A glass processing method according to a viewpoint of the present disclosure includes generating a pulse laser beam by using a laser oscillator, and irradiating alkali-free glass to be processed with the pulse laser beam. The wavelength of the pulse laser beam ranges from 248 nm to 266 nm, and the pulse laser beam has an energy ratio greater than or equal to 91% but smaller than or equal to 99% in the region from 5 ns after a pulse rises to 400 ns.

A glass processing method according to a viewpoint of the present disclosure includes generating a pulse laser beam by using a laser oscillator, and irradiating alkali-free glass to be processed with the pulse laser beam. The wavelength of the pulse laser beam ranges from 248 nm to 266 nm, and the pulse laser beam has an energy ratio greater than or equal to 91% but smaller than or equal to 99% in the region from 5 ns after a pulse rises to 400 ns.

A waterjet-guided laser machine includes a laser source, an LED, a waterjet head, and a light sensor. The waterjet head includes a water inlet and a nozzle having an outlet for a discharging a waterjet. There is a laser optical path along which a pulsed laser beam travels to the nozzle outlet. There is also a light beam optical delivery path along which the light beam travels from the LED to the nozzle outlet. The light beam optical delivery path is coincident with the laser optical path in the nozzle. There is a light beam optical return path along which the light beam that is reflected off of a workpiece travels to the light sensor. The light beam optical return path is coincident with the laser optical path inside the nozzle and coincident with the light beam optical delivery path inside the nozzle.

A laser processing method for laser processing of a workpiece made of a base material and a fiber reinforced composite material containing fibers having a thermal conductivity and a processing threshold higher than physical properties of glass fibers. The laser processing method includes a step of processing the workpiece by forming a plurality of through-holes extending through the workpiece by irradiating the workpiece with pulsed laser light from a processing head while relatively moving the workpiece and the processing head in a predetermined cutting direction. The pulsed laser light has a pulse width smaller than 1 ms and an energy density capable of forming each of the through-holes by a single pulse.

A laser processing method for laser processing of a workpiece made of a base material and a fiber reinforced composite material containing fibers having a thermal conductivity and a processing threshold higher than physical properties of glass fibers. The laser processing method includes a step of processing the workpiece by forming a plurality of through-holes extending through the workpiece by irradiating the workpiece with pulsed laser light from a processing head while relatively moving the workpiece and the processing head in a predetermined cutting direction. The pulsed laser light has a pulse width smaller than 1 ms and an energy density capable of forming each of the through-holes by a single pulse.

The problem to be solved by the present invention is to provide a novel technique that can remove a strained layer introduced into an aluminum nitride substrate. In order to solve this problem, the present aluminum nitride substrate manufacturing method involves a strained layer removal step for removing a strained layer in an aluminum nitride substrate by heat treatment of the aluminum nitride substrate in a nitrogen atmosphere. In this way, the present invention can remove a strained layer that has been introduced into an aluminum nitride substrate.

The problem to be solved by the present invention is to provide a novel technique that can remove a strained layer introduced into an aluminum nitride substrate. In order to solve this problem, the present aluminum nitride substrate manufacturing method involves a strained layer removal step for removing a strained layer in an aluminum nitride substrate by heat treatment of the aluminum nitride substrate in a nitrogen atmosphere. In this way, the present invention can remove a strained layer that has been introduced into an aluminum nitride substrate.

A method for processing a plastic workpiece having a first side and a second side opposite the first side using laser ablation and a nozzle body produced according to the method. The method includes advancing a laser beam into the plastic workpiece from outside of the plastic workpiece and through the first side to at least partially penetrate the plastic workpiece, and evaporating at least a portion of the plastic workpiece with the laser beam starting from the second side.

A method of producing a glass substrate having a hole is provided. The method includes preparing the glass substrate having a first surface and a second surface facing each other; forming a hole in the glass substrate with a laser; and annealing the glass substrate placed on a first support substrate having a thermal expansion coefficient whose difference from a thermal expansion coefficient of the glass substrate is less than or equal to 1 ppm/K, where the first support substrate is placed on a second support substrate having a thermal expansion coefficient of less than or equal to 10 ppm/K.

A method of producing a glass substrate having a hole is provided. The method includes preparing the glass substrate having a first surface and a second surface facing each other; forming a hole in the glass substrate with a laser; and annealing the glass substrate placed on a first support substrate having a thermal expansion coefficient whose difference from a thermal expansion coefficient of the glass substrate is less than or equal to 1 ppm/K, where the first support substrate is placed on a second support substrate having a thermal expansion coefficient of less than or equal to 10 ppm/K.