A laser cutting apparatus includes a laser beam irradiation apparatus configured to radiate a laser beam, a pressure wave irradiation part including a plurality of pressure wave sources configured to radiate pressure waves toward a fusing part or a section to be cut by the laser beam, and a jet injection part configured to inject jets toward the fusing part or the section to be cut along respective outer circumferential sides of the pressure waves.

Methods and apparatus for laser patterning leverage mask trench debris removal techniques to form etch singulation trenches. In some embodiments, the method includes forming a mask layer on the wafer, forming a pattern in the mask layer using a laser of a laser assembly where the pattern allows singulation of the wafer by deep etching and forms a trench in the mask layer with a laser beam which has a process point at a bottom of the trench, directing gas nozzles that flow a pressurized gas at the process point in the trench as the pattern is formed with a gas flow angle relative to the process point and evacuating debris from the trench using an area of negative pressure where the gas flow from gas nozzles and the area of negative pressure are in fluid contact and are confined within a cylindrical housing.

Disclosed is a laser beam processing device, the main part of which is a coupling device (1) for coupling a focused laser beam (2) into a fluid jet (3) of a defined cross-section. The coupling device (1) comprises a housing (4), in which a fluid nozzle is configured for forming the fluid jet (3). In addition, an outlet opening (6) is provided in the housing, through which the fluid jet (3) exits from the housing (4) and the cross-section of which is larger than the cross-section of the fluid jet (3). A passage chamber is provided between the fluid nozzle (5) and the outlet opening (6) for the fluid jet (3). According to the invention, a throttle bore is provided, which connects the passage chamber (7) to the pressure chamber and is dimensioned in relation to the outlet opening so that, in the region of the passage chamber which is arranged about the fluid nozzle (5), there is a pressure that is smaller than the pressure in the pressure chamber so that an overpressure does not form in the passage chamber with respect to the pressure in the pressure chamber. In addition, a method is disclosed for setting a pressure in the passage chamber (7) in a coupling device of this type, in which the pressure does not exceed the pressure in the pressure chamber.

To provide a nozzle for laser processing head capable of reliably drilling a small hole when drilling of the workpiece is performed by using a laser machine. A nozzle includes: a nozzle tip body that irradiates a workpiece with a laser beam; a charge port formed in the nozzle tip body; an exhaust port formed in the nozzle tip body so as to oppose to the charge port; and an elastic member that is provided in a tip end of the nozzle tip body and contacts with the workpiece while elastically extending and contracting in the axial center direction of the nozzle tip body. The nozzle supplies gas to the inside of the nozzle tip body along a gas flow path extending from the charge port to the exhaust port in a form of crossing across the laser beam in the nozzle tip body, to generate a negative pressure in the vicinity of an opening part of a tip end of the nozzle tip body. The elastic member contacts with the workpiece and improves the degree of enclosure of the nozzle tip body by the workpiece. Thereby, higher negative pressure than the negative pressure is generated.

Methods and apparatus for laser patterning leverage mask trench debris removal techniques to form etch singulation trenches. In some embodiments, the method includes forming a mask layer on the wafer, forming a pattern in the mask layer using a laser of a laser assembly where the pattern allows singulation of the wafer by deep etching and forms a trench in the mask layer with a laser beam which has a process point at a bottom of the trench, directing gas nozzles that flow a pressurized gas at the process point in the trench as the pattern is formed with a gas flow angle relative to the process point and evacuating debris from the trench using an area of negative pressure where the gas flow from gas nozzles and the area of negative pressure are in fluid contact and are confined within a cylindrical housing.

Methods and systems are implemented for piercing a metal workpiece by means of a laser beam and a process gas The methods and systems form a hole in the workpiece using the laser beam and using an inert gas as the process gas, such that the formed hole extends only partially through the workpiece, widen the upper part of the hole into a trough that surrounds the hole on the top side of the workpiece using the laser beam and using oxygen as the process gas, and fully pierce the hole using the laser beam and using oxygen as the process gas.

This disclosure relates to methods for cutting metal workpieces in sheet form with a thickness of at least 2 mm. A laser beam is positioned in a nozzle opening of a cutting gas nozzle configured to cut via the laser beam and a cutting gas so that a beam axis of the laser beam along a direction of propagation of the laser beam is at least a distance of 3 mm from a rear opening wall portion of the nozzle opening. Cutting gas configured for concurrently exiting the nozzle opening with the laser beam is emitted through the nozzle opening at a cutting gas pressure (p) of at most 10 bar.

A system for performing a laser peening application on a workpiece. A purge system is included with the system to provide a compartment housing combustion sources with compressed air so that the compartment has an increased air pressure. Also, a method of operating the system in which power is provided to the system, but only the purge system operates initially. Only after the purge system has bene operating, are the other subsystems and components of the systems, like the laser, provided with operational power.

A system for performing a laser peening application on a workpiece. A purge system is included with the system to provide a compartment housing combustion sources with compressed air so that the compartment has an increased air pressure. Also, a method of operating the system in which power is provided to the system, but only the purge system operates initially. Only after the purge system has bene operating, are the other subsystems and components of the systems, like the laser, provided with operational power.

The invention relates to a method for controlling stress in a substrate during laser deposition. The method includes the steps of: providing a laser deposition device including a chamber with a target holder with a target, a substrate holder with a substrate facing the target and a window, the laser deposition device further including a laser beam directed through the window of the chamber onto a spot at the target for generating a plasma plume of target material and depositing the target material onto a surface portion of the substrate in order to form a thin film of target material, wherein the target spot is movable relative to the substrate in order to deposit target material onto a plurality of surface portions of the substrate; defining a plurality of discrete surface portions on the substrate; aligning the target spot one after the other with each of the plurality of discrete surface portions and generating a plasma plume to deposit target material on each of the plurality of discrete surface portions; and adjusting at least one of the parameters of the deposition process depending on the discrete surface portion with which the target spot is aligned, which parameters include temperature, pressure, laser beam pulse duration, laser beam power, distance of target to substrate.