Patent classifications
B23K26/3576
Lathe head for nano/micro machining of materials
Apparatus, methods and systems for nano/micro machining. A lathe head has a microscopic pivot aperture for seating a conical tip. The conical tip is carried on a turnable part at one end thereof and is polished down to a microscopic apex. The microscopic pivot aperture is dimensioned for seating the concentric tip in the pivot aperture such that an apex of the conical tip protrudes through and beyond the aperture to a position in close proximity with the aperture. A driver system can comprise a rotator for axially rotating the turnable part, including the conical tip seated in the pivot aperture, and a forward pressure applicator for concurrently applying forward pressure to the conical tip in the direction of the pivot aperture. A light/particle beam system can be utilized to machine the rotating conical tip and the rotating turnable part, including the tip, can be easily removed after machining.
EDGE POLISHING A GLASS SUBSTRATE AFTER CUTTING
A method includes projecting energy onto an annular edge of a glass substrate. The annular edge includes a first roughness. The first roughness is reduced to a second roughness with the energy. The energy reduces the first roughness without changing a roundness of the annular edge of the glass substrate.
LASER BEAM CUTTING/SHAPING A GLASS SUBSTRATE
An apparatus includes a beam splitter and a plurality of mirrors. The beam splitter is positioned to receive a laser beam from a source and split the received laser beam to a first plurality of split laser beams and a second plurality of split laser beams. The plurality of mirrors is configured to direct the first plurality of split laser beams and further configured to direct the second plurality of split laser beams. The first plurality of split laser beams is directed by the plurality of mirrors is configured to cut a glass substrate. The second plurality of split laser beams is directed by the plurality of mirrors is configured to shape the glass substrate.
SHAPING A GLASS SUBSTRATE AFTER CUTTING
A method includes projecting a first energy beam onto an annular edge of a glass substrate. A first portion of the annular edge of the glass substrate is removed with the first energy beam. Removing the first portion increases the roundness of the annular edge of the glass substrate. A second energy beam is projected onto the annular edge of the glass substrate. A second portion of the annular edge of the glass substrate is removed with the second energy beam. Removing the second portion increases the roundness of the annular edge of the glass substrate.
FINISHING A 3D PRINTED OBJECT
According to an example, in a method, a radiation source that is to output radiation at a preset energy level onto a surface of a three-dimensional (3D) printed object may be activated. In addition, the radiation source may be deactivated after a predefined period of time sufficient to cause an outer portion of about a predetermined thickness of the surface of the 3D printed object to begin to melt to finish the surface of the 3D printed object.
LASER INDUCED FRICTION SURFACE ON FIREARM
A firearm having a laser induced friction surface.
ELECTROSURGICAL FORCEPS FOR GRASPING, TREATING, AND/OR DIVIDING TISSUE
A knife configured for use with an electrosurgical forceps having curved jaw members and a method of manufacturing the same. The knife includes a distal body having an inner side and an outer side, a first etching on the outer side of the distal body defining a distal cutting edge and a second etching on the outer side of the distal body extending along a portion of a length of the distal body to define relatively protruded and relatively recessed surfaces extending along a portion of the length of the distal body on the outer side thereof.
SiC WAFER PRODUCING METHOD
A SiC wafer is produced from a single crystal SiC ingot. A focal point of a pulsed laser beam having a transmission wavelength to the ingot is set inside the ingot at a predetermined depth from a flat surface of the ingot, the predetermined depth corresponding to the thickness of the wafer to be produced. The pulsed laser beam is applied to the ingot to thereby form a separation layer for separating the wafer from the ingot. The wafer is separated from the ingot along the separation layer, and a flat surface is formed by grinding an upper surface of the ingot as a rough separation surface left after separating the wafer, thereby removing the roughness of the upper surface of the ingot to flatten the upper surface of the ingot.
ELECTROSURGICAL FORCEPS FOR GRASPING, TREATING, AND/OR DIVIDING TISSUE
A knife configured for use with an electrosurgical forceps having curved jaw members and a method of manufacturing the same. The knife includes a distal body having an inner side and an outer side, a first etching on the outer side of the distal body defining a distal cutting edge and a second etching on the outer side of the distal body extending along a portion of a length of the distal body to define relatively protruded and relatively recessed surfaces extending along a portion of the length of the distal body on the outer side thereof.
LASER INDUCED FRICTION SURFACE ON FIREARM
A firearm having a laser induced friction surface. A method for forming the laser induced friction surface on the firearm may includes the steps of disposing the laser machine adjacent to a component of the firearm, adjusting the laser machine, then applying the laser beam of the laser machine onto a component surface.