A laser light profile measuring device of the present disclosure includes a reflection attenuation part reflecting and attenuating at least part of laser light incident from a first direction in a direction different from the first direction to generate measurement target laser light traveling in the first direction, a capture unit placed on one side of the reflection attenuation part in the first direction and which captures the measurement target laser light, a cooling body covering at least part of the reflection attenuation part and the capture unit in a circumferential direction with respect to the first direction, a refrigerant supply unit forcibly feeding a refrigerant toward the cooling body, and a rotation support part supporting the reflection attenuation part, the cooling body, and the refrigerant supply unit to be rotatable around a rotation axis extending in a horizontal direction.

A calibration apparatus for a processing system with a plurality of optical tools is provided. The calibration apparatus includes a housing with a stop aperture, a sensor arrangement for capturing light that is incident through the stop aperture, and a light source arrangement for emitting light through the stop aperture.

A method for adjusting a laser beam includes, following passage of the laser beam through a beam-shaping device, measuring, via a detector of a detector device, a beam profile of the laser beam. The method further includes determining a beam quality property of the laser beam based on the measured beam profile and altering an adjustable optical unit for modifying at least one property of the laser beam prior to the entry into the beam-shaping device. For adjusting the laser beam, the adjustable optical unit is altered based on the determined beam quality property.

Apparatus and techniques for laser-processing workpieces can be improved, and new functionalities can be provided. Some embodiments discussed relate to use of beam characterization tools to facilitate adaptive processing, process control and other desirable features. Other embodiments relate to laser power sensors incorporating integrating spheres. Still other embodiments relate to workpiece handling systems capable of simultaneously providing different workpieces to a common laser-processing apparatus. A great number of other embodiments and arrangements are also detailed.

A laser processing apparatus includes a light source, a laser head configured to emit a laser beam, a robot configured to move the laser head, and a control apparatus configured to control start and stop of generation of the laser beam and control operation of the robot. The control apparatus controls the light source to generate the laser beam when a first time has elapsed after causing the robot to start an operation of accelerating the laser head such that a movement speed of the laser head with respect to a processing target object reaches a constant target speed.

A wafer processing apparatus includes: a laser apparatus configured to generate a laser beam; a focusing lens optical system configured to focus the laser beam on an inside of a wafer; an arbitrary wave generator configured to supply driving power to the laser apparatus; and a controller configured to control the arbitrary wave generator, wherein the laser beam includes a plurality of pulses sequentially emitted from the laser apparatus, and wherein each of the plurality of pulses is a non-Gaussian pulse, and a full width at half maximum (FWHM) of each of the plurality of pulses ranges from 1 ps to 500 ns.

Provided is a laser annealing apparatus causing laser light to be radiated to processing receiving areas arranged, out of a first direction and a second direction perpendicular to the first direction, along at least the second direction and move a batch radiation area and a workpiece in the first direction, and the laser annealing apparatus includes an energy density measuring apparatus measuring the energy density at, out of first and second ends of the batch radiation area in the second direction, at least the second end, an energy density adjusting apparatus adjusting the energy density at the first end, and a controller controlling the energy density adjusting apparatus. The energy density at the first end when (N+1)-th scanning is performed is so adjusted that the energy density at the first end in an (N+1)-th scan area approaches the energy density at the second end in the N-th scan area.

This shaping apparatus is equipped with: a movement system which moves a target surface; a measurement system for acquiring position information of the target surface in a state movable by the movement system, a beam shaping system that has a beam irradiation section and a material processing section which supplies a shaping material irradiated by a beam from beam irradiation section; and a controller. On the basis of 3D data of a three-dimensional shaped object to be formed on a target surface and position information of the target surface acquired using the measurement system, the controller controls the movement system and the beam shaping system such that a target portion on the target surface is shaped by supplying the shaping material while moving the target surface and the beam from beam irradiation section relative to each other.

Disclosed is a multi-mode laser device for metal manufacturing applications including additive manufacturing (AM), laser cladding, laser welding, laser cutting, laser texturing and laser polishing. The multi-mode laser device configures off-axis, solid-state diode or diode-pumped lasers into an array to perform precision controlled, direct metal deposition printing, cladding, laser welding, laser cutting, laser texturing and laser polishing through a single device. Dual-mode printing, cladding and welding capability using metal wire and powder feedstock sources in the same device is provided with in-line control, precision wire feed driver/controller, adjustable shield gas diffuser, and nozzles tailored to wire feedstock diameter.

A method for adjusting a laser beam includes, following passage of the laser beam through a beam-shaping device, measuring, via a detector of a detector device, a beam profile of the laser beam. The method further includes determining a beam quality property of the laser beam based on the measured beam profile and altering an adjustable optical unit for modifying at least one property of the laser beam prior to the entry into the beam-shaping device. For adjusting the laser beam, the adjustable optical unit is altered based on the determined beam quality property.