A method for manufacturing a heat exchanger (1) includes joining an inner fin (3) to a hollow structure (20) formed from at least two clad plates (200a, 200b) by heating and brazing a filler metal layer (B). Each clad plate has a core layer (A) composed of an aluminum alloy that contains Mg: 0.40-1.0 mass %. The filler metal layer is composed of an aluminum alloy that contains Si: 4.0-13.0 mass %, and further contains Li: 0.0040-0.10 mass %, Be: 0.0040-0.10 mass %, and/or Bi: 0.01-0.30 mass %. The inner fin is composed of an aluminum alloy that contains Si: 0.30-0.70 mass % and Mg: 0.35-0.80 mass %. A flux (F) that contains cesium (Cs) is applied along a contact part (201), and the vicinity thereof, of the at least two clad plates prior to the heating. A heat exchanger (1) may be manufactured according to this method.

In the case of a method according to the invention for connecting at least two components of an endoscope, at least one brazing preform, which contains a high-temperature brazing solder, is introduced into at least one brazing solder reservoir of at least one of the components, the at least two components are held in relation to one another in such a way that at least one brazing gap that is in capillary connection with the at least one brazing solder reservoir is formed between joining regions of the at least two components that are assigned to one another, and the arrangement comprising the at least two components and the at least one brazing preform is heated to a brazing temperature of the high-temperature brazing solder. The invention also relates to a component of an endoscope and to an endoscope.

Some implementations of the disclosure are directed to a solder preform, comprising: a solder alloy body, the solder alloy body comprising at least one opening; and a flux core embedded in the solder alloy body, the flux core comprising a thermochromic indicator, wherein during reflow soldering, the flux core comprising the thermochromic indicator is configured to flow out of the at least one opening of the solder alloy.

A brazing sheet brazing suitable for brazing performed in an inert gas atmosphere or in a vacuum without using a flux has a three-layer composition. An aluminum alloy core material contains Mg: 1.3 mass % or less. An aluminum alloy intermediate material is layered on the core material and contains Mg: 0.40-6.0 mass %. An aluminum alloy filler material is layered on the intermediate material and contains Si: 6.0-13.0 mass %, Bi: 0.0040-0.070 mass %, and Mg: 0.050-0.10 mass %.

An embodiment is directed to a method of fabricating a multi-layer contact plate, comprising providing a layer stack with first, second and third conductive layers, inserting brazing material into holes first and/or second conductive layers of a layer stack, and brazing the layer stack after the inserting. Another embodiment is directed to a multi-layer contact plate, comprising a layer stack with first, second and third conductive layers, with at least one inter-layer connection including a brazed area where the second conductive layer is brazed to each of the first and third conductive layers, and where the first and third conductive layers are directly brazed to each other through a hole in the second conductive layer.

The invention relates to an insert brazed on a body of cutting tools (101), consisting of: a metal substrate (11), in the form of plates, having a surface for attachment to the tool body; a high-temperature, brazing, alloy layer (12); an intermediate layer; and a ceramic plate (14). The brazing alloy layer connects the metal substrate (11) of the ceramic plate (14) via the metal layer (13). A low-temperature brazing layer (1) connects the insert (1, 1) to the body of the tool (101).

Provided is a thinner CuNiSn based copper alloy foil that has a foil thickness of 0.1 mm or less, has improved solder wettability and improved solder adhesion strength, and can be suitably used as a conductive spring material for use in electronic device parts such as autofocus camera modules; a copper rolled product; an electronic device part; and an autofocus camera module. The CuNiSn based copper alloy foil according to one embodiment of the present invention has a foil thickness of 0.1 mm or less; and contains from 14% by mass to 22% by mass of Ni, from 4% by mass to 10% by mass of Sn, the balance being copper and inevitable impurities; and has a 60-degrees glossiness G60.sub.RD of from 200 to 600 on a surface as measured in a direction parallel to a rolling direction.

A process for producing an amorphous ductile brazing foil is provided. According to one example embodiment, the method includes providing a molten mass, and rapidly solidifying the molten mass on a moving cooling surface with a cooling speed of more than approximately 10.sup.5 C./sec to produce an amorphous ductile brazing foil. A process for joining two or more parts is also provided. The process includes inserting a brazing foil between two or more parts to be joined, wherein the parts to be joined have a higher melting temperature than that the brazing foil to form a solder joint and the brazing foil comprises an amorphous, ductile Ni-based brazing foil; heating the solder joint to a temperature above the liquidus temperature of the brazing foil to form a heated solder joint; and cooling the heated solder joint, thereby forming a brazed joint between the parts to be joined.

To provide a wound body of a sheet for sintering bonding with a base material that realizes a satisfactory operational efficiency in a process of producing a semiconductor device comprising sintering bonding portions of semiconductor chips and that also has both a satisfactory storage stability and a high storage efficiency. A wound body 1 according to the present invention has a form in which a sheet for sintering bonding with a base material X is wound around a winding core 2 into a roll shape, the sheet for sintering bonding with a base material X having a laminated structure comprising: a base material 11; and a sheet for sintering bonding 10, comprising an electrically conductive metal containing sinterable particle and a binder component.

Use of an aluminium composite material in a thermal joining method, said material consisting of at least one aluminium core alloy and at least one external brazing layer consisting of an aluminium brazing alloy provided on one or both sides of the aluminium core alloy, wherein the aluminium brazing layer has a pickled surface. Reduced costs and a lower environmental impact is achieved by using an aluminium composite material in which the pickled surface of the aluminium brazing layer had been pickled by pickling with an acid, aqueous pickling solution containing at least one mineral acid and at least one complex-forming agent or a complexing mineral acid, wherein the removal of material in the pickling is between 0.05 g/m.sup.2 and 6 g/m.sup.2, the aluminium composite material is used in a flux-free, thermal joining method, and the joining method is carried out in the presence of a protective gas.