A laser crystallizing apparatus includes a first light source unit configured to emit a first input light having a linearly polarized laser beam shape. A second light source unit is configured to emit a second input light having a linearly polarized laser beam shape. A polarization optical system is configured to rotate the first input light and/or the second input light at a predetermined rotation angle. An optical system is configured to convert the first input light and the second input light, which pass through the polarization optical system, into an output light. A target substrate is seated on a stage and output light is directed onto the target substrate. A monitoring unit is configured to receive the first input light or the second input light from the polarization optical system and measure a laser beam quality thereof.

A method determines at least one parameter for a process quality during a processing process. The method includes: processing a workpiece while moving a processing tool and the workpiece relative to one another; monitoring a region on the workpiece; determining the at least one parameter for the process quality based on the monitored region; and determining at least one position-dependent parameter for the process quality based on a plurality of measured values of the at least one parameter at a same processing position, or determining at least one direction-dependent parameter for the process quality based on the plurality of measured values of the at least one parameter in a same processing direction.

The present disclosure concerns a device for distance measurement for a laser processing system. The device comprises a light source, which is configured to generate a primary beam for direction onto a workpiece, at least one detection device configured to record a secondary beam reflected from the workpiece, at least one optical amplifier configured to amplify the primary beam and/or the secondary beam, and an evaluation unit configured to evaluate interference between spectral components in the frequency domain.

A machine learning device is connected to a fiber laser device. The machine learning device observes, as a state variable representing a driving state of the fiber laser device, a state quantity including time-series data on output light detection results obtained by detecting a light output of laser light emitted from the fiber laser device and time-series data on reflected light detection results obtained by detecting reflected light of the laser light, and acquires determination data representing a failure occurrence situation in the fiber laser device as determined from a difference between the output light detection results and a light output instruction of the fiber laser device. The machine learning device learns a boundary condition for failure occurrence caused by the reflected light by using the state variable and the determination data.

A laser oscillator capable of detecting scattered light intensity when a laser beam is incident on an end surface of a fiber more appropriately is provided. A laser oscillator monitoring control system includes: a scattered light detection unit that detects a scattered light intensity on an input end surface of a process fiber of a fiber laser oscillator; a control unit that controls a laser output value on the basis of a laser output command value from a CNC and a detection result obtained by the scattered light detection unit; a normal scattered light calculation unit that calculates a normal index value; a first threshold setting unit that sets a first threshold indicating an abnormality resulting from a contamination and/or a scratch; a second threshold setting unit that sets a second threshold indicating an abnormality resulting from an optical axis shift; and a third threshold setting unit that sets a third threshold indicating an abnormality of a level in which a component is destroyed. The control unit controls a laser output value on the basis of the scattered light intensity detected by the scattered light detection unit, the first threshold, the second threshold, and the third threshold.

The invention relates to a method for conducting and monitoring a machining process of a workpiece (10), in particular a welding process for joining the workpiece (10) to a further workpiece (10), by means of a high-energy machining beam (14), wherein the method comprises the following steps: generating a high-energy machining beam (14); projecting and/or focusing the machining beam (14) onto the workpiece (10), wherein, in accordance with a machining control signal, different machining regions of the workpiece (10) are machined; generating a measurement beam (16) by means of an optical coherence tomograph (18), wherein the measurement beam (16) is able to be coupled into the machining beam (14); determining measurement points (20) during the machining process by means of the optical coherence tomograph (18) using the measurement beam (16), in accordance with a measurement control signal; obtaining at least one external signal which is based on a measured variable and which is independent of a processing of the machining control signal and of the measurement control signal; generating an evaluation on the basis of the measurement points (20) and of the at least one external signal, which evaluation comprises a comparison of the measurement points (20) with at least one threshold value; monitoring the machining process on the basis of the evaluation.

The invention relates further to a correspondingly configured device for conducting and monitoring a machining process of a workpiece (10).

An inspection apparatus for a laser oscillator includes a dimming plate that dims a laser beam immediately after the laser beam is emitted from the laser oscillator; an imaging unit that images, with a plurality of pixels, the laser beam dimmed by the dimming plate; a processing unit that processes an image captured by the imaging unit; and a display unit that displays the image processed by the processing unit. The processing unit has at least two thresholds of an inner ring and an outer ring used for partitioning the intensity of the laser beam.

A feed mechanism moves a workpiece relative to a cylindrical irradiation region of laser light. A light receiver receives laser light that has not impinged on the workpiece. An intensity detector detects intensity of the laser light received. A controller identifies a relative positional relationship between the laser light and the workpiece on the basis of the light intensity detected. The controller determines, at timing when the light intensity detected decreases, that the laser light has begun to cut into the workpiece.

The invention provides a method for laser modification of a sample to form a modified region at a target location within the sample. The method comprises positioning a sample in a laser system for modification by a laser; measuring tilt of a surface of the sample through which the laser focusses; using at least the measured tilt to determine a correction to be applied to an active optical element of the laser system; applying the correction to the active optical element to modify wavefront properties of the laser to counteract an effect of coma on laser focus; and laser modifying the sample at the target location using the laser with the corrected wavefront properties to produce the modified region.

A laser processing system is disclosed, which includes a system frame, a process frame movably supported by the system frame, an optics wall coupled to the process frame, a process shroud coupled to the system frame and extending over and alongside upper and lateral peripheral regions of the optics wall and an optics shroud coupled to the process shroud. The process frame is configured to support a laser source, a workpiece positioning system and a beam delivery system. The process frame is moveable relative to the process shroud and the process frame is moveable relative to the optics shroud. The process shroud, the optics wall and the process frame enclose a first space for laser processing of a workpiece. The optics shroud, the optics wall and the process frame enclose a second space for accommodating the laser source.