Patent classifications
B23K26/705
SCALABLE MANUFACTURING WITH LASER INDUCED REFRACTIVE INDEX CHANGE
Methods of designing a laser writing system for modifying a plurality of ophthalmic devices, and systems designed in accordance with those methods. One example of such a method includes: (a) determining at least one material characteristic of the ophthalmic devices, determined over a range of laser writing system parameters; (b) determining at least one design characteristic of the ophthalmic device; and (c) using at least the determined material and design characteristics, configuring at least one system parameter of the laser writing system to optimize throughput of the laser writing system, the laser writing system including: (i) a laser configured to generate a laser beam, (ii) a splitter configured to split the laser beam into a plurality of outputs, and (iii) a plurality of writing heads, each writing head configured to direct at least one of the outputs to an ophthalmic device to write one or more localized refractive index modifications into the ophthalmic device.
Axis calibration of beam processing machines
In a method for determining a deviation of a spatial orientation of a beam axis (S) of a beam processing machine from a spatial nominal orientation (S0) of the beam axis (S), contour sections (KA1, KB2) are cut with a processing beam into a test workpiece from two sides of the workpiece. The contour sections (KA1, KB2) extend parallel to a nominal orientation of a rotation axis (B, C), where the rotation axis is to be calibrated. The contour sections (KA1, KA2) are probed from one side of the test workpiece by a measuring device for determining the spatial position of the contour sections (KA1, KB1). Deviation of the spatial orientation of the beam axis (S) of the beam processing machine from the spatial nominal orientation (S0) is determined based on the spatial positions of the contour sections (KA1, KB1).
Machining condition setting device and 3D laser machining system
A 3D laser machining system comprises: a move state simulation unit that simulates a move state of a machining head using 3D CAD data about a workpiece containing material information defining thermophysical properties and 3D CAD data about a machining head under a condition of moving the machining head relative to the workpiece while the machining head is maintained at a predetermined angle a predetermined distance along a machining line in virtual space; a thermal fluid simulation unit that conducts non-stationary thermal fluid simulation for obtaining a temperature distribution in a region covering the workpiece to be changed by the move of the machining head outputting a laser beam; and a machining condition setting unit that sets a laser machining condition containing a relative move condition for the machining head and a laser beam output condition before laser machining on the basis of results of the simulations.
LASER ANNEALING APPARATUS, INSPECTION METHOD OF SUBSTRATE WITH CRYSTALLIZED FILM, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
A laser annealing apparatus (1) according to the embodiment includes: a laser beam source (11) configured to emit a laser beam (L1) to crystallize an amorphous silicon film (101a) on a substrate (100) and to form a poly-silicon film (101b); a projection lens (13) configured to condense the laser beam to irradiate a silicon film (101); a probe beam source configured to emit a probe beam (L2); a photodetector (25) configured to detect the probe beam (L3) transmitted through the silicon film (101), a processing apparatus (26) configured to calculate a standard deviation of detection values of a detection signal output from the photodetector, and to determine a crystalline state of the crystallized film based on the standard deviation.
LASER MACHINING APPARATUS
A laser machining apparatus includes an actuator that changes relative positions of a machining head and a workpiece; a control unit that controls in machining execution the laser oscillator, the machining head, and the actuator based on a machining parameter; a machining state observation unit that detects, from process light that is light generated from the workpiece by laser beam irradiation, light intensities in a plurality of predetermined wavelength bands as a plurality of optical sensor signals; a feature extraction unit that extracts at least one of features, the features being obtainable from an index of correlation between the plurality of optical sensor signals and from one of the optical sensor signals; and a correction quantity calculation unit that determines the machining parameter to be corrected as a correction parameter and a correction quantity for the correction parameter based on the at least one of the features.
Laser assisted micromachining system and temperature control method using same
A laser assisted micromachining system, includes a working sliding, a tool module, a laser module, and a temperature control module for the processing of a workpiece. The laser module is disposed in the working slide and moves with the working slide in three-dimensional space. The temperature control module includes a temperature sensor, a cooler, a controller and a coolant, which detects the real-time temperature value of the cooler. The cooler is located in the working slide and supports the tool module. The controller controls the working state of the cooler according to the temperature feedback. Control signal induced by the temperature indicator, and the working state of the cooler are controlled by the controller. The coolant is used to control the temperature distribution of the cooler in the setting range. At the same time, the invention also provides a temperature control method for the laser assisted micro machining system.
Multiple laser beam processing
Described herein is a system for processing a workpiece that includes a plurality of lasers that each produces a laser beam pulse. The system also includes a laser control module that sequences temporal characteristics of the laser beam pulses. Additionally, the system includes a laser beam compensation module that shapes a near field intensity profile of at least one of the laser beam pulses and adjusts a path length of at least one of the laser beam pulses. The system also includes at least one laser beam position element that combines the laser beam pulses to produce a combined laser beam pulse at a surface of the workpiece.
APPARATUS AND METHOD FOR SEMICONDUCTOR PACKAGE FAILURE ANALYSIS
A pulsed laser apparatus for milling a sample is described. The apparatus includes a pulsed laser, a scan head for scanning a beam from the pulsed laser across the sample and an F-theta lens for focusing the scanned beam onto the sample. The apparatus may also include a liquid bath for milling the sample under the liquid, such as water. Methods of pulsed laser milling are also described.
LASER OSCILLATOR, LASER PROCESSING MACHINE, AND METHOD OF SUPPRESSING STIMULATED RAMAN SCATTERING
A pulse generation unit generates a driving voltage signal including a pulse signal. A laser oscillation module oscillates a laser beam by carrying out, based on the driving voltage signal, a pulse oscillating operation. When the power command signal has a voltage command value corresponding to a laser power greater than a predetermined laser power during a high period, the pulse generation unit modulates, in a pulsed manner, a voltage value of the high period of the driving voltage signal so as to alternately repeat, for a preset period of time from a rising time of the high period of the driving voltage signal, a high state in which the voltage value is maintained and a low state in which the voltage value is lowered by a predetermined voltage value without being lowered to a voltage value of a low period of the driving voltage signal.
Laser fabrication with beam detection
A computer numerically controlled machine may include a source of electromagnetic energy. A beam of electromagnetic energy from the source may be delivered to a destination such as, for example, a material positioned in a working area of the computer numerically controlled machine. The beam of electromagnetic energy may be susceptible to interferences while traveling from the source to the destination. The computer numerically controlled machine may include a beam detector configured detect an interference of the beam by measuring a power of the beam of electromagnetic energy at a location between the source and the destination. An interference of the beam may be detected if the power of the beam is less than a threshold value. A controller at the computer numerically controlled machine may perform one or more actions in response to the beam detector detecting the interference of the beam of electromagnetic energy.