A unit (10) for the regulation or control of a fluid pressure, having at least one housing section (13, 14) and a switching film (22) connected to the at least one housing section (13, 14) for switching at pressure differentials relative to an ambient pressure acting on the switching film (22), and for the regulation, release or blocking of a flow of the fluid between an inlet (28) and a discharge (30) for the fluid. The switching film (22) is made out of a polymer material having fluorine and carbon, in particular a thermoplastic having fluorine and carbon. In this arrangement, a hole cross-section (40) of the at least one housing section (13, 14) is closed off by the switching film (22).

A unit (10) for the regulation or control of a fluid pressure, having at least one housing section (13, 14) and a switching film (22) connected to the at least one housing section (13, 14) for switching at pressure differentials relative to an ambient pressure acting on the switching film (22), and for the regulation, release or blocking of a flow of the fluid between an inlet (28) and a discharge (30) for the fluid. The switching film (22) is made out of a polymer material having fluorine and carbon, in particular a thermoplastic having fluorine and carbon. In this arrangement, a hole cross-section (40) of the at least one housing section (13, 14) is closed off by the switching film (22).

A process for the production of three-dimensional structures involves generating stepped structures in the micrometer to millimeter range. A novel possibility for realizing microstructures for micromechanical and high-performance electronic structures allows a substantially free shaping of and high-throughput production of stepped structures is met according to the invention by coating a copper-clad substrate at least once with a first photoresist for generating a defined height of at least one structure step and coating the first photoresist at least once with a second photoresist for generating a defined height of at least one further structure step, wherein the first photoresist and the second photoresist have different photosensitivities and transmission characteristics which generate structure-forming regions at least of the first photoresist and second photoresist by exposing with different wavelengths and radiation doses and after developing. The structure-forming regions at least partially overlap one another and form a stepped three-dimensional structure.

A joint structure includes a first material (1), a second material (2) weldable to the first material, and a third material (3) at least a portion of which being sandwiched between the first material and the second material, having a through opening portion at the sandwiched portion, and including a material that is difficult to be welded to both the first material and the second material, the first material and the second material welded the via through opening portion. At least one of the first material and the second material is provided with a protrusion (14) inserted in the through opening portion. A first gap (4) is provided between an inner peripheral surface of the through opening portion and the protrusion. A second gap (5) is provided between the first material and the second material, the second gap having a size depending on a plate thickness of the first material in a region corresponding to the protrusion. Under a condition in which the second gap has a size of greater than or equal to 0.1 mm but less than or equal to 40% of the plate thickness of the first material in the region, the first material and the second material are welded by emitting a laser beam from a side on which the first material is disposed.

A joint structure includes a first material (1), a second material (2) weldable to the first material, and a third material (3) at least a portion of which being sandwiched between the first material and the second material, having a through opening portion at the sandwiched portion, and including a material that is difficult to be welded to both the first material and the second material, the first material and the second material welded the via through opening portion. At least one of the first material and the second material is provided with a protrusion (14) inserted in the through opening portion. A first gap (4) is provided between an inner peripheral surface of the through opening portion and the protrusion. A second gap (5) is provided between the first material and the second material, the second gap having a size depending on a plate thickness of the first material in a region corresponding to the protrusion. Under a condition in which the second gap has a size of greater than or equal to 0.1 mm but less than or equal to 40% of the plate thickness of the first material in the region, the first material and the second material are welded by emitting a laser beam from a side on which the first material is disposed.

The method of metal-thermoplastic resin direct bonding is characterized by comprising a first step for irradiating a surface of the metal material with a pulse laser under an oxidizing atmosphere to form a surface modification region, a second step for causing the thermoplastic resin material to abut against the surface modification region to form a bonding interface, and a third step for heating up the bonding interface by laser irradiation to achieve bonding, the first step including forming metal oxide particle clusters obtained when metal oxide particles having a particle diameter of 5-500 nm to be continuously bonded at the surface modification region, so that the maximum height (Sz) of a surface of the metal oxide particle clusters is 50 nm-3 μm.

The method of metal-thermoplastic resin direct bonding is characterized by comprising a first step for irradiating a surface of the metal material with a pulse laser under an oxidizing atmosphere to form a surface modification region, a second step for causing the thermoplastic resin material to abut against the surface modification region to form a bonding interface, and a third step for heating up the bonding interface by laser irradiation to achieve bonding, the first step including forming metal oxide particle clusters obtained when metal oxide particles having a particle diameter of 5-500 nm to be continuously bonded at the surface modification region, so that the maximum height (Sz) of a surface of the metal oxide particle clusters is 50 nm-3 μm.

A steel sheet for the manufacture of a press hardened part is provided, having a composition of: 0.15%≤C≤0.22%, 3.5%≤Mn<4.2%, 0.001%≤Si≤1.5%, 0.020%≤Al≤0.9%, 0.001%≤Cr≤1%, 0.001%≤Mo≤0.3%, 0.001%≤Ti≤0.040%, 0.0003%≤B≤0.004%, 0.001%≤Nb≤0.060%, 0.001%≤N≤0.009%, 0.0005%≤S≤0.003%, 0.001%≤P≤0.020%. A microstructure has less than 50% ferrite, 1% to 20% retained austenite, cementite, such that the surface density of cementite particles larger than 60 nm is lower than 10{circumflex over ( )}7/mm.sup.2, and a complement of bainite and/or martensite, the retained austenite having an average Mn content of at least 1.1*Mn %. Press-hardened steel part obtained by hot forming the steel sheet, and manufacturing methods thereof.

Methods for laser bonding optical elements to substrates and optical assemblies are disclosed. According to one embodiment, a method of bonding an optical element to a substrate includes disposing at least one optical element onto a surface of the substrate, electrostatically affixing the at least one optical element to the surface of the substrate, and directing a laser beam into the at least one optical element. The laser beam heats an interface between at least one optical element and the substrate to a temperature that is higher than a lowest temperature of the optical element change temperature and the substrate change temperature, thereby forming a bond between at least one optical element and the substrate at a bond area. The laser beam has a fluence that does not modify the substrate at areas of the substrate that are outside of the at least one optical element.

Methods for laser bonding optical elements to substrates and optical assemblies are disclosed. According to one embodiment, a method of bonding an optical element to a substrate includes disposing at least one optical element onto a surface of the substrate, electrostatically affixing the at least one optical element to the surface of the substrate, and directing a laser beam into the at least one optical element. The laser beam heats an interface between at least one optical element and the substrate to a temperature that is higher than a lowest temperature of the optical element change temperature and the substrate change temperature, thereby forming a bond between at least one optical element and the substrate at a bond area. The laser beam has a fluence that does not modify the substrate at areas of the substrate that are outside of the at least one optical element.