Provided is flux for resin flux cored solder using in a soldering method in which the resin flux cored solder is supplied into a through hole formed along a central axis of a soldering iron. The flux contains volatile rosin in an amount of 70 wt % or more and 98 wt % or less, non-volatile rosin in an amount of 0 wt % or more and 10% or less, and an activator in an amount of 2 wt % or more and 30 wt % or less, the activator including an organic acid in an amount of 0 wt % or more and 15 wt % or less, an organohalogen compound in an amount of 0.5 wt % and 15 wt % or less, an amine in an amount of 0 wt % or more and 5 wt % or less, and an amine hydrohalide salt in an amount of 0 wt % or more and 2.5 wt % or less.

A solder material may include nickel and tin. The nickel may include first and second amounts of particles. A sum of the particle amounts is a total amount of nickel or less. The first amount is between 5 at % and 60 at % of the total amount of nickel. The second amount is between 10 at % and 95 at % of the total amount of nickel. The particles of the first amount have a first size distribution, the particles of the second amount have a second size distribution, 30% to 70% of the first amount have a particle size in a range of about 5 μm around a particle size the highest number of particles have according to the first size distribution, and 30% to 70% of the second amount have a particle size in a range of about 5 μm around a particle size the highest number of particles have according to the second size distribution.

Various implementations include a method of coupling a wire to conductive fabric. The method includes providing a conductive fabric, placing low-temperature solder in contact with a portion of the conductive fabric wherein the low-temperature solder has a liquidus temperature and a solidus temperature, placing a wire in contact with the low-temperature solder, increasing the temperature of the low-temperature solder to the liquidus temperature, and decreasing the temperature of the low-temperature solder to the solidus temperature. In some implementations, the low-temperature solder has a preformed shape corresponding to a surface of a portion of a wire, and the surface of the wire is placed in contact with the low-temperature solder.

A self-cleaning wire bonding machine includes a spool, a cleaning tank, a drying element, a tensioner, and a nozzle. The spool includes a rotating body and a metal wire wound around the rotating body. The cleaning tank is configured to clean the metal wire after the rotating body passes the metal wire through the cleaning tank. The drying element is configured to dry the metal wire after passing through the cleaning tank. The tensioner is configured to adjust a tension of the metal wire. The nozzle is configured to heat the metal wire, and the metal wire exits out of the nozzle after being heated.

An electronic device is described wherein the electronic device comprises a substrate with a first conductive metal layer and a second conductive metal layer. A first microphonic noise reduction structure is in electrical contact with the first conductive metal layer wherein the first microphonic noise reduction layer comprises at least one of the group consisting of a compliant non-metallic layer and a shock absorbing conductor comprising offset mounting tabs with a space there between coupled with at least one stress relieving portion. An electronic component comprising a first external termination of a first polarity and a second external termination of a second polarity is integral to the electronic device and the first microphonic noise reduction structure and the first external termination are adhesively bonded by a transient liquid phase sintering adhesive.

A brazing wire includes a brazing tube having an inner cavity and a flux filled in the inner cavity. A trench is provided on an outer peripheral surface of the brazing tube, and the trench extends along an axis of the brazing tube or spirally extends around the axis. A forming mold of the brazing wire includes a mold body having a molding cavity therein. An inner wall of the molding cavity is provided with a protrusion. When the brazing wire passes through the forming mold, the protrusion is used to form the trench. The forming method of the brazing wire includes the following steps. The brazing tube passes through the forming mold, and the trench is formed on the outer peripheral surface of the brazing tube by the protrusion. The trench extends along the axis of the brazing tube or spirally extends around the axis.

A brazing material outer coat and a method for preparing the same, an in-situ synthetic metal-coated flux-cored silver brazing material and a method for preparing the same, a welding method and a joint body, wherein the in-situ synthetic metal-coated flux-cored silver brazing material comprises a flux core and a brazing material outer coat wrapping the flux core, the brazing material outer coat comprises, in percentage by weight: silver Ag 20.0˜36.0%, copper Cu 35.0˜45.0%, zinc Zn 27.0˜37.0%, tin Sn 1.0˜3.0%, phosphorus P 0.1%˜0.5%, nickel Ni 0.5˜2.0%, germanium Ge 0.1˜0.3%, and lithium Li 0.1˜0.3%, the flux core comprises, in percentage by weight: elemental boron micropowder 5.0˜10.0%, sodium borohydride 5.0˜10.0%, potassium fluoroborate 15.0˜30.0%, boric anhydride 25.0˜40.0%, sodium fluoride 10.0˜30.0%, sodium bifluoride 2.0˜4.0%, and copper sulfate 1.0˜5.0%. The in-situ synthetic metal-coated flux-cored silver brazing material in the present disclosure realizes self-reaction in a brazing process to coat a layer of copper film on a surface of a brazed metal, the core of the brazing material has good wettability, good flowability, self-brazing function, and zinc being hard to volatilize, the flux coat has high activity, low hygroscopicity, few carbon residues, good plasticity and toughness, etc. The present disclosure is particularly suitable for brazing pipeline components of stainless steel, manganese brass and so on.

The present disclosure provides a thermal spray alloy system that is more resistant to corrosion than conventional alloy compositions. The disclosed alloy comprises copper as the main component and also potentially nickel, tin, boron, and/or carbon as other principle elements. The alloy composition may utilize a cored wire, and an outer sheath of the cored wire may comprise unalloyed copper. The alloy has superior corrosion resistance to a wide number of corrosive materials, such as hydrogen sulfide, carbon dioxide/carbonic acid, sodium chloride/potassium chloride (salts), bio-fouling, and micro-biologicals. The alloy demonstrates superior thermal conductivity compared to nickel based alloys and stainless steels. The alloy may form an anti-corrosive coating that may be applied to any number of substrates. The disclosed alloy may be applied to a substrate in thick layers, such as between 0.100 inches and 3.0 inches, and may be used to form shapes, such as centralizers.

The present invention provides a solder for nickel based superalloy soldering. The solder includes 11 wt % to 13 wt % chromium, 5.0 wt % to 7.0 wt % aluminum, 3.5 wt % to 5.0 wt % molybdenum, 1.5 wt % to 2.5 wt % niobium, 0.4 wt % to 1.0 wt % titanium, 0.03 wt % to 0.07 wt % carbon, 0.05 wt %-0.15 wt % zirconium, 0.001 wt % to 0.1 wt % boron and remainder nickel or other inevitable impurities, thereby reducing occurrence of soldering hot cracking and insufficient weld bead strength in nickel based superalloy raw materials during soldering.

The present disclosure relates to the field of brazing material technologies, and particularly to a copper-phosphorus brazing wire for brazing a copper alloy spectacle frame as well as a preparing method and system thereof. The copper-phosphorus brazing wire for brazing a copper alloy spectacle frame includes components with following mass percentage, 87.1%91.4% of Cu, 1.5%2.6% of Ag, 5.9%8.4% of P, 0.2%0.42% of Al and 0.8%1.68% of Si. For the copper-phosphorus brazing wire according to the present disclosure, through coordination and cooperation of the components, impurity content is low and joint strength is high in a welding process; a mass ratio of the Si to the Al is a constant value, and a dense oxide film may be formed on a surface of a molten pool to hinder volatilization of Zn in a base material.