A method for joining dissimilar materials includes forming a first recess and a second recess by irradiating a surface of a first member with laser light, the first recess and the second recess being cut into the surface obliquely at angles different from each other, and joining the second member to the surface of the first member with a part of the second member engaging with each of the first recess and the second recess by melting the part of the second member lower in melting point than the first member to cause the part of the second member to flow into each of the first recess and the second recess and solidifying the part of the second member.

The present invention relates to a method of joining glass elements with material continuity, to a glass component, to a housing, and to a vacuum insulating panel. The method comprises the following steps providing first and second glass elements, with each of the glass elements having at least one joining region having an outer edge to be joined, introducing a metallic material into the first glass element in the region of the joining region of the first glass element, placing the first and second glass elements onto one another such that the first and second glass elements contact one another at least at one outer edge of the respective joining region; and heating the metallic material in the first glass element so that the glass element at least partially melts in the region of the joining region of the first glass element so that a connection with material continuity is produced between the first and second glass elements.

A method of acupuncture needle packaging includes inserting an acupuncture needle body of an acupuncture needle including an acupuncture needle handle at an upper portion thereof into an acupuncture needle tube starting from the acupuncture needle handle; disposing the acupuncture needle in the acupuncture needle tube in a state in which the upper portion of the acupuncture needle handle is exposed to an exterior of the acupuncture needle tube; ascending the upper portion of the acupuncture needle handle exposed to the exterior using a pressing jig; irradiating a laser to an area where the acupuncture needle tube and the acupuncture needle handle abut each other; and coupling the acupuncture needle handle and the acupuncture needle tube by thermally deforming the area where the acupuncture needle tube and the acupuncture needle handle abut each other with a heat generated by the laser.

The invention relates to laser equipment, specifically pulsed scanning lasers used to cut brittle substrates. The authors propose a method and device for forming a stressed edge in the substrate for cleaving of the substrate, to which end a track of cavities is formed through optically induced breakdown in the body of tire material during its irradiation with a focused laser beam with a fixed focal distance during the course of angled scanning of the laser beam, with longitudinal movement along the length of the substrate. The technical result is: improved strength parameters of products and better quality of straight and oblique edges formed during substrate cleaving, absence of chips and microcracks, high rate of formation of the stressed cleaving edge, which implies faster laser cutting.

The present disclosure relates to methods of manufacture, apparatus, and fixtures. An apparatus comprising an inner liner having a hollow chamber extending the length of the inner liner, at least two guide rings disposed collectively along the inner liner, and at least one lumen portion extending through each of the at least two guide rings and being parallel with the hollow chamber, wherein the at least two components are fixed by welding is provided. Further provided is a fixture and a method of manufacture.

The invention relates to a method for welding a first workpiece (11) to a second workpiece (12) by means of a laser. It is an object of the invention to provide a reliable, repeatable and reproducible approach for laser welding of two workpieces one of which consists of a semiconductor material. The method proposed by the invention comprises the following steps: Irradiating the first workpiece (11) with a beam of pulsed laser radiation, wherein the first workpiece (11) consists of a semiconductor material which is transparent at the wavelength of the laser radiation, so that the beam enters the first workpiece (11) through an entrance surface and leaves it through an exit surface, the geometric focus of the beam being positioned in the plane of the exit surface; determining a delocalization of the focus caused by nonlinear interaction of the laser radiation with the semiconductor material; placing the second workpiece (12) against the first workpiece (11); and, again, irradiating the first workpiece (11) with the laser beam of pulsed laser radiation, the focus of the laser radiation being positioned along the beam direction taking into account the determined delocalization so that the intensity maximum is located in the plane of the exit surface forming the interface of the two workpieces (11, 12), whereby the first workpiece (11) is welded to the second workpiece (12). Moreover, the invention relates to a system for welding a first workpiece (11) to a second workpiece (12).

A method for producing an additively-manufactured article includes: a step for feeding a powdered material onto a base metal, the powdered material being obtained by mixing a first powder containing a stellite alloy and a second powder containing tungsten carbide; a nd a step for irradiating the fed powdered material with a laser beam while weaving the lase r beam, and depositing a cladding layer, obtained by melting and solidifying at least the pow dered material, on the base metal. The step for depositing the cladding layer is performed such that 20≤A≤35, 2.2≤B≤2.9, and 5 mass%≤R2≤15 mass% are satisfied, where A is a laser heat input index, B is a powder feeding rate index, and R2 is the ratio of the second powder contained in the powdered material.

A method for producing an additively-manufactured article includes: a step for feeding a powdered material onto a base metal, the powdered material being obtained by mixing a first powder containing a stellite alloy and a second powder containing tungsten carbide; a nd a step for irradiating the fed powdered material with a laser beam while weaving the lase r beam, and depositing a cladding layer, obtained by melting and solidifying at least the pow dered material, on the base metal. The step for depositing the cladding layer is performed such that 20≤A≤35, 2.2≤B≤2.9, and 5 mass%≤R2≤15 mass% are satisfied, where A is a laser heat input index, B is a powder feeding rate index, and R2 is the ratio of the second powder contained in the powdered material.

A process for room temperature substrate bonding employs a first substrate substantially transparent to a laser wavelength is selected. A second substrate for mating at an interface with the first substrate is then selected. A transmissivity change at the interface is created and the first and second substrates are mated at the interface. The first substrate is then irradiated with a laser of the transparency wavelength substantially focused at the interface and a localized high temperature at the interface from energy supplied by the laser is created. The first and second substrates immediately adjacent the interface are softened with diffusion across the interface to fuse the substrates.

A process for room temperature substrate bonding employs a first substrate substantially transparent to a laser wavelength is selected. A second substrate for mating at an interface with the first substrate is then selected. A transmissivity change at the interface is created and the first and second substrates are mated at the interface. The first substrate is then irradiated with a laser of the transparency wavelength substantially focused at the interface and a localized high temperature at the interface from energy supplied by the laser is created. The first and second substrates immediately adjacent the interface are softened with diffusion across the interface to fuse the substrates.