Metallization of semiconductor substrates using a laser beam, and the resulting structures, e.g., micro-electronic devices, semiconductor substrates and/or solar cells, solar cell circuit, solar cell strings, and solar cell arrays are described. A solar cell string can include a plurality of solar cells. The plurality of solar cells can include a substrate and a plurality of semiconductor regions disposed in or above the substrate. A plurality of conductive contact structures is electrically connected to the plurality semiconductor regions. Each conductive contact structure includes a locally deposited metal portion disposed in contact with a corresponding one of the semiconductor regions.

Presented are intelligent non-autogenous metalworking systems and control logic for automated wire-to-beam alignment, methods for making/using such systems, and robot-borne laser welding/brazing heads with closed-loop control for real-time wire alignment. A method for controlling operation of a non-autogenous workpiece processing system includes a system controller receiving sensor signals from a position sensor indicative of a location of filler wire discharged into a joint region by a wire feeder. Using the received sensor signals, the controller determines a displacement between the wire location and a location of a beam emitted onto the joint region by a beam emitter. If the wire displacement is greater than a threshold wire displacement value, the controller responsively determines a corrective force calculated to reduce wire displacement to below the threshold wire displacement value. The controller then commands the actuator to pivot the processing head to thereby apply the corrective force to the discharging filler wire.

Presented are intelligent non-autogenous metalworking systems and control logic for automated wire-to-beam alignment, methods for making/using such systems, and robot-borne laser welding/brazing heads with closed-loop control for real-time wire alignment. A method for controlling operation of a non-autogenous workpiece processing system includes a system controller receiving sensor signals from a position sensor indicative of a location of filler wire discharged into a joint region by a wire feeder. Using the received sensor signals, the controller determines a displacement between the wire location and a location of a beam emitted onto the joint region by a beam emitter. If the wire displacement is greater than a threshold wire displacement value, the controller responsively determines a corrective force calculated to reduce wire displacement to below the threshold wire displacement value. The controller then commands the actuator to pivot the processing head to thereby apply the corrective force to the discharging filler wire.

A method for welding between two metallic plates, including: (a) fitting a solid plate without openings, configured to be transparent at at least one emission wavelength of a laser beam (F) emitted by a laser (L), between the laser (L) and at least one contact zone between the metallic plates to be welded; (a1) inerting of the contact zone via a netural gas, where the neutral gas circulates in channels delimited by the contact zone between the metallic plates and by the solid plate; (a2) exerting pressure on the two metallic plates to apply them against one another in the contact zone to be welded, where the application pressure is exerted by the solid plate directly in contact with one of the two metallic plates to be welded; and (b) emission of a laser beam, through the solid plate, to perform welding of the metallic plates in the contact zone.

A method for welding between two metallic plates, including: (a) fitting a solid plate without openings, configured to be transparent at at least one emission wavelength of a laser beam (F) emitted by a laser (L), between the laser (L) and at least one contact zone between the metallic plates to be welded; (a1) inerting of the contact zone via a netural gas, where the neutral gas circulates in channels delimited by the contact zone between the metallic plates and by the solid plate; (a2) exerting pressure on the two metallic plates to apply them against one another in the contact zone to be welded, where the application pressure is exerted by the solid plate directly in contact with one of the two metallic plates to be welded; and (b) emission of a laser beam, through the solid plate, to perform welding of the metallic plates in the contact zone.

A method for joining an optical crystal to a substrate includes radiating a pulsed laser beam through the optical crystal or through the substrate onto a surface of an intermediate layer between the optical crystal and the substrate, and forming a fusion zone in the intermediate layer between the optical crystal and the substrate by the radiation of the pulsed laser beam, thereby integrally joining the optical crystal and the substrate.

A method for joining an optical crystal to a substrate includes radiating a pulsed laser beam through the optical crystal or through the substrate onto a surface of an intermediate layer between the optical crystal and the substrate, and forming a fusion zone in the intermediate layer between the optical crystal and the substrate by the radiation of the pulsed laser beam, thereby integrally joining the optical crystal and the substrate.

A welding or cladding apparatus in which one or more energy beam emitters are used to generate a wide beam spot transverse to a welding or cladding path, and one or more wide feeders feed wire to the spot to create a wide welding or cladding puddle.

A welding or cladding apparatus in which one or more energy beam emitters are used to generate a wide beam spot transverse to a welding or cladding path, and one or more wide feeders feed wire to the spot to create a wide welding or cladding puddle.

The invention relates to a tool for realising a press quenching and tempering method for a rotational symmetric tool, in particular for a gear wheel, wherein the tool is at least in part manufactured as an additive and wherein, in an additively manufactured area of the tool, is formed at least one pipe for guiding a fluid.