A system for creating a braze joint within a component. The system includes an environment operable to reach a braze temperature sufficient to melt at least a portion of a braze material. The system also includes a component within the environment, the component including a base having a base surface, a recess depending from the base surface into the base to an inner edge, and a braze material within the recess and forming a cap above the base surface. The braze material fills the recess from the cap to the inner edge. The cap has an exposed braze surface. The system also includes an insulation layer that at least partially covers the exposed braze surface.

A welding system includes a welding power source configured to provide pulsed electropositive direct current (DCEP), a gas supply system configured to provide a shielding gas flow that is at least 90% argon (Ar), a welding wire feeder configured to provide tubular welding wire. The DCEP, the tubular welding wire, and the shielding gas flow are combined to form a weld deposit on a zinc-coated workpiece, wherein less than approximately 10 wt % of the tubular welding wire is converted to spatter while forming the weld deposit on the zinc-coated workpiece.

To provide a wound body of a sheet for sintering bonding with a base material that realizes a satisfactory operational efficiency in a process of producing a semiconductor device comprising sintering bonding portions of semiconductor chips and that also has both a satisfactory storage stability and a high storage efficiency. A wound body 1 according to the present invention has a form in which a sheet for sintering bonding with a base material X is wound around a winding core 2 into a roll shape, the sheet for sintering bonding with a base material X having a laminated structure comprising: a base material 11; and a sheet for sintering bonding 10, comprising an electrically conductive metal containing sinterable particle and a binder component.

A method for producing an additively manufactured, graded composite transition joint (AM-GCTJ) includes preparing a grating or lattice pattern from a first alloy A; the grating or lattice pattern includes pores in the grating or lattice patterns. The grating pattern is built from a first end to a second end being denser on the first end than on second end, and gradually reduces density by increasing the pore size and/or reducing density of the grating or lattice pattern; adding a second alloy B powder to the second end of grating or lattice pattern. The second alloy B powder is filled towards the first end. A composite is formed of first alloy A and second alloy B powder in the AM-GCTJ. The composite is subjected to hot isotropic pressing (HIP) to densify the composite. The second alloy B is graduated from the first end to the second end O of AM-GCTJ.

A solder material may include nickel and tin. The nickel may include first and second amounts of particles. A sum of the particle amounts is a total amount of nickel or less. The first amount is between 5 at % and 60 at % of the total amount of nickel. The second amount is between 10 at % and 95 at % of the total amount of nickel. The particles of the first amount have a first size distribution, the particles of the second amount have a second size distribution, 30% to 70% of the first amount have a particle size in a range of about 5 μm around a particle size the highest number of particles have according to the first size distribution, and 30% to 70% of the second amount have a particle size in a range of about 5 μm around a particle size the highest number of particles have according to the second size distribution.

Systems and methods for the manufacture of a solid wire using additive manufacturing techniques are disclosed. In one embodiment, a fine powdery material is sintered or melted or soldered or metallurgically bonded onto a metal strip substrate in a compacted solid form or a near-net shape (e.g., a near-net solid wire shape) before being turned into a final product through forming or drawing dies.

Described herein are compositions for use in the brazing of metal substrates. Methods of making and using these compositions are also described herein.

A solder paste includes a first solder alloy powder in an amount ranging from 30% to 95% by weight. The first solder alloy powder includes a first solder alloy with a solidus temperature of 200° C. to 260° C. The first solder alloy includes an Sn—Cu alloy or an Sn—Cu—Ag alloy. The solder paste further includes a second solder alloy powder in an amount ranging from 5% to 70% by weight, and a solder flux. The second solder alloy powder includes a second solder alloy with a solidus temperature below 250° C. The solder paste has a variable melting point. In multiple reflow soldering, a remelting of the solder paste is inhibited under different temperature conditions so that no functional failure occurs during assembly and/or packaging of PCBs or electronic devices due to melting of solder.

There is provided a bonding material which forms a bonding portion between two objects, which material contains (1) first metal particles comprising a first metal and having a median particle diameter in the range of 20 nm to 1 μm, and (2) second metal particles comprising, as a second metal, at least one alloy of Sn and at least one selected from Bi, In and Zn and having a melting point of not higher than 200° C.

Ni—Mn—Si based braze filler alloys or metals which may be nickel-rich, manganese-rich, or silicon-rich braze filler alloys, have unexpectedly narrow melting temperature ranges, low solidus and low liquidus temperatures, as determined by Differential Scanning calorimetry (DSC), while exhibiting good wetting, and spreading, without deleterious significant boride formation into the base metal, and can be brazed at lower temperatures. The nickel rich alloys contain 58 wt % to 70 wt % nickel, the manganese-rich alloys contain 55 wt % to 62 wt % manganese, and the silicon-rich alloys contain 25 wt % to 29 wt % silicon. Copper with or without boron to partly replace nickel may be employed without any substantial increase of the melting point, or to reduce the melting point. The braze filler alloys have sufficient brazability to withstand high temperature conditions for thin-walled aeronautical and other heat exchangers.