A computer-numerically-controlled (CNC) machine is configured to (i) measure a power of a beam of electromagnetic energy at a location between a source of the electromagnetic energy and a destination in the CNC machine, the beam of electromagnetic energy traveling from the source to the destination being susceptible to one or more interferences, and the one or more interferences being capable of altering the power of the beam of electromagnetic energy by at least diverting, away from an intended path for the beam of electromagnetic energy, at least a portion of the beam of electromagnetic energy, (ii) detect, based at least on the measured power of the beam of electromagnetic energy being less than a threshold value, an interference of the beam of electromagnetic energy, and (iii) in response to detecting the interference of the beam of electromagnetic energy, perform one or more actions.

A laser apparatus includes: a first vacuum chamber, wherein machining is performed on a target substrate in the first vacuum chamber; a laser facing the first vacuum chamber; a carrier disposed in the first vacuum chamber, wherein the target substrate is seated on the carrier; a chamber window disposed in one surface of the first vacuum chamber, wherein a laser beam emitted by the laser passes through the chamber window; a first protection window positioned between the carrier and the chamber window; a second vacuum chamber disposed at a first side of the first vacuum chamber; and a transfer unit configured to transfer the first protection window to the second vacuum chamber.

Laser cleaning apparatus (100) comprising: a laser system (102) configured to output laser light having a power, a wavelength, a temporal characteristic and a divergence; a delivery cable (106) to deliver the laser light to a cleaning head; a cleaning head (110) comprising: an output aperture and output optics (116) configured to focus the laser light (104) to have a fluence at a focal plane (126) that is greater than an ablation threshold of a surface contaminant to be removed from a surface to be cleaned; scanning apparatus (118) to scan the laser light in at least one dimension across a scan region within the focal plane to cause the scanning laser light to have an effective divergence greater than the divergence of the laser light and to have a corresponding safe working distance from the output aperture determined by the effective divergence, the power, the wavelength and the temporal characteristic; and scan monitoring apparatus (120) to monitor the effective divergence of the scanning laser light and to generate an alarm signal (108) in response to determining that the effective divergence has changed.

A laser processing device is a device that processes a workpiece using a laser beam, and includes a cutting pallet and a container. The cutting pallet includes a placement unit that supports a lower surface of the workpiece. The container supports the cutting pallet and is capable of storing a transmission inhibition liquid inhibiting transmission of light having a wavelength greater than or equal to 0.7 .Math.m and less than or equal to 10 .Math.m up to a height position of the placement unit.

Laser processing head (20) of the present disclosure includes housing (30), transparent protector (40), and temperature sensor (70). Housing (30) includes an optical path of processing laser light (LB). Transparent protector (40) is detachably fixed to housing (30), passes processing laser light (LB), and suppresses dust of work material (W) entering into housing (30). Here, the dust is generated from the work material (W) irradiated with processing laser light (LB). Temperature sensor (70) detects the temperature of transparent protector (40).

A housing for a laser processing machine is described to treat work pieces. The housing comprises a dividing wall, which separates a first work space having a first length and a second work space having a second length from one another, a first entrance to allow access to the first work space, a second entrance to allow access to the second work space, a closing device, which is configured to selectively open and close the first entrance and the second entrance and a control unit, which is operatively connected to the closing device. The dividing wall is placeable in an operating position, which is variable among at least a first position, a second position and a third position. The control unit is configured to control the closing device as a function of the operating position of the dividing wall.

A housing for a laser processing machine is described comprising a dividing wall, which separates a first work space and a second work space, and a covering device, which is configured to selectively cover at least one between the first work space and the second work space. The covering device comprises at least a cover, which is controllable in an active configuration, in which the cover is configured to cover one between the first work space and the second work space and a guide system, which is configured to guide the cover so that the cover, when it is in the active configuration, comprises at least a main portion and an auxiliary portion extending from the main portion and being inclined relative to the main portion.

A welding window device includes an elongated body that defines a welding cavity that extends through the body from a top side to a bottom side. The welding cavity is framed by an inlet end, an outlet end, and lateral sides of the body. The body includes one or more gas channels inwardly extending through one or more of the first lateral side or the second lateral side from an inlet opening in the inlet end toward the outlet end of the body. The gas channels include nozzle openings inwardly oriented toward the welding cavity. The gas channels are positioned in the body to direct a gas into the welding cavity during welding of other bodies together within the welding cavity.

A laser etching apparatus includes a chamber, a laser port, a laser emitter, a particle grabber, and a revolving window module. The chamber is configured to receive a substrate. The laser port is disposed below the chamber in a downward direction. The laser emitter is configured to emit a laser to the substrate disposed within the chamber through the laser port. The particle grabber is disposed within the chamber and includes a body disposed over the laser port. An opening is formed through the body. The opening is configured to pass the laser therethrough. The revolving window module includes a revolving window and a driving part configured to drive the revolving window. The revolving window is disposed between the particle grabber and the laser port.

Described herein is an apparatus, for shielding light generated by a laser during non-destructive inspection of an object. The apparatus includes a light shield at least partially enveloping the laser and defining a first opening through which light generated by the laser passes from the laser to the object. The light shield is opaque and includes at least one first biasing mechanism. The apparatus also includes at least one first light seal coupled to the light shield about the first opening of the light shield. The at least one first biasing mechanism is configured to urge resilient deformation of the at least one first light seal against the object. When the at least one first light seal is resiliently deformed against the object, light generated by the laser is constrained within a light containment space defined between the light shield, the at least one first light seal, and the object.