Patent classifications
B23K26/707
Laser Processing Apparatus
A laser processing apparatus includes a laser light output section, a first scanner and a second scanner, a distance measurement light emitting section, a reference member which is arranged at a position which is the other end of a correction optical path formed with the distance measurement light emitting section as one end of the correction optical path and is arranged such that an optical path length of the correction optical path is a predetermined reference distance, a distance measurement light receiving section which receives distance measurement light reflected by the workpiece or the reference member, a distance measuring section which measures a distance to the workpiece or the reference member, and a distance correcting section which compares a measurement result of the distance to the reference member with the reference distance stored in advance to correct the measurement result obtained by the distance measuring section.
Method and device for the controlled machining of a workpiece
A method for controlled machining of a workpiece includes focusing a laser light beam on a target point of the workpiece to generate a laser focus point. An optical distance measuring device gathers measuring data to determine a distance between the target point and a laser target optics. The workpiece is positioned in relation to the laser focus point based on the distance measuring data gathered. The distance measuring device is a confocal optical distance measuring device having a measuring light source for generating a measuring light and having a variable-focal-length measuring lens system. The focal length of the variable-focal-length measuring lens system is varied over time to gather distance measuring data at different focal length values of the variable-focal-length measuring lens system. A device for controlled machining includes a laser light source, a laser target optics, a distance measuring device, a positioning device, and an evaluation and control unit.
In Situ Optical Feedback
Sensors incorporated within a waveguide detect a laser light output from at least a laser delivery optical fiber to provide in situ feedback of the laser light intensity detected by the sensor. The sensors may detect laser light directly from the laser delivery optical fiber or as reflected back from a plurality of work pieces during a weld cycle. In various aspects, the feedback provided from the sensors is used to control the laser light intensity or to alert an operator that the laser light intensity is below a predetermined parameter.
LASER DEVICE
A laser device includes a laser oscillator that generates a laser beam, condenser lens that condenses laser beam emitted from the laser oscillator, transmission fiber that includes at least core that transmits laser beam condensed by condenser lens, and cladding provided around core, and a lens driving unit that adjusts a position of condenser lens. The lens driving unit automatically adjusts the position of condenser lens to reduce light intensity of laser beam incident on cladding.
CONSTANT KERF DIEBOARD CUTTING SYSTEM USING LASER AND VISION
Laser cutting a dieboard using a laser cutting system, including: setting a width of material to be removed from the dieboard using the laser cutting system; capturing an image of the width of the material removed by the laser cutting system using at least one image capture unit; measuring the captured width of the material captured on the image using the at least one image capture unit; and comparing the measured width of the material to the set width of the material, and moving a laser head of the laser cutting system up and down to adjust a focal length of the laser cutting system and moving the laser head of the laser cutting system sideways to adjust a speed of the laser head, until the measured width and the set width are substantially similar.
MULTIFUNCTIONAL LASER PROCESSING APPARATUS
A multifunctional laser processing apparatus includes a hollow milling shaft, a light path tool holder, a tool-holder-type melting module, a laser light source, and a temperature sensor. The hollow milling shaft includes a first light path channel and a connection portion. The light path tool holder can be connected to the connection portion. The light path tool holder has a second light path channel communicating with the first light path channel. The tool-holder-type melting module can be connected to the connection portion. The tool-holder-type melting module has a third light path channel communicating with the first light path channel. The laser light source is configured to emit a laser light beam toward the first light path channel. The temperature sensor is disposed on an outer surface of the hollow milling shaft and is configured to sense a temperature of a work piece during a multifunctional processing process.
Machine learning apparatus, laser machining system and machine learning method
A machine learning apparatus that learns laser machining condition data of a laser machining system includes: a state amount observation unit that observes a state amount of the laser machining system; an operation result acquisition unit that acquires a machined result of the laser machining system; a learning unit that receives an output from the state amount observation unit and an output from the operation result acquisition unit, and learns the laser machining condition data in association with the state amount and the machined result of the laser machining system; and a decision-making unit that outputs laser machining condition data by referring to the laser machining condition data learned by the learning unit.
Laser irradiation apparatus, method for manufacturing semiconductor device, and method for operating laser irradiation apparatus
A laser annealing apparatus (1) according to an embodiment includes a laser oscillator (4) configured to generate a laser beam (L), a floating-type conveying stage (3) configured to float and convey a workpiece (W) to be irradiated with the laser beam (L), and a beam profiler (7) configured to measure a beam profile of the laser beam (L). The floating-type conveying stage (3) includes a conveying surface (3a) opposed to the workpiece (W), and a bottom surface (3b) on the side opposite to the conveying surface (3a). The beam profiler (7) is positioned below the bottom surface (3b) of the floating-type conveying stage (3). The floating-type conveying stage (3) includes a detachable part (12) in a part of it. An opening (S) is formed by detaching the detachable part (12) from the floating-type conveying stage (3), the opening (3) extending from the conveying surface (3a) to the bottom surface (3b). The beam profiler (7) is configured to measure the beam profile of the laser beam (L) through the opening (S).
APPARATUS FOR ADDITIVELY MANUFACTURING THREE-DIMENSIONAL OBJECTS
Apparatus for additively manufacturing three-dimensional objects by means of successive layerwise selective irradiation and consolidation of layers of a build material which can be consolidated by means of an energy beam, which apparatus comprises an irradiation device adapted to guide an energy beam across a build plane, wherein a calibration device is provided comprising a positioning unit, a determination unit and a calibration unit, preferably arranged in a process chamber of the apparatus, that is adapted to at least partially reflect the energy beam, wherein the irradiation device is adapted to guide the energy beam to the calibration unit for generating a reflected part of the energy beam, wherein the positioning unit is adapted to position the irradiation device dependent on at least one parameter of the reflected part of the energy beam determined via the determination unit.
DETERMINATION DEVICE FOR DETERMINING AT LEAST ONE PARAMETER OF AN ENERGY BEAM
Determination device (1) for determining at least one parameter of an energy beam (5) for an apparatus (3) for additively manufacturing three-dimensional objects by means of successive layerwise selective irradiation and consolidation of layers of a build material which can be consolidated by means of an energy beam (5), wherein the determination device (1) comprises a beam guiding element (12) adapted to guide the energy beam (5) to a determination unit (7) which is adapted to determine at least one parameter of the energy beam (5), wherein the determination unit (7) and the beam guiding element (12) are arranged as a determination assembly in a defined spatial arrangement relative to each other, wherein the determination assembly is movable, in particular rotatable, into at least a first and a second determination position, wherein the determination unit (7) is adapted to receive the energy beam (5) being guided to a first spatial position from the beam guiding element (12) in the first determination position and to receive the energy beam (5) being guided to a second spatial position from the beam guiding element (12) in the second determination position.