Patent classifications
B23K26/707
Multifunctional laser processing apparatus
A multifunctional laser processing apparatus includes a hollow milling shaft, a light path tool holder, a tool-holder-type melting module, a laser light source, and a temperature sensor. The hollow milling shaft includes a first light path channel and a connection portion. The light path tool holder can be connected to the connection portion. The light path tool holder has a second light path channel communicating with the first light path channel. The tool-holder-type melting module can be connected to the connection portion. The tool-holder-type melting module has a third light path channel communicating with the first light path channel. The laser light source is configured to emit a laser light beam toward the first light path channel. The temperature sensor is disposed on an outer surface of the hollow milling shaft and is configured to sense a temperature of a work piece during a multifunctional processing process.
SYSTEM AND METHOD TO MEASURE AND CALIBRATE LASER PROCESSING MACHINE USING LOW-POWER BEAM PROFILER
An apparatus calibrates a laser processing machine and includes an imaging sensor and a controller. The controller directs output of a beam from the machine’s low power pointer laser and directs an actuator at measurement conditions. Images of the beam are obtained by an imaging sensor, and the controller measures a parameter of at least one of the machine’s optical components. The controller then outputs an indication of the machine indicative of the measured parameter. For example, the controller can calculate a focus position of the beam from the laser head so the Z-position of the laser head can be adjusted for any discrepancies. In other examples, the controller can determine an offset of the fiber tip of the head so adjustments to operations can be made, or the controller can determine centering of the beam in the head’s nozzle so adjustments can be made.
LASER MACHINING AND RELATED CONTROL FOR ADDITIVE MANUFACTURING
Additive manufacturing can include use of a laser-machining technique. Laser machining can be used to form cavities, trenches, or other features in an additively-manufactured structure. Spectroscopy can be performed to monitor a laser machining operation. For example, a laser-enhanced additive manufacturing process flow can include depositing a conductive layer on a surface of a dielectric layer, and conductively isolating a first region from a second region of the conductive layer using ablative optical energy, including applying ablative optical energy to the conductive layer, monitoring a spectrum of an ablative plume generated by applying the ablative optical energy, and controlling the ablative optical energy in response to a characteristic of the spectrum of the ablative plume.
Laser processing head and laser processing system using same
Laser processing head (20) of the present disclosure includes housing (30), transparent protector (40), and temperature sensor (70). Housing (30) includes an optical path of processing laser light (LB). Transparent protector (40) is detachably fixed to housing (30), passes processing laser light (LB), and suppresses dust of work material (W) entering into housing (30). Here, the dust is generated from the work material (W) irradiated with processing laser light (LB). Temperature sensor (70) detects the temperature of transparent protector (40).
Machine learning device, laser machine, and laser machining system
A machine learning device performs machine learning on a laser machine including a plurality of galvanometer mirrors for reflection of a laser beam and a plurality of galvanometer motors for driving the galvanometer mirrors to rotate, and scanning the laser beam over a workpiece. The machine learning device includes: input data acquisition unit that acquires at least two detected temperatures from the galvanometer mirrors and the galvanometer motors as input data; label acquisition unit that acquires a coefficient as a label for calculating a machining target position from an actual position of machining with the laser beam on the workpiece; and learning unit that performs supervised learning using a set of the label and the input data as training data to construct a mathematical model for calculating the machining target position from the actual machining position on the workpiece based on the at least two detected temperatures.
METHOD FOR COMPARING LASER PROCESSING SYSTEMS AND METHOD FOR MONITORING A LASER PROCESSING PROCESS AND ASSOCIATED LASER PROCESSING SYSTEM
A method for comparing laser machining systems is provided, wherein a laser machining system comprises a laser machining head and a sensor module having at least one photodiode for detecting process radiation, said method comprising: detecting radiation emitted from a light source by means of the photodiode and generating a corresponding intensity signal, wherein the radiation is guided from the light source to the photodiode by at least one optical element in the laser machining head and/or by at least one optical element of the sensor module; aligning the laser machining head and the light source with one another so that the intensity signal assumes a maximum value; and comparing the intensity signal with at least one predetermined reference value. A method for monitoring a laser machining process and an associated laser machining system are also provided.
Method for detecting the operating condition of an optical element arranged along a propagation path of a laser beam of a machine for processing a material, system for carrying out said method and laser processing machine provided with said system
A method and system for detecting an operating condition of an optical element along a propagation path of a power laser beam in a laser processing machine head are based on a first signal of a back-propagating optical radiation at the wavelength of the laser beam; a second signal of a back-propagating optical radiation having a wavelength in the near infrared; a third signal of an optical radiation emitted by the optical element in the infrared in proximity to its surface; a fourth signal which is a function of the time-of-flight of an acoustic wave launched through the volume of the optical element.
LASER PROCESSING APPARATUS
A laser beam irradiation unit of a laser processing apparatus includes a laser oscillator that emits a laser beam, a characteristic conversion optical element that converts a characteristic of the laser beam emitted from the laser oscillator, a mirror and a collecting lens that are optical elements that guide the laser beam to a workpiece, a detecting unit that detects the water retention state of the characteristic conversion optical element, and a drying unit that dries the characteristic conversion optical element.
LASER PROCESSING HEAD AND LASER PROCESSING SYSTEM USING SAME
Laser processing head (20) of the present disclosure includes housing (30), transparent protector (40), and temperature sensor (70). Housing (30) includes an optical path of processing laser light (LB). Transparent protector (40) is detachably fixed to housing (30), passes processing laser light (LB), and suppresses dust of work material (W) entering into housing (30). Here, the dust is generated from the work material (W) irradiated with processing laser light (LB). Temperature sensor (70) detects the temperature of transparent protector (40).
BONDING METHOD AND BONDING DEVICE FOR METAL MEMBER
A bonding method includes: an oxide-film forming step, on an irradiated surface, an oxide film having a film thickness corresponding to a first output and an irradiation time of an oxide-film-forming laser beam; a first reflected-laser-beam detection step of detecting a second output; a first absorptance computing step of computing a first absorptance for the oxide-film-forming laser beam; laser-beam switching step of switching the oxide-film-forming laser beam radiated onto the irradiated surface to a heat-bonding laser beam; and a heat bonding step of heating a first bonding surface until the temperature thereof reaches a predetermined bonding temperature, and bonding the first bonding surface to a second bonding surface.