Provided is a preform solder including a first metal containing Sn and a second metal formed of an alloy containing Ni and Fe. Alternatively, provided is a preform solder (1) having a metal structure including a first phase (10) that is a continuous phase and a second phase (20) dispersed in the first phase (10), the first phase (10) contains Sn, the second phase (20) is formed of an alloy containing Ni and Fe, and a grain boundary (15) of a metal is present in the first phase (10).

An aluminum alloy brazing sheet used for brazing in an inert gas atmosphere without using flux includes a core material of aluminum or aluminum alloy, and a brazing material of aluminum alloy including Si of 4.0 mass % to 13.0 mass % and cladding one side surface or both side surfaces of the core material. One or both of the core material and the brazing material includes any one or two or more types of X atoms (X is Mg, Li, Be, Ca, Ce, La, Y, and Zr). The aluminum alloy brazing sheet is a brazing sheet in which oxide particles including the X atoms and having a volume change ratio of 0.99 or lower with respect to an oxide film before brazing heating are formed on a surface thereof, by brazing heating.

A bonded body of the present invention includes a ceramic member formed of ceramics and a Cu member formed of Cu or a Cu alloy. In a bonding layer formed between the ceramic member and the Cu member, an area ratio of a Cu.sub.3P phase in a region extending by up to 50 μm toward the Cu member side from a bonding surface of the ceramic member is equal to or lower than 15%.

An aluminum alloy brazing sheet for a heat exchanger includes a three-layer material in which a brazing material layer, an intermediate layer, and a core material are cladded and stacked, the intermediate layer is formed of an aluminum alloy which can include Mn, Si, Fe, and Cu, with the balance being Al and inevitable impurities, the core material is formed of an aluminum alloy which can include Si, Fe, Cu, and Mn, with the balance being Al and inevitable impurities, and the brazing material layer is formed of an aluminum alloy including Si, with the balance being Al and inevitable impurities.

Provided is a solder-metal mesh composite material in which a lead-free solder layer formed of Sn—Cu—Ni-based lead-free solder contains metal mesh having high thermal conductivity, a void occupancy in a cross-section in a thickness direction is 15% or less, and the Sn—Cu—Ni-based lead-free solder contains 0.1 to 2% by weight of Cu, 0.002 to 1% by weight of Ni, and Sn as a remainder or contains 0.1 to 2% by weight of Cu, 0.002 to 1% by weight of Ni, 0.001 to 1% by weight of Ge, and Sn as a remainder.

Provided is a preformed solder including a lead-free solder mainly composed of Sn and a metal particle with a melting point higher than a melting point of the lead-free solder. The metal particle is formed of a Cu-Ni alloy having a Ni content of 0.1 to 90% by mass, or a Cu-Co alloy having a Co content of 0.1 to 90% by mass, and the lead-free solder may contain Ni when the metal particle is formed of the Cu-Ni alloy, or contains Ni when the metal particle is formed of the Cu-Co alloy, and (Cu,Ni) 6Sn5 is formed on a surface of the metal particle. With this preformed solder, a bonded portion having heat resistance, thermal conductivity, and reliability higher than ever can be formed.

A soldering method in which abrasive particles, in particular cubic boron nitride, are applied in a matrix composed of a solder material and are intended to have better adhesion in the matrix material. The particle which includes an abrasive particle, in particular of cubic boron nitride, is coated with a metal. A method for producing a layer on a substrate, wherein a solder material is applied as metallic matrix material such with particles, in particular solder material in the form of a soldering paste, a soldering tape, a solder powder, by an application method, in particular by a welding process or a thermal spraying process.

A ceramic-copper composite having a flat plate shape, including: a ceramic layer; a copper layer; and a brazing material layer present between the ceramic layer and the copper layer, in which a specified Expression (1) is satisfied in a cut surface of the copper layer obtained when the ceramic-copper composite is cut at a plane perpendicular to a main surface of the ceramic-copper composite, where S(102)% is an area ratio occupied by copper crystals having a crystal orientation of which an inclination from a crystal orientation of (102) plane is within 10°, S(101)% is an area ratio occupied by copper crystals having a crystal orientation of which an inclination from a crystal orientation of (101) plane is within 10°, S(111)% is an area ratio occupied by copper crystals having a crystal orientation of which an inclination from a crystal orientation of (111) plane is within 10°, and S(112)% is an area ratio occupied by copper crystals having a crystal orientation of which an inclination from a crystal orientation of (112) plane is within 10°.

An aluminum alloy brazing sheet used for brazing of an aluminum material in an inert gas atmosphere or in vacuum is formed of a two-layer material in which a brazing material and a core material are stacked in this order. The core material is formed of an aluminum alloy and has a grain size of 20 to 300 μm, and the aluminum alloy includes Mn of 0.50 to 2.00 mass %, Mg of 0.40 to 2.00 mass %, Si of 1.50 mass % or less, and Fe of 1.00 mass % or less. The brazing material is formed of an aluminum alloy including Si of 4.00 to 13.00 mass % and one or two or more of Mn of 2.00 mass or less, Ti of 0.30 mass % or less, Zr of 0.30 mass % or less, and Cr of 0.30 mass % or less.

The present invention has as its technical problem to prevent cracking when producing a steel sheet by ferritic stainless steel sheet and provide a ferritic stainless steel sheet excellent in toughness and a part using the same. To solve this technical problem, the present invention provides steel comprised of, by mass %, C: 0.001 to 0.030%, Si: 0.01 to 1.00%, Mn: 0.01 to 1.00%, P: 0.010 to 0.050%, S: 0.0002 to 0.0100%, Cr: 10.0 to 20.0%, N: 0.001 to 0.030%, Nb: 0.10 to 0.40%, B: 0.0002 to 0.0030%, Al: 0.005 to 0.100%, and a balance of Fe and unavoidable impurities in which the amount of solute Nb being less than or equal to a smaller value of 0.20 and (Nb content-0.08) mass %.