Provided are a dental implant with a nano bacteriostatic structure ring at a transgingival part and a machining method thereof. The transgingival part of the dental implant has a three-level micro-nano composite structure, and the three-level micro-nano composite structure endows a surface of the transgingival part of the implant with functions of promoting adhesion and proliferation of a gingival fibroblast and a gingival mesenchymal stem cell and inhibiting adhesion and growth of various oral bacteria. A preparation method thereof comprises: firstly, injecting bioactive, wear-resistant or corrosion-resistant C, N, Ca and P elements into the transgingival part of the dental implant by a plasma injection method; and then, preparing the three-level micro-nano composite structure at a part in which the elements are injected.

The present application provides a double-beam laser polishing device and a double-beam laser polishing method for an aluminum alloy, which includes a frame; a rotary workbench and an optical path system, which are arranged on the frame. The optical path system includes: a first fiber laser, a second fiber laser, a first three-dimensional galvanometer, and a second three-dimensional galvanometer. The first three-dimensional galvanometer is connected with the first fiber laser through an optical fiber, and the second three-dimensional galvanometer is connected with the second fiber laser through an optical fiber. The first three-dimensional galvanometer and the second three-dimensional galvanometer are arranged side by side above the rotary workbench in a horizontal direction.

A method for producing a device support base in an embodiment according to the present disclosure includes step A of providing a support base having a first surface and a second surface parallel to the first surface; step B of forming a laser beam in a first direction parallel to the first surface of the support base; and step C of translating or rotating the laser beam in a second direction parallel to the first surface of the support base and crossing the first direction to remove at least a part of protruding portions or contamination elements on the first surface of the support base.

An engraved code includes a plurality of dot dented portions defined on an article. The engraved code includes an opening peripheral edge portion of each of the dot dented portions which has a polygonal or quadrilateral shape. This configuration leads to detection of each dot dented portion as a polygonal or quadrilateral dot.

An article allows an engraved code to be detected. The engraved code includes a plurality of dot dented portions defined on the article. Each of the dot dented portions has a quadrilateral pyramid shape with a coating layer on a prior stage dented portion having a quadrilateral pyramid shape. Corner dented portions dented at acute angles outward along a diagonal direction are defined at four corner positions of an opening peripheral edge portion of the prior stage dented portion.

An annular glass plate has an outer circumferential edge surface, an inner circumferential edge surface, and a thickness not larger than 0.6 mm. The outer circumferential edge surface and the inner circumferential edge surface are constituted by molten surfaces. The molten surfaces in the outer circumferential edge surface and the inner circumferential edge surface each have an arithmetic average surface roughness Ra not larger than 0.1 ?m and the surface roughness of the molten surface in the inner circumferential edge surface is larger than the surface roughness of the molten surface in the outer circumferential edge surface. The molten surfaces in the inner circumferential edge surface and the outer circumferential edge surface do not bulge relative to both main surfaces of the annular glass plate.

In one or more embodiments, a method includes selecting a cemented carbide substrate from a plurality of cemented carbide substrates in a substrate inventory. Each of the plurality of cemented carbide substrates have a substantially planar top surface. The method also includes emitting a plurality of laser pulses from a laser towards at least the substantially planar top surface of the cemented carbide substrate to ablate selected regions of the cemented carbide substrate thereby forming the cemented carbide substrate into a selected shape.

A method for applying a measurement scale to a guide rail surface of a linear profile rail guide, the guide rail having a first side surface and the measurement scale including at least one track extending linearly and longitudinally toward the guide rail, including several mirror regions arranged alternately one behind the other, and marking regions, uses a pulsed laser to generate a laser beam and introduces a microstructure in a first region corresponding to the at least one marking region of the first side surface. The laser generates the laser beam with a sequence of several light pulses that is directed at the first region so that the laser beam is moved two-dimensionally relative to the first region to irradiate different subregions of the first region one after the other by the light pulses. Each different irradiated subregion has an overlap with at least one other irradiated subregion.

The present invention relates to a device as well as a method for the additive manufacture of components by deposition of material layers by layer-by-layer joining of powder particles to one another and/or to an already produced pre-product or substrate, via selective interaction of the powder particles with a high-energy beam, wherein, for smoothing a surface of the component being produced running crosswise to the deposited material layers in between the deposition of two layers of the component, the complete edge region of the last layer that is applied and that runs along a surface of the component being produced is compacted in a direction of action that has a directional component parallel to the build-up direction of the layers, and/or at least one edge region of a surface of the component is also compacted.

Laser processing of hard dielectric materials may include cutting a part from a hard dielectric material using a continuous wave laser operating in a quasi-continuous wave (QCW) mode to emit consecutive laser light pulses in a wavelength range of about 1060 nm to 1070 nm. Cutting using a QCW laser may be performed with a lower duty cycle (e.g., between about 1% and 15%) and in an inert gas atmosphere such as nitrogen, argon or helium. Laser processing of hard dielectric materials may further include post-cut processing the cut edges of the part cut from the dielectric material, for example, by beveling and/or polishing the edges to reduce edge defects. The post-cut processing may be performed using a laser beam with different laser parameters than the beam used for cutting, for example, by using a shorter wavelength (e.g., 193 nm excimer laser) and/or a shorter pulse width (e.g., picosecond laser).