A laser diode driving power source of a laser machining device that radiates laser light emitted from an LD to a workpiece to machine the workpiece includes a power converter including a switching device, to supply a current to the LD, and a control unit to control a switching operation of the switching device. A value smaller than a value that is n times a time constant for laser machining is set as a switching period of the switching device in the control unit, the n is larger than 1, and the time constant for laser machining is a value obtained by dividing a surface roughness required for machining of the workpiece by a moving velocity of the workpiece.

A method includes projecting energy onto an annular edge of a glass substrate. The annular edge includes a first roughness. The first roughness is reduced to a second roughness with the energy. The energy reduces the first roughness without changing a roundness of the annular edge of the glass substrate.

A method for laser-marking an iron-based sintered body includes a first step of forming with a first laser beam a plurality of dotted recesses with a predetermined depth in an identification mark area of a surface of an iron-based sintered body, and a second step of flattening with a second laser beam the surface within the identification mark area other than the dotted recesses. The first laser beam has an irradiation energy per unit area greater than an irradiation energy per unit area of the second laser beam.

An apparatus and a method for forming a leveled surface of at least one pasty mass in a mold are described. Thereby, the mold is particularly adapted to mold lipstick mines, wherein the mold was filled with the pasty mass and the pasty mass was at least partially cooled in the mold. The apparatus comprises a means for at least partially melting the surface of the at least one cooled pasty mass in the mold to level the surface by heat introduction, wherein the heat introduction takes place via focused optical photo emission.

A method for producing a device support base in an embodiment according to the present disclosure includes step A of providing a support base having a first surface and a second surface parallel to the first surface; step B of forming a laser beam in a first direction parallel to the first surface of the support base; and step C of translating or rotating the laser beam in a second direction parallel to the first surface of the support base and crossing the first direction to remove at least a part of protruding portions or contamination elements on the first surface of the support base.

A system uses a femtosecond laser beam to polish a surface of an optical element to optical smoothness. The system includes a fixture, a laser system, and a controller. The fixture holds the optical element. The laser system generates the femtosecond laser beam. The femtosecond laser beam includes converging laser pulses with a pulse duration less than 900 femtoseconds. The controller controls relative positioning of the surface of the optical element and the femtosecond laser beam so that a waist of the femtosecond laser beam is outside the optical element and 0.5-2.0 Rayleigh ranges away from the surface of the optical element. Also, an intensity of the femtosecond laser beam at the surface of the optical element is sufficient to ablate the surface.

A plastic component is provided that leads to an initial friction reduction with a friction partner. At least part of the surface of the plastic component, which interacts with a surface of a friction partner, is provided with a plurality of structures. The structures are composed of at least one structure type. Between two adjacent structure types, a distance is formed in the range of 10 microns to 1 mm. A width of the structure types is in the range of 10 microns to 100 microns. A height or depth of the structure types is in the range from 1 micron to 100 microns.

A method according to one aspect of the present disclosure is a laser marking method for a powder compact containing metal powder, which includes: a first step of scanning with laser light of first power which is weaker over a predetermined area in a surface of the powder compact, to melt and smooth inside of the predetermined area; and a second step of scanning with laser light of second power which is greater, to form a dot formed of a recess of a predetermined depth at a predetermined location in the predetermined area.

Substrates having laser textured surfaces and methods for forming the same are described. The methods involve using a laser to form three-dimensional features on a surface of the substrate. The laser three-dimensional features can be designed to interact with incident light to create unique visual effects. In some embodiments, the substrate is further treated with a pre-anodizing process and an anodizing process to form a protective metal oxide coating. In some cases, the type of pre-anodizing and anodizing process are chosen based on the geometry of the three-dimensional features and to enhance the visual effects.

A system and method of planarizing a layer are disclosed. Topography of the layer is measured to produce a topographic map, which is then digitized into blocks of that indicate different thickness variation. Laser conditions are assigned for each block, a laser steered to planarization blocks where material is to be removed, and the material ablated at each planarization block. In-situ monitoring of the surface profile provides feedback to adjust the laser conditions during planarization. When depth control is used, the laser is focused at a focal plane and has a focal depth beyond which no material is ablated and the laser is steered across the entire layer. A thin metal layer of higher ablation threshold than the dielectric layer formed over the layer provides added selectivity, with the laser conditions changed after ablation of the metal layer. Otherwise, planarization is limited to the planarization blocks.