The systems and methods disclosed herein utilize a beam-forming system configured to convert a Gaussian laser beam into an annular vortex laser beam having a relatively large depth of focus, which enables the processing of thick or stacked glass-based objects annular laser beam is defined in part by a topological charge m that defines an amount of rotation of the annular vortex beam around its central axis as it propagates annular vortex beam is used to form micro-holes in a glass-based object using either a one-step or a two-step method micro-holes formed by either process can be in the form of recesses or through-holes, depending on the application size of the micro-holes can be controlled by controlling the size of the annular vortex beam over the depth of focus range.

A method of producing a glass substrate having a hole is provided. The method includes preparing the glass substrate having a first surface and a second surface facing each other; forming a hole in the glass substrate with a laser; and annealing the glass substrate placed on a first support substrate having a thermal expansion coefficient whose difference from a thermal expansion coefficient of the glass substrate is less than or equal to 1 ppm/K, where the first support substrate is placed on a second support substrate having a thermal expansion coefficient of less than or equal to 10 ppm/K.

A method of producing a glass substrate having a hole is provided. The method includes preparing the glass substrate having a first surface and a second surface facing each other; forming a hole in the glass substrate with a laser; and annealing the glass substrate placed on a first support substrate having a thermal expansion coefficient whose difference from a thermal expansion coefficient of the glass substrate is less than or equal to 1 ppm/K, where the first support substrate is placed on a second support substrate having a thermal expansion coefficient of less than or equal to 10 ppm/K.

A method for manufacturing a one-piece woven (OPW) air bag includes providing yarns and warping the yarns on at least one beam of a loom. Yarns are simultaneously woven into a fabric air bag structure having two layer portions defining both an inflatable volume and non-inflatable portions and single layer portions forming seams delimiting the inflatable volume. The air bag structure is cut to define the OPW air bag and at least one opening extending through only one layer of the two layer portions.

A pane-shaped glass element having two opposing side surfaces which are edge-wise interconnected by a number of edge surfaces, wherein in the or each edge surface there are provided filamentary damages forming side-by-side elongate depressions, and wherein the or each edge surface lies obliquely to the side surfaces, is to be further formed for particularly good usability in a plurality of possible applications. For this purpose, according to the invention, the respective edge surface has a surface roughness with a mean roughness value of at least 0.3 μm, and preferably of at most 2 μm, in a particularly advantageous embodiment of about 1 μm, in its region provided with the filamentary damages.

A method for introducing at least one cutout, in particular in the form of an aperture, into a sheetlike workpiece having a thickness of less than 3 mm, involving detecting a laser beam onto the surface of the workpiece, selecting the exposure time of the laser beam to be extremely short so that only a modification of the workpiece concentrically around a beam axis of the laser beam occurs, such a modified region having defects resulting in a chain of blisters, and, as a result of the action of a corrosive medium, anisotropically removing material by successive etching in those regions of the workpiece that are formed by the defects and have previously been modified by the laser beam, resulting, along the cylindrical zone of action, in producing a cutout as an aperture in the workpiece.

A method for introducing at least one cutout, in particular in the form of an aperture, into a sheetlike workpiece having a thickness of less than 3 mm, involving detecting a laser beam onto the surface of the workpiece, selecting the exposure time of the laser beam to be extremely short so that only a modification of the workpiece concentrically around a beam axis of the laser beam occurs, such a modified region having defects resulting in a chain of blisters, and, as a result of the action of a corrosive medium, anisotropically removing material by successive etching in those regions of the workpiece that are formed by the defects and have previously been modified by the laser beam, resulting, along the cylindrical zone of action, in producing a cutout as an aperture in the workpiece.

A laser cutting system for cutting articles, such as tubes, and method of using the same. The laser cutting system can cut slots, holes, and/or pores into each article or tube to form filtration tubes, for example. The system includes a delivery system for delivering a laser beam from a laser source, at least one mirror, a focusing objective lens, a gas source, and a delivery nozzle. A first stage holds each article in a longitudinal direction, and may rotate the article axially during delivery of the gas and laser beam towards the article and move the article longitudinally relative to the delivery nozzle. A second stage is provided in the system for moving the delivery nozzle relative to the article being held by the first stage. A controller controls actuation of the laser beam and the gas source, and movement of the first stage and the second stage.

In a method of processing a substrate, in a second step, only some of a plurality of altered portions are exposed from an opening portion of a mask, and the remaining portions are not exposed. In this case, at the time of etching in a third step, an etching rate may be made different between the altered portions exposed from the opening portion of the mask and the altered portions which are not exposed. Accordingly, it becomes easier to obtain a desired processed shape by adjusting the altered portions exposed from the opening portion of the mask and the altered portions which are not exposed.

In a method of processing a substrate, in a second step, only some of a plurality of altered portions are exposed from an opening portion of a mask, and the remaining portions are not exposed. In this case, at the time of etching in a third step, an etching rate may be made different between the altered portions exposed from the opening portion of the mask and the altered portions which are not exposed. Accordingly, it becomes easier to obtain a desired processed shape by adjusting the altered portions exposed from the opening portion of the mask and the altered portions which are not exposed.