A composite hard-surface material preparation method and a composite hard-surface material prepared thereby, the preparation method comprising: dispersedly fixing a plurality of cemented carbide sheets (2) to a surface of a metal substrate (1); and surfacing the cemented carbide sheets (2) and the metal substrate (1) with a solder (3) to obtain a composite hard-surface material, the solder (3) comprising nickel-based alloy powder, tungsten carbide particles and boron nitride powder. The solder (3) used in the preparation of the composite hard-surface material comprises nickel-based alloy powder, tungsten carbide particles and boron nitride powder, wherein the nickel-based alloy powder can increase fluidity and corrosion resistance, the tungsten carbide particle can improve hardness, and the boron nitride powder can effectively reduce friction coefficient. The present solder has good fluidity, high hardness and good solderability, using said solder, the obtained composite hard-surface material may enjoy good wear resistance.

Provided is a preform solder including a first metal containing Sn and a second metal formed of an alloy containing Ni and Fe. Alternatively, provided is a preform solder (1) having a metal structure including a first phase (10) that is a continuous phase and a second phase (20) dispersed in the first phase (10), the first phase (10) contains Sn, the second phase (20) is formed of an alloy containing Ni and Fe, and a grain boundary (15) of a metal is present in the first phase (10).

A composite wear pad includes a substrate that is selected from the group of iron based alloys, steel, nickel based alloys, and cobalt based alloys. A hard particle-matrix alloy layer is bonded at a surface to the substrate. The hard particle-matrix alloy layer has a plurality of hard particles dispersed in a matrix alloy. The hard particle-matrix alloy layer has a thickness ranging between greater than about 13 millimeters and about 20 millimeters.

A solder preform in the shape of a solder tube or washer includes: a cylindrically shaped solder alloy body including an inner surface, an outer surface, a first end, a second end, a first opening located at the first end, and a second opening located at the second end, the second end interlocking with the first end, and the first opening and the second opening cut along an entire height of the solder alloy body; and a flux core embedded in the solder alloy body between the inner surface and the outer surface, the flux core including a thermochromic indicator. During reflow soldering, the flux core including the thermochromic indicator flows out of the first opening of the first end and the second opening of the second end to coat the inner surface of the solder alloy body and the outer surface of the solder alloy body.

Provided is a solder transfer sheet which is capable of increasing the amount of solder to be transferred without the occurrence of bridging. A solder transfer sheet 1A includes a base material 5, an adhesive layer 4 formed on the surface of the base material 5, a solder powder-containing adhesive layer 3 formed on the surface of the adhesive layer 4, and a solder powder layer 2 formed on the surface of the solder powder-containing adhesive layer 3. In the solder powder layer 2, particles of solder powder 20 are arranged in a one-layer sheet form. In the solder powder-containing adhesive layer 3, solder powder 30 and an adhesive component 31 are mixed so as to have such a thickness that two or more layers of the solder powder 30 are stacked.

A method for the additive manufacturing of an object and a system for manufacturing an object. The method includes depositing a first foil layer, the first foil layer including a first body section, a first support section connected to the first body section, and a second support section connected to the first body section; depositing a second foil layer, the second foil layer comprising a second body section, a third support section, and a fourth support section; aligning the second foil layer and the first foil layer; and applying at least one of heat and pressure to the first foil layer and the second foil layer to form the object comprising the first body section and the second body section.

A solder alloy includes 1.1% by mass or more and 8% by mass or less of Cu; 6% by mass or more and 20% by mass or less of Sb; 0.01% by mass or more and 0.5% by mass or less of Ni; and 0.001% by mass or more and 1% by mass or less of Co; a balance being Sn. An amount of Cu (% by mass) and an amount of Ni (% by mass) satisfies following formula: the amount of Ni/(the amount of Cu+the amount of Ni)<0.10.

Provided is a solder material having oxidation resistance at the time of melting solder or after melting it, as well as managing a thickness of oxide film at a fixed value or less before melting the solder. A Cu core ball 1A is provided with a Cu ball 2A for keeping a space between a semiconductor package and a printed circuit board and a solder layer 3A that covers the Cu ball 2A. The solder layer 3A is composed of Sn or a solder alloy whose main component is Sn. For the Cu core ball 1A, lightness is equal to or more than 65 in the L*a*b* color space and yellowness is equal to or less than 7.0 in the L*a*b* color space, and more preferably, the lightness is equal to or more than 70 and the yellowness thereof is equal to or less than 5.1.

An electrochemical cell is described, including an anodic chamber and a cathodic chamber separated by an electrolyte separator tube, all contained within a cell case. The cell also includes an electrically insulating ceramic collar positioned at an opening of the cathodic chamber, and defining an aperture in communication with the opening; along with a cathode current collector assembly; and at least one metallic ring that has a coefficient of thermal expansion (CTE) in the range of about 3 to about 7.5 ppm/° C., contacting at least a portion of a metallic component within the cell, and an adjacent ceramic component. An active braze alloy composition attaches and hermetically seals the ring to the metallic component and the collar. Sodium metal halide batteries that contain this type of cell are also described, along with methods for sealing structures within the cell.

An aluminum alloy brazing sheet exhibits excellent brazability by effectively weakening an oxide film formed on the surface of a filler metal. The aluminum alloy brazing sheet includes a core material and a filler metal, and is used to braze aluminum in an inert gas atmosphere or in vacuum, the core material including aluminum or an aluminum alloy, the filler metal including 6 to 13 mass % of Si, with the balance being Al and unavoidable impurities, and one side or each side of the core material being clad with the filler metal, wherein the core material is clad with the filler metal in a state in which a sheet material is interposed between the core material and the filler metal, the sheet material including one element, or two or more elements, among 0.05 mass % or more of Li, 0.05 mass % or more of Be, 0.05 mass % or more of Ba, and 0.05 mass % or more of Ca, with the balance being Al and unavoidable impurities.