A sensing apparatus monitors a cover optic on a laser processing head for contamination, indicating the need to replace the cover optic. The apparatus includes at least one reflector and at least one sensors that are disposed in the processing head adjacent a periphery of the cover optic. The reflector reflects radiation from the laser beam deflected from contamination on the cover optic and incident thereagainst. The sensor is offset from the reflector and detects at least a portion of the radiation reflected by the reflector. A controller in communication with the sensor can determine the contamination on the cover optic based on the detected radiation.

An evaluation method for evaluating laser machining in which irradiation region of a laser beam is moved relative to object to perform machining of object, includes a measurement step and an evaluation step. In the measurement step, a change in an intensity of light according to a movement of measurement region is measured by moving measurement region for measuring the intensity of light, relative to object. In the evaluation step, an evaluation of the laser machining is performed based on the change in the intensity of light according to the movement of measurement region. In the measurement step, measurement region is moved relative to object so that movement path of measurement region has a plurality of intersections with movement path of irradiation region.

A laser device includes a laser oscillator that generates a laser beam, condenser lens that condenses laser beam emitted from the laser oscillator, transmission fiber that includes at least core that transmits laser beam condensed by condenser lens, and cladding provided around core, and a lens driving unit that adjusts a position of condenser lens. The lens driving unit automatically adjusts the position of condenser lens to reduce light intensity of laser beam incident on cladding.

An arrangement monitors an optical element. The arrangement includes: a light source configured to emit radiation onto a surface of the optical element; a detector configured to detect the radiation that has been at least partially reflected at the surface of the optical element; and a holder for the optical element, in which the light source and the detector are integrated. The holder has a cooling region through which a cooling liquid is configured to flow, the cooling region being in contact with the optical element. The holder has a reservoir, through which a beam path between the light source and the detector extends. The reservoir is configured to receive the cooling liquid leaking out at the optical element in case of a leakage.

A laser calibration device includes a scanning surface, an optical detector for scanning a calibration substrate arranged on the scanning surface, and a processing unit. The optical detector is movable with respect to the scanning surface with not more than two, preferably not more than one, degree of freedom. The processing unit is configured for: generating pattern generation executable instructions to generate a calibration pattern on a calibration substrate by one or more laser processing devices of a laser processing apparatus; detecting a calibration pattern generated based on such pattern generation executable instructions; and based on a detected calibration pattern and on the corresponding pattern generation executable instructions, generating calibration executable instructions for calibrating the one or more laser processing devices of said laser processing apparatus.

Provided is a laser processing head including: shield holder (23) that has opening (23b) formed through shield holder (23) and optical sensor mounting hole (23c) formed in an inner peripheral surface of opening (23b); optical sensor (24) that has light receiving surface (24a) facing the inside of opening (23b) through optical sensor mounting hole (23c) and is attached to shield holder (23); and second protective glass (25) that has an outer peripheral surface facing light receiving surface (24a) of optical sensor (24) and is provided in opening (23b), second protective glass (25) transmitting a laser beam emitted by a laser oscillator to emit the laser beam toward a workpiece, and second protective glass (25) including reflective coating film (25a) formed in a region in the outer peripheral surface except an opposed region facing light receiving surface (24a) of optical sensor (24).

An arrangement monitors an optical element. The arrangement includes: a light source configured to emit radiation onto a surface of the optical element; a detector configured to detect the radiation that has been at least partially reflected at the surface of the optical element; and a holder for the optical element, in which the light source and the detector are integrated. The holder has a cooling region through which a cooling liquid is configured to flow, the cooling region being in contact with the optical element. The holder has a reservoir, through which a beam path between the light source and the detector extends. The reservoir is configured to receive the cooling liquid leaking out at the optical element in case of a leakage.

Provided is a lens assembly. The lens assembly includes a first optical path offset assembly (33), a second optical path offset assembly (34), a drive mechanism, an elastic seal ring (35) and a locking mechanism (37). The optical path of the first optical path offset assembly and the optical path of the second optical path offset assembly communicate with each other. The first optical path offset assembly and the second optical path offset assembly are each rotatable about the central axis of the lens assembly (3). The drive mechanism is configured to drive the first optical path offset assembly to rotate about the central axis. The elastic seal ring is configured to make the first optical path offset assembly and the second optical path offset assembly rotate together. The locking mechanism is pressed against the first optical path offset assembly or the second optical path offset assembly to enable the first optical path offset assembly and the second optical path offset assembly to rotate relative to each other. The lens assembly enables an offset laser beam to be further offset or be rectified, and thereby the size of a light spot can be regulated in a more diversified manner and with a higher precision. Also provided is a laser welding head. The laser welding head includes the preceding lens assembly.

Laser cutting a dieboard using a laser cutting system, including: setting a width of material to be removed from the dieboard using the laser cutting system; capturing an image of the width of the material removed by the laser cutting system using at least one image capture unit; measuring the captured width of the material captured on the image using the at least one image capture unit; and comparing the measured width of the material to the set width of the material, and moving a laser head of the laser cutting system up and down to adjust a focal length of the laser cutting system and moving the laser head of the laser cutting system sideways to adjust a speed of the laser head, until the measured width and the set width are substantially similar.

A laser processing device comprises: a first shutter that shifts between a closed-state position for blocking a laser beam and an open-state position for allowing the laser beam to pass; a second shutter that shifts between a closed-state position for blocking laser beams and an open-state position for allowing the laser beams to pass; a first closed-state sensor that detects that the first shutter is disposed at the closed-state position; a first open-state sensor that detects that the first shutter is disposed at the open-state position; a second closed-state sensor that detects that the second shutter is disposed at the closed-state position; and a second open-state sensor that detects that the second shutter is disposed at the open-state position.