A lead-free solder has a heat resistance temperature which is high and a thermal conductive property which is not changed in a high temperature range. A semiconductor device includes a solder material containing more than 5.0% by mass and 10.0% by mass or less of Sb and 2.0 to 4.0% by mass of Ag, an element selected from the group consisting of: more than 0 and 1.0% by mass or less of Si, more than 0 and 0.1% by mass or less of V, 0.001 to 0.1% by mass of Ge, 0.001 to 0.1% by mass of P, and more than 0 and 1.2% by mass or less of Cu, and the remainder consisting of Sn and inevitable impurities. A bonding layer including the solder material, is formed between a semiconductor element and a substrate electrode or a lead frame.

A method for joining heat transfer plates, comprising: applying a melting depressant composition on individual application areas of a first metal sheet, each application area comprising a mid-section and two end-sections; pressing ridges and grooves in the metal sheet, the ridges extending in a direction that extends between the end-sections of the application areas, such that the application areas are located on top of the ridges; bringing the metal sheet into contact with a second, pressed metal sheet, such that contact points are formed where the mid-sections of the application areas re located; heating the sheets until melted metal is formed at the application areas where the melting depressant composition is applied; and allowing the melted metal to solidify such that a joint is obtained at the contact points.

A solder preform is provided, at least one surface of the solder preform (C) is provided with a plurality of protruding portions and/or recessing portions provided at a certain interval.

A method of repairing an airfoil is provided. The method includes providing an airfoil with a damaged section and removing the damaged section by machining or cutting an upper section of the airfoil. A replacement section is configured to mate with an upper surface of the airfoil. A presintered preform is provided to join the airfoil and the replacement sections through a resistance brazing process. The presintered preform is configured to mate with the upper surface of the airfoil and a lower surface of the replacement section and inserted between this upper surface and lower surface, creating a stacked airfoil comprising three mated sections in abutting contact. The stacked airfoil is resistance brazed such that only the braze material of the presintered preform melts and the upper surface of the airfoil and the lower surface of the replacement section remain below the grain boundary temperature of the material of the airfoil.

Processes for forming an electric heater comprise providing a heater element and a power supply, applying a layer of a diffusion solder paste onto the heater element and/or the power supply and drying the applied diffusion solder paste, arranging the heater element and the power supply such that the heater element and the power supply contact each other via the dried diffusion solder paste, and diffusion soldering the arrangement to form a connection between the heater element and the power supply. The diffusion solder paste comprises or consists of 10-30 wt.-% of at least one type of particles selected from the group consisting of copper particles, copper-rich copper/zinc alloy particles, and copper-rich copper/tin alloy particles, 60-80 wt.-% of at least one type of particles selected from tin particles, tin-rich tin/copper alloy particles, tin-rich tin/silver alloy particles, and tin-rich tin/copper/silver alloy particles, and 3-30 wt.-% of a solder flux.

The present invention relates to an Ni-based alloy which is excellent in terms of wear resistance and high-temperature corrosion resistance and which includes 0.3≤C≤1.0 mass %, 36.0≤Cr≤50.0 mass %, and 3.0≤Al≤7.0 mass %, with the balance being Ni and unavoidable impurities, and relates to an Ni-based alloy product made of the Ni-based alloy according to the present invention, and methods for producing the Ni-based alloy product.

Methods for welding a particle-matrix composite body to another body and repairing particle-matrix composite bodies are disclosed. Additionally, earth-boring tools having a joint that includes an overlapping root portion and a weld groove having a face portion with a first bevel portion and a second bevel portion are disclosed. In some embodiments, a particle-matrix bit body of an earth-boring tool may be repaired by removing a damaged portion, heating the particle-matrix composite bit body, and forming a built-up metallic structure thereon. In other embodiments, a particle-matrix composite body may be welded to a metallic body by forming a joint, heating the particle-matrix composite body, melting a metallic filler material forming a weld bead and cooling the welded particle-matrix composite body, metallic filler material and metallic body at a controlled rate.

A method of applying a braze component to a honeycomb structure may comprise: applying at least a partial vacuum within a chamber, the chamber defined at least partially by a vacuum device and a cover, the honeycomb structure disposed within the chamber, the braze component disposed between the honeycomb structure and the cover; pulling the cover towards the braze component in response to applying the partial vacuum; and pulling the braze component into a plurality of hexagonal cells defined by the honeycomb structure in response to pulling the cover towards the braze component.

The invention relates to a pretreatment process for a brazing composition that comprises metallic particles with a granulometry in the order of the micrometer or nanometer, one or several binders and one or several solvents, said process comprising: a desolvation step of the brazing composition, so as to obtain a desolvated brazing composition, then a compacting step of the desolvated brazing composition so as to obtain a preform of metallic particles, said preform being able to be used for the sintering of an electronic, photonic, thermal or mechanical component onto a substrate, the brazing composition being represented either by a brazing paste, or by a suspension of metallic or metallic oxalate grains in suspension in a solvent.

The sinter-bonding composition contains sinterable particles containing an electroconductive metal. The average particle diameter of the sinterable particles is 2 μm or less and the proportion of the particles having a particle diameter of 100 nm or less in the sinterable particles is not less than 80% by mass. The sinter-bonding sheet (10) has an adhesive layer made from such a sinter-bonding composition. The dicing tape with a sinter-bonding sheet (X) has such a sinter-bonding sheet (10) and a dicing tape (20). The dicing tape (20) has a lamination structure containing a base material (21) and an adhesive layer (22), and the sinter-bonding sheet (10) is positioned on the adhesive layer (22) of the dicing tape (20).