A method of separating a wafer into at least two thinner wafers includes a pressing member placing step of placing a pressing member that is transmissive of a wavelength of a laser beam on a first surface of the wafer such that the pressing member is pressed against the first surface of the wafer, a separation initiating point forming step of forming a separation initiating point in the wafer by applying the laser beam whose wavelength is transmittable through the wafer to the wafer while positioning a focused spot of the laser beam within the wafer and moving the focused spot and the wafer relatively to each other along a first direction, and an indexing feed step of moving the focused spot and the wafer relatively to each other along a second direction perpendicular to the first direction.

A method of separating a wafer into at least two thinner wafers includes a pressing member placing step of placing a pressing member that is transmissive of a wavelength of a laser beam on a first surface of the wafer such that the pressing member is pressed against the first surface of the wafer, a separation initiating point forming step of forming a separation initiating point in the wafer by applying the laser beam whose wavelength is transmittable through the wafer to the wafer while positioning a focused spot of the laser beam within the wafer and moving the focused spot and the wafer relatively to each other along a first direction, and an indexing feed step of moving the focused spot and the wafer relatively to each other along a second direction perpendicular to the first direction.

A process for manufacturing a bicycle wheel component, comprising the steps of providing a component having at least one braking area that cooperates with a braking body made by molding of composite material having structural fibers in a polymeric material, and post-molding machining of at least one region of the braking area by removing only polymeric material, without removal of the structural fiber, from the entire region so that the structural fiber outcrops at least in part from the polymeric material, and removing the structural fiber and possibly the polymeric material according to at least one groove within the region. A bicycle wheel component having a braking area of composite material, wherein in a region of the braking area, the structural fiber outcrops at least from the polymeric material, and the region comprises a groove through the structural fiber and possibly the polymeric material of the composite material.

A process for manufacturing a bicycle wheel component, comprising the steps of providing a component having at least one braking area that cooperates with a braking body made by molding of composite material having structural fibers in a polymeric material, and post-molding machining of at least one region of the braking area by removing only polymeric material, without removal of the structural fiber, from the entire region so that the structural fiber outcrops at least in part from the polymeric material, and removing the structural fiber and possibly the polymeric material according to at least one groove within the region. A bicycle wheel component having a braking area of composite material, wherein in a region of the braking area, the structural fiber outcrops at least from the polymeric material, and the region comprises a groove through the structural fiber and possibly the polymeric material of the composite material.

A method for making an infrared light absorber is provided, and the method includes following steps: providing a first carbon nanotube array on a substrate; truncating the carbon nanotube array by irradiating a top surface of the carbon nanotube array by a laser beam in two directions, the top surface being away from the substrate, wherein the two directions being at an angle, the angle is in a range of 30 degrees to 90 degrees.

A method for making an infrared light absorber is provided, and the method includes following steps: providing a first carbon nanotube array on a substrate; truncating the carbon nanotube array by irradiating a top surface of the carbon nanotube array by a laser beam in two directions, the top surface being away from the substrate, wherein the two directions being at an angle, the angle is in a range of 30 degrees to 90 degrees.

A method for microstructuring a plate-shaped glass substrate by laser radiation includes: introducing one-sided recesses into the glass substrate, in which a focus of the laser radiation forms a spatial beam along a beam axis and in which the laser radiation creates modifications in the glass substrate along the beam axis so that an action of an etching medium subsequently creates the recesses in the glass substrate through anisotropic removal of material in a respective region of the modifications. A chemical composition of the glass substrate is partially changed and thus at least one region of changed properties is created before the action of the etching medium.

A method for microstructuring a plate-shaped glass substrate by laser radiation includes: introducing one-sided recesses into the glass substrate, in which a focus of the laser radiation forms a spatial beam along a beam axis and in which the laser radiation creates modifications in the glass substrate along the beam axis so that an action of an etching medium subsequently creates the recesses in the glass substrate through anisotropic removal of material in a respective region of the modifications. A chemical composition of the glass substrate is partially changed and thus at least one region of changed properties is created before the action of the etching medium.

There are provided high power laser and laser mechanical earth removing equipment, and operations using laser cutting tools having stand off distances. These equipment provide high power laser beams, greater than 1 kW to cut and volumetrically remove targeted materials and to remove laser affected material with gravity assistance, mechanical cutters, fluid jets, scrapers and wheels. There is also provided a method of using this equipment in mining, road resurfacing and other earth removing or working activities.

There are provided high power laser and laser mechanical earth removing equipment, and operations using laser cutting tools having stand off distances. These equipment provide high power laser beams, greater than 1 kW to cut and volumetrically remove targeted materials and to remove laser affected material with gravity assistance, mechanical cutters, fluid jets, scrapers and wheels. There is also provided a method of using this equipment in mining, road resurfacing and other earth removing or working activities.