Patent classifications
B23K26/703
Machining module for a device for an additive manufacturing process
The invention relates to a machining module for a device for producing a molded metal body (1) by means of an additively generative manufacturing process. A sheet, wire, or pulverulent metal-containing starting material (2) is melted and applied in layers, thereby forming the molded body (1). According to the invention, in addition to a material supply device (9), the machining module comprises a protective gas supply device (11), which has an outlet opening arranged annularly about the material supply device (9), and a fluid supply device (3) for supplying coolant (4), having one or more nozzles (10) which are arranged spatially adjacent to the material supply device (9) such that the surface of the molded body (1) can be supplied with the coolant (4) in points or in a partial manner directly adjacent to the melt bath at one position or along a curve, each of which can be specified in a variable manner.
Additive manufacturing system and method
An additive manufacturing system including a two-dimensional energy patterning system for imaging a powder bed is disclosed. Improved chamber designs, multiple chambers, powder handling and re-use systems, and powder characterization methods are disclosed.
Glass separating and cutting system for electronic mobile device repair
A system for separating the front and back outer glass layer from the casing/body of electronic mobile devices and for cutting mobile device screen protector sheets by way of laser burning and cutting comprises a housing, such housing containing a laser; a mirror galvanometer; a safety chamber enclosure; a metal plate with internal glass sheet; a chamber with opening and closing lid, lid button and lid sensor; a control printed circuit board with processor; a power inlet; a power supply; and an on/off switch.
WELDING-TYPE POWER SUPPLIES WITH EXPANDABLE THERMAL INTERFACES
Systems and methods are disclosed relating to welding-type power supplies. In some examples, the power supplies may have no vents, which may help prevent environmental contaminants from entering the power supplies. Instead, the power supplies include one or more thermal interfaces configured to conduct heat generated by internal circuitry of the power supply from the interior of the power supply to an exterior of the power supply. Additionally, the thermal interface(s) may be configured for attachment to one or more exterior heat dissipating devices.
SAFETY AND RELIABILITY GUARANTEES FOR LASER FABRICATION
Sensor data generated by a sensor of a computer numerically controlled machine can be compared with a forecast. The forecast can include expected sensor data for the sensor, over a course of an execution plan for making a cut with a movable laser cutting head. The sensor data can be generated during execution of the execution plan. During execution of the execution plan, the sensor data can be monitored and a deviation of from the forecast can be detected. It can be determined, based on the detecting, that an anomalous condition of the computer numerically controlled machine has occurred. Based on the determining, an action can be performed.
THREE-DIMENSIONAL DEPOSITION DEVICE AND THREE-DIMENSIONAL DEPOSITION METHOD
A three-dimensional deposition device includes a deposition head provided with a powder jetting port and a light beam irradiation port to form a deposited body by the powder being melted and solidified; a shape measurement unit that measures a shape of the deposited body; a deposited body cooling unit that jets cooling gas to the deposited body to cool the deposited body; and a control unit. The control unit causes the shape measurement unit to measure the shape of the deposited body, determines whether to cool the deposited body based on a result of measuring the shape of the deposited body, and causes the deposited body cooling unit to jet the cooling gas to the deposited body to cool the deposited body in a case in which the cooling determination unit determines to cool the deposited body.
WELDING-TYPE POWER SUPPLIES WITH EXPANDABLE THERMAL INTERFACES
Systems and methods are disclosed relating to welding-type power supplies. In some examples, the power supplies may have no vents, which may help prevent environmental contaminants from entering the power supplies. Instead, the power supplies include one or more thermal interfaces configured to conduct heat generated by internal circuitry of the power supply from the interior of the power supply to an exterior of the power supply. Additionally, the thermal interface(s) may be configured for attachment to one or more exterior heat dissipating devices.
Pre-treatment, method for additive production of a component, and device
A method for additive production and a correspondingly produced component made of a powdery base material, includes the thermal pre-treatment of the base material at a first temperature of at least 800° C. under an inert gas atmosphere, wherein the first temperature and a duration of the pre-treatment are further selected such that no sintering process of the base material occurs, subsequent cooling of the base material, and additive construction of the component from the thermally pre-treated base material. A corresponding device is for the additive production.
Variable Print Chamber Walls For Powder Bed Fusion Additive Manufacturing
Additive manufacturing can involve dispensing a powdered material to form a layer of a powder bed on a support surface of a build platform. A portion of the layer of the powder bed may be selectively melted or fused to form one or more temporary walls out of the fused portion of the layer of the powder bed to contain another portion of the layer of the powder bed on the build platform
LASER PROCESSING APPARATUS, METHODS OF LASER-PROCESSING WORKPIECES AND RELATED ARRANGEMENTS
Apparatus and techniques for laser-processing workpieces can be improved, and new functionalities can be provided. Some embodiments discussed relate to processing of workpieces in a manner resulting in enhanced accuracy, throughput, etc. Other embodiments relate to realtime Z-height measurement and, when suitable, compensation for certain Z-height deviations. Still other embodiments relate to modulation of scan patterns, beam characteristics, etc., to facilitate feature formation, avoid undesirable heat accumulation, or otherwise enhance processing throughput. A great number of other embodiments and arrangements are also detailed.