The present invention provides a machining fluid comprising a first phase fluid and a second phase fluid pressurized to be dissolved in the first phase fluid. The present invention further provides a machining device comprising an injecting head having a nozzle and a flow channel communicating with the nozzle for guiding the machining fluid to the nozzle injecting the machining fluid to an object. Alternatively, the present invention further provides a machining device comprising a light source for generating a laser beam and an injecting head having a nozzle and a flow channel communicating with the nozzle. The flow channel guides a machining fluid having a first phase fluid and a second phase fluid such that the machining fluid is injected to an object by the nozzle. The injecting head also receives the laser beam and guides the laser beam to the object through the nozzle.

According to an embodiment, an apparatus for manufacturing a display device includes a stage on which a target substrate is mounted, and a suction unit positioned above the stage. The suction unit includes a main body including an outer box with top and bottom openings and an inner cup disposed in the outer box, a light emitting unit disposed on at least one inner surface of the outer box, the light emitting unit providing light, and a light receiving unit disposed opposite to the light emitting unit, and disposed on at least one inner surface of the outer box, the light receiving unit receiving the light provided from the light emitting unit.

Methods for direct writing of single crystal super alloys and metals are provided. The method can include: heating a substrate positioned on a base plate to a predetermined temperature using a first heater; using a laser to form a melt pool on a surface of the substrate; introducing a superalloy powder to the melt pool; measuring the temperature of the melt pool; receiving the temperature measured at a controller; and using an auxiliary heat source in communication with the controller to adjust the temperature of the melt pool. The predetermined temperature is below the substrate's melting point. The laser and the base plate are movable relative to each other, with the laser being used for direct metal deposition. An apparatus is also generally provided for direct writing of single crystal super alloys and metals.

An article includes a ceramic material and features a machined surface that is characteristic of cold ablation laser machining, and the machined surface exhibits no visible oxidation. A laser machining apparatus and technique is based on cold-ablation, but is modified or augmented with an inert assist gas, to minimize deleterious surface modifications and mitigate the oxide formation associated with laser machining.

A material deposition unit includes a radiation unit designed to emit electromagnetic radiation in a directed manner onto a workpiece along a beam axis, and a powder discharge device that has multiple powder discharge units configured to discharge powder in a directed form onto the workpiece through powder-outlet openings. The material deposition unit further includes a powder division unit having multiple powder channels. A number of powder channels corresponds to a number of powder discharge units. The powder division unit is designed to distribute a central powder stream guided to a feed channel uniformly over the powder channels. Each respective powder channel is connected to a respective powder discharge unit by an exchangeable connecting element. At least one powder discharge unit has an exchangeable powder discharge element, which is elongate, has a first end and a second end, and is arranged at least partially within the corresponding powder discharge unit.

A nozzle for a laser processing head is provided. The nozzle includes a primary passage disposed in a body of the nozzle. The primary passage is configured to direct a laser beam and a primary fluid from a proximal end of the body to a distal end of the body. The nozzle also includes a set of at least one auxiliary passage disposed in the body of the nozzle and radially offset from a longitudinal axis of the primary passage. A distal portion of the auxiliary passage diverts into two fluid flow passages including (i) a first fluid flow passage configured to direct a first portion of an auxiliary fluid axially forward toward the distal end of the nozzle body, and (ii) a second fluid flow passage configured to direct a second portion of the auxiliary fluid radially inward to mix with the primary fluid in the primary passage.

An apparatus for laser materials processing including a laser (4) for generating a laser beam and a laser head (5) which is movable along at least one spatial direction and is connected to the laser via a light guide, and which emits a laser beam (7) capable of processing a material. The present invention also relates to an apparatus for selective laser melting or selective laser sintering having an apparatus for laser materials processing.

A manufacturing machine is capable of subtractive manufacturing and additive manufacturing for a workpiece. The manufacturing machine includes: a first headstock and a second headstock disposed in a machining area and configured to hold a workpiece; a tool spindle and a lower tool rest disposed in the machining area and configured to hold a tool to be used for subtractive manufacturing for the workpiece; an additive manufacturing head configured to discharge a material during additive manufacturing for the workpiece; a workpiece gripper configured to grip the workpiece during transportation of the workpiece into and out of the machining area; and a robot arm on which the additive manufacturing head and the workpiece gripper are mountable. Accordingly, the manufacturing machine improving the productivity in the simple and easy manner is provided.

A laser etching apparatus includes a chamber, a laser port, a laser emitter, a particle grabber, and a revolving window module. The chamber is configured to receive a substrate. The laser port is disposed below the chamber in a downward direction. The laser emitter is configured to emit a laser to the substrate disposed within the chamber through the laser port. The particle grabber is disposed within the chamber and includes a body disposed over the laser port. An opening is formed through the body. The opening is configured to pass the laser therethrough. The revolving window module includes a revolving window and a driving part configured to drive the revolving window. The revolving window is disposed between the particle grabber and the laser port.

A high power laser drilling system utilizing an electric motor laser bottom hole assembly. A high power laser beam travels within the electric motor for performing a laser operation. A system includes a down hole electrical motor having a hollow rotor for conveying a high power laser beam having a wavelength less than 1060 nm through the electrical motor.