A method for producing a hardened wear plate to be used in mining or agricultural operations for transporting raw materials. The hardened wear plate is produced by providing a metal plate, overlaying a metal deposit, overlaying a flux, submerging a power head through the metal deposit and flux, and then arc-welding the arrangement to form a hardened wear plate. The hardened wear plate has a smooth, patternless surface with surface features resulting in the plate being resistant to abrasion and having few stress points making it less vulnerable to fracture or failure when in use.

Systems and methods for low-manganese welding alloys are disclosed. An example arc welding consumable may comprise: between 0.4 and 1.0 wt% manganese; strengthening agents selected from the group consisting of nickel, cobalt, copper, carbon, molybdenum, chromium, vanadium, silicon, and boron; and grain control agents selected from the group consisting of niobium, tantalum, titanium, zirconium, and boron. The grain control agents may comprise greater than 0.06 wt% and less than 0.6 wt% of the welding consumable. The resulting weld deposit may comprise a tensile strength greater than or equal to 70 ksi, a yield strength greater than or equal to 58 ksi, a ductility (as measured by percent elongation) of at least 22%, and a Charpy V-notch toughness greater than or equal to 20 ft-lbs at -20° F. The welding consumable may provide a manganese fume generation rate less than 0.01 grams per minute during the arc welding operation.

Disclosed is a method for producing a high-temperature-resistant, lead-free solder joint between a circuit board and a part, wherein a lead-free solder preform is used that has a composite material having a first composite component arranged substantially in layers and wherein the part is soldered with the solder preform in a hot-bar selective soldering process. Also disclosed is a high-temperature-resistant, lead-free solder joint and a field device of automation technology for determining and/or monitoring the process variable of a medium with a high-temperature-resistant, lead-free solder joint.

Provided is a preform solder including a first metal containing Sn and a second metal formed of an alloy containing Ni and Fe. Alternatively, provided is a preform solder (1) having a metal structure including a first phase (10) that is a continuous phase and a second phase (20) dispersed in the first phase (10), the first phase (10) contains Sn, the second phase (20) is formed of an alloy containing Ni and Fe, and a grain boundary (15) of a metal is present in the first phase (10).

A method for forming a connection between two connection partners includes: forming a pre-connection layer on a first surface of a first connection partner, the pre-connection layer including a certain amount of liquid; performing a pre-connection process, thereby removing liquid from the pre-connection layer; performing photometric measurements while performing the pre-connection process, wherein performing the photometric measurements includes determining at least one photometric parameter of the pre-connection layer, wherein the at least one photometric parameter changes depending on the fluid content of the pre-connection layer; and constantly evaluating the at least one photometric parameter, wherein the pre-connection process is terminated when the at least one photometric parameter is detected to be within a desired range.

A system and method are presented for producing solder paste having undercooled metallic core-shell particles. In one or more arrangements, the system includes a reconstitution assembly, a dispenser assembly, and a mixer, among other components. The reconstitution assembly is configured to place the cores of the solid core metallic core-shell particles into an undercooled liquid state to form a plurality of undercooled metallic core-shell particles. The dispenser assembly is configured to dispense one or more of a set of available flux components. The mixer assembly is configured to mix the one or more of the set of flux components dispensed by the dispenser assembly with the plurality of undercooled metallic core-shell particles formed by the reconstitution assembly to form a solder paste.

A suppressor having a body and a first connector half coupled to the body, wherein the first connector half includes a first component that includes at least one channel and a first surface; and wherein the body provides a second surface, wherein a gap between the first surface and the second surface defines at least one track; wherein the gun includes a second connector half comprising at least one protrusion, wherein the protrusion and channel have corresponding shapes that allow the protrusion to be inserted through the channel and into alignment with the track, wherein the first component may be rotated with respect to the protrusion and the body to bring the protrusion out of alignment with the channel so that the first and second surfaces clamp the protrusion to thereby secure the first connector half and second connector half with respect to each other.

A lead-free silver-free solder alloy may comprise tin, copper, bismuth, cobalt, and antimony. Alternatively, the alloy may comprise gallium in lieu of cobalt. The alloy may further comprise nickel, germanium, or both. The copper may be present in an amount from about 0.5% to 0.9% by weight of the solder. The bismuth may be present in an amount from about 1.0% to about 3.5% by weight of the solder. The cobalt may be present in an amount from about 0.02% to about 0.08% by weight of the solder. Where gallium is used in lieu of cobalt, the gallium may be present in an amount from about 0.2% to about 0.8% by weight of the solder. The antimony may be present in an amount between about 0.0% to about 0.09% by weight of the solder. The balance of the solder is tin.

A bonded body includes a first bonded member, a second bonded member, and a bonding material. The bonding material is located between the first bonded member and the second bonded member. The bonding material includes fine copper particles having an average particle diameter of 300 nm or less; coarse copper particles having an average particle diameter of 3 μm or more and 11 μm or less; and a reducing agent which reduces the fine copper particles and the coarse copper particles.

A method for producing a bonding material having a plate shape or a sheet shape includes a mixture producing step in which fine copper particles having an average particle diameter of 300 nm or less, coarse copper particles having an average particle diameter of 3 μm or more and 11 μm or less, and a reducing agent which reduces the fine copper particles and the coarse copper particles are mixed to produce a mixture: and a molding step in which the mixture is formed in a plate shape or a sheet shape.