A laser processing apparatus includes at least a laser oscillator, optical fiber (30), and laser head (40). Laser head (40) includes at least first and second shield glasses (45) and (47) and first and second light receivers (51) and (52) inside second housing (41). In first and second shield glasses (45) and (47), first and second coating films (46) and (48) are respectively provided on light receiving surfaces of laser light (LB). First light receiver (51) receives laser light (LB) reflected by first coating film (46) and outputs a first light receiving signal, and second light receiver (52) receives laser light (LB) reflected by peripheral portion (48b) of second coating film (48) and outputs a second light receiving signal.

An apparatus for laser processing of very wide non-woven fabric materials at high speeds. This invention enables a laser beam to sever, perforate and pattern a large piece of fabric materials planarly disposed at regular or irregular spatial intervals over the entire width while the fabric passes from one roller to another roller at high speeds by precisely managing focus and intensity of the beam at the focal point on the web. A control system managing the laser processing system enables rapid reconfiguration of perforation patterns. The fabric can be woven or nonwoven, homogeneous or nonhomogeneous material with uniform or nonuniform thickness. An optical sensor is provided to sense the laser processing as it is performed and provide feedback to a system controller to optimize laser processing performance in real time.

Laser apparatus (10) includes at least: a laser oscillator that emits laser light (LB); reflection mirrors (M1), (M2) that are disposed on an optical path of laser light (LB) and change the optical path; actuators (ACT1), (ACT2) that are respectively coupled to reflection mirrors (M1), (M2) and displace reflection mirrors (M1), (M2); optical axis deviation detector (16) that is disposed to surround the optical path of laser light (LB) and detects an optical axis deviation of laser light (LB); and a controller that drives actuators (ACT1), (ACT2) on the basis of a detection result of optical axis deviation detector (16) to displace reflection mirrors (M1), (M2) and correct the optical axis deviation of laser light (LB).

A laser processing device and a laser processing method that are capable of forming a high-quality semiconductor film are provided. An ELA device (excimer laser annealing device) (1) includes a laser oscillator (10) that generates laser light for forming a polysilicon film by irradiating an amorphous silicon film over a substrate to be processed with the laser light, a pulse measuring instrument (100) for detecting first partial light and second partial light contained in the laser light, and a monitoring device (60) for comparing a detection result of the first partial light with a detection result of the second partial light.

A method for comparing laser machining systems is provided, wherein a laser machining system comprises a laser machining head and a sensor module having at least one photodiode for detecting process radiation, said method comprising: detecting radiation emitted from a light source by means of the photodiode and generating a corresponding intensity signal, wherein the radiation is guided from the light source to the photodiode by at least one optical element in the laser machining head and/or by at least one optical element of the sensor module; aligning the laser machining head and the light source with one another so that the intensity signal assumes a maximum value; and comparing the intensity signal with at least one predetermined reference value. A method for monitoring a laser machining process and an associated laser machining system are also provided.

The present application relates to an apparatus (10) for laser processing, comprising at least two laser sources, which are different from one another and are configured for supplying respective laser beams having wavelengths different from one another, a laser head (20), which can be operated as end tool of a laser machine tool (90) that can be configured for carrying out at least one type of laser processing operation that can be selected from a set of types of laser processing operations, and a set of orientable optical components (16) so as to provide a set of selectable optical paths for directing a laser beam supplied by a laser source of said at least two laser sources, and a control unit (30) coupled to the at least two laser sources, to the set of orientable optical components (16), and to the laser head (20) and configured for controlling the at least two laser sources, the set of orientable optical components (16), and the laser head (20) according to the type of laser processing operation selected from the set of types of laser processing operations, i.e., so as to supply and direct a laser beam associated to the respective type of processing operation onto a region of a work surface (110). The laser head (20) comprises a set of nozzles (40, 42, 44, 46) configured for directing at least one processing material onto the working region (110), which comprises at least one nozzle (40) configured for directing jets of powder of at least one material, preferably powder of metal material (in brief metal powder), as well as comprising at least one of the following: a) a first nozzle (42) configured for directing a metal wire onto the working region, preferably metal wire for laser welding; and b) a second nozzle (46) configured for directing an assist gas onto the working region, preferably an assist gas for laser welding, and wherein the control unit (30) is coupled to the set of nozzles and is configured for controlling at least one nozzle of said set of nozzles (40, 42, 44, 46) according to the type of associated and selected laser processing operation so as to control said at least one nozzle so that it will direct respective processing materials onto the working region (110) simultaneously with direction of the laser beam (L) associated to the type of laser processing operation selected.

A computer-numerically-controlled (CNC) machine is configured to (i) measure a power of a beam of electromagnetic energy at a location between a source of the electromagnetic energy and a destination in the CNC machine, the beam of electromagnetic energy traveling from the source to the destination being susceptible to one or more interferences, and the one or more interferences being capable of altering the power of the beam of electromagnetic energy by at least diverting, away from an intended path for the beam of electromagnetic energy, at least a portion of the beam of electromagnetic energy, (ii) detect, based at least on the measured power of the beam of electromagnetic energy being less than a threshold value, an interference of the beam of electromagnetic energy, and (iii) in response to detecting the interference of the beam of electromagnetic energy, perform one or more actions.

The laser machining device includes an observation image acquiring unit configured to repeatedly acquire an observation image of a machining spot of laser light emitted from a laser optical system to a street on a wafer while a machined groove is being formed, a luminance detector configured to detect a luminance of a plasma generated at the machining spot by emission of the laser light based on the observation image every time the observation image acquiring unit acquires the observation image, a correspondence information obtaining unit configured to obtain correspondence information indicating a correspondence relationship among the luminance, energy of the laser light and a machined state of the machined groove, and a machined state assessing unit configured to assess the machined state with reference to the correspondence information based on the luminance and known energy of the laser light every time the luminance detector detects the luminance.

A device for introducing patterns by radiating a wound continuous substrate. The device provides patterning during continuous roll-to-roll movement without material slippage and with minimal distortion by providing a dancer roll between a processing drum and an unwinder roll on one side, and a winder roll on the other side, for tautly guiding the continuous substrate along a contact surface of at least half of the circumference of the processing drum in order to drive the continuous substrate without slippage. The dancer rolls are adapted to tautly guide the advancing substrate web and returning substrate web with a constant force, and an equilibrium is adjustable between a defined counterforce and the constant action of force on the dancer roll by a stabilization device, and is maintained constant by a controller based on measured deflections of the dancer roll by controlling the rotational speed of the unwinder and winder rolls.

The present laser processing device has a laser oscillator, a laser power supply, a control unit, an optical fiber cable, an electric cable, a processing head, an operation panels and a laser processing monitor unit. The laser processing monitor unit includes the control unit, the operation panel a sensor signal processing unites and a sensor unites as a basic configuration for a main function, that is, a monitoring function, and additionally includes a reference beam source, a reference beam source power supply, an optical measuring instrument and an optical path switching unit as a calibration unites for calibrating an optical sensor incorporated in the sensor unit.