water supplying path; and a temperature sensor which measures the temperature inside of the environment isolation container. The temperature and/or the flow quantity of the cooling water to be supplied from the cooling water supplying apparatus is controlled on the basis of the measurement results obtained from the temperature sensor.

A laser cutting tool with protective enclosure assembly for manipulating a workpiece on a movable platen includes a frame, a top protection assembly, a middle protection shield, a bottom protection assembly and a laser torch head. The top protection assembly, middle protection assembly, and bottom protection assembly are removably mounted to the frame such that they form a cavity enclosing only substantially the laser torch head.

Laser ablation systems comprise a flow-directing structure that comprises a body that is configured to be operatively attached to a laser assembly relative to purge-gas jet and an optical assembly. The internal volume and the outlet of the flow-directing structure are configured to direct high velocity air away from an optic surface of the laser assembly and toward a substrate surface being ablated by the laser ablation system. Laser ablation methods comprise emitting a laser beam through a optic surface of an optical assembly of a laser assembly, directing high velocity purge gas toward the optic surface, constraining the purge gas within a body of a flow-directing structure to create positive pressure inside the body, exhausting a column of the purge gas out of the body toward the substrate surface, removing a plasma plume from a path of the laser beam, and dissipating fumes and effluent.

An electromagnetic radiation steering mechanism is configured to steer electromagnetic radiation to address a specific location within a two-dimensional field of view. The electromagnetic radiation steering mechanism comprises a first optical element having an associated first actuator configured to rotate the first optical element about a first rotational axis to change a first coordinate of a first steering axis; a second optical element having an associated second actuator configured to rotate the second optical element about a second rotational axis to change a second coordinate of a second steering axis; and an electromagnetic radiation manipulator optically disposed between the first and second optical elements. The electromagnetic radiation steering mechanism comprises a reflector configured to redirect incoming electromagnetic radiation towards the first optical element to form a coaxial device in which the incoming electromagnetic radiation propagates in a direction substantially parallel to the first and second rotational axes.

A laser processing head for directing a laser beam includes two reflectors and a sole lens element. The first reflector disposed in a housing's interior reflects the laser beam from a source to the second reflector, which then reflects the laser beam toward a process zone for a workpiece. The single lens element is disposed in the housing's interior between the reflectors. The lens element can be moved to adjust a focal position of the laser beam beyond the housing's outlet. To reduce contamination, one or more nozzles are configured to direct purge gas across one or more of the first reflector, the second reflector, and the lens element, while one or more collection areas disposed in the interior are configured to collect contamination directed from the purge gas.

A laser cutting tool with protective enclosure assembly for manipulating a workpiece on a movable platen includes a frame, a top protection assembly, a middle protection shield, a bottom protection assembly and a laser torch head. The top protection assembly, middle protection assembly, and bottom protection assembly are removably mounted to the frame such that they form a cavity enclosing only substantially the laser torch head.

A laser processing system includes an irradiation device that irradiates a laser beam to a workpiece and includes a housing, a box positioned inside the housing and housing at least a part of a path of the laser beam, and at least one infrared sensor positioned inside the housing and around the box.

A laser working machine includes a first slot provided at another end portion of a first body. In the first slot, either one of a first shielding plate and a first light transmissive plate is selectively insertable in a sealed manner. The first shielding plate is configured to block a first optical path. The first light transmissive plate has a first optical path hole through which the first optical path and a second optical path are connectable. The laser working machine includes a second slot provided at a second body end portion of a second body. In the second slot, either one of a second shielding plate and a second light transmissive plate is selectively insertable in a sealed manner. The second shielding plate is configured to block the second optical path. The second light transmissive plate has a second optical path hole.