B23K35/0244

Lead-free solder alloy, solder joining material, electronic circuit mounting substrate, and electronic control device

A lead-free solder alloy includes 2.0% by mass or more and 4.0% by mass or less of Ag, 0.3% by mass or more and 0.7% by mass or less of Cu, 1.2% by mass or more and 2.0% by mass or less of Bi, 0.5% by mass or more and 2.1% by mass or less of In, 3.0% by mass or more and 4.0% by mass or less of Sb, 0.001% by mass or more and 0.05% by mass or less of Ni, 0.001% by mass or more and 0.01% by mass or less of Co, and the balance being Sn.

Heat exchanger and method of manufacturing the same

A method for manufacturing a heat exchanger (1) includes joining an inner fin (3) to a hollow structure (20) formed from at least two clad plates (200a, 200b) by heating and brazing a filler metal layer (B). Each clad plate has a core layer (A) composed of an aluminum alloy that contains Mg: 0.40-1.0 mass %. The filler metal layer is composed of an aluminum alloy that contains Si: 4.0-13.0 mass %, and further contains Li: 0.0040-0.10 mass %, Be: 0.0040-0.10 mass %, and/or Bi: 0.01-0.30 mass %. The inner fin is composed of an aluminum alloy that contains Si: 0.30-0.70 mass % and Mg: 0.35-0.80 mass %. A flux (F) that contains cesium (Cs) is applied along a contact part (201), and the vicinity thereof, of the at least two clad plates prior to the heating. A heat exchanger (1) may be manufactured according to this method.

FLUX-COATED BALL AND METHOD FOR MANUFACTURING SAME

The present invention employs a flux-coated ball 100 having a core part 110 and a shell part 120 with which the core part 110 is coated. The flux-coated ball 100 is characterized in that the core part 110 is made of a solder ball or a copper core ball, that the shell part 120 is made of a flux layer containing at least one selected from the group consisting of an activator and a resin component, and that an oxide film thickness in the flux-coated ball 100 is 3 nm or less.

METHOD FOR SOLDERING HEATING ELEMENTS TO CREATE AN ELECTRIC HEATING DEVICE OR A HEATING SOURCE; CORRESPONDING ELECTRIC HEATING DEVICE

A method for creating an electric heating source, including a body equipped with one or more housings containing mineral-insulated heating cables. The housings communicate with one or more reservoirs which accept a purely metallic solder material in solid, powder or sheet form. The device is heated in a vacuum degassing plateau, followed by a casting plateau during which the solder melts and fills the housing around the heating cables, resulting in full metal contact between the cables and the body, providing a more uniform temperature and a shorter response time to heating or cooling. Also, a heating source obtained in this manner, including an infrared faired source or an immersion heater for the heating of a liquid bath of molten metal.

SOLDER PASTES AND METHODS OF USING THE SAME
20230241725 · 2023-08-03 ·

Solder pastes comprise a high temperature solder powder, a low temperature solder powder and flux. The melting temperature of the low temperature solder powder is lower than that of the high temperature solder powder. The high temperature solder powder and the low temperature solder powder are both capable of wetting upon heating.

SOLDER AND ELECTRONIC COMPONENT
20230302583 · 2023-09-28 · ·

A solder includes a Sn alloy phase and a particle. The particle has a higher Young's modulus than the Sn alloy phase. The particle has a lower linear expansion coefficient than the Sn alloy phase. An electronic component includes a metal terminal joined thereto with the solder.

METHOD FOR PRODUCING BONDED OBJECT AND SEMICONDUCTOR DEVICE AND COPPER BONDING PASTE

An embodiment of the present invention provides a method for producing a bonded object. The method comprises a step for preparing a laminate in which a first member, a copper bonding paste, and a second member are laminated in order and a step for sintering the copper bonding paste under a pressure of 0.1-1 MPa. The copper bonding paste contains metal particles and a dispersion medium, wherein the content of metal particles is at 50 mass % or more with respect to the total mass of the copper bonding paste, and the metal particles contain 95 mass % or more of submicro copper particles with respect to the total mass of the metal particles.

DISC CUTTER FOR TUNNEL BORING MACHINES AND A METHOD OF MANUFACTURE THEREOF

A disc cutter for a cutting unit used in a tunnel boring machine and a method of producing the same. The disc cutter includes an annular disc body made of a metal alloy or metal matrix composite having a first side, a second side arranged substantially opposite to the first side and a radially peripheral part. At least one metal alloy, metal matrix composite or cemented carbide cutting part is mounted in and substantially encircling the radially peripheral part of the disc body, which protrudes outwardly therefrom to engage with the rock during the mining operation. The at least one cutting part is made from a material having a higher wear resistance than the material used for the disc body. A metallic interlayer is disposed between at the least one disc body and the at least one cutting part, the elements of which form the diffusion bonds.

Method of manufacturing turbine airfoil and tip component thereof using ceramic core with witness feature

Methods of manufacturing or repairing a turbine blade or vane are described. The airfoil portions of these turbine components are typically manufactured by casting in a ceramic mold, and a surface made up of the cast airfoil and at the least the ceramic core serves as a build surface for a subsequent process of additively manufacturing the tip portions. The build surface is created by removing a top portion of the airfoil and the core, or by placing an ultra-thin shim on top of the airfoil and the core. The overhang projected by the shim is subsequently removed. These methods are not limited to turbine engine applications, but can be applied to any metallic object that can benefit from casting and additive manufacturing processes. The present disclosure also relates to finished and intermediate products prepared by these methods.

Conductive pathways within a wellbore using no-heat liquid solder

A conductive path can be formed using metal material coated with a layer that is controllably activated to release the metal material downhole in the wellbore. The conductive path can be used to communicate signals or power downhole in the wellbore.