A solder material is provided. The solder material may include a first amount of particles having particle sizes forming a first size distribution, a second amount of particles having particle sizes forming a second size distribution, the particle sizes of the second size distribution being larger than the particle sizes of the first size distribution, and a solder base material in which the first amount of particles and the second amount of particles is distributed. The first amount of particles and the second amount of particles consist of or essentially consist of a metal of a first group of metals. The first group of metals includes copper, silver, gold, palladium, platinum, iron, cobalt, and aluminum. The solder base material includes a metal of a second group of metals. The second group of metals includes tin, indium, zinc, gallium, germanium, antimony, and bismuth.

One object of the present invention is to provide a bonding material capable of forming a highly reliable bond, the present invention provides a bonding material having a plate shape or a sheet shape, wherein the bonding material includes: fine copper particles having an average particle diameter of 300 nm or less; coarse copper particles having an average particle diameter of 3 .Math.m or more and 11 .Math.m or less; and a reducing agent which reduces the fine copper particles and the coarse copper particles.

The present invention relates to a method for reducing or completely closing an opening of an inner contour 2 of a workpiece by means of a material melted by a laser deposition welding device 7, comprising the following steps: providing a workpiece 1 with an inner contour 2 having an opening defined by an edge section 11, forming a plurality of base webs 41 from molten material by laser deposition welding by starting at the edge section 11 of the inner contour 2 of the workpiece in such a way that the formed base webs 41 protrude from the edge section 11 at a predetermined angle, connecting adjacent base webs 41 by forming connecting webs 42 from molten material by laser deposition welding in such a way that a support structure 4 which comprises base webs 41 and connecting webs 42 is formed, forming a cover layer 5 of molten material connected to the support structure 4 in such a way that the opening of the inner contour 2 is reduced or completely closed.

The present invention relates to a method for manufacturing composite solder balls that are metallized on the surface and calibrated, these balls comprising a core consisting of a spherical support particle of diameter Do made of expanded polystyrene and having an intergranular porosity of at least 50%, and a shell covering said support particle and formed by a plurality of metallic surface layers. The present invention also relates to balls that can be obtained by the method according to the invention, as well as to the use thereof for the assembly of electronic boards.

A solder alloy has an alloy composition consisting of, in mass %, Cu: 0.1% to 2.0%, Ni: 0.01% to 0.4%, P: 0.001% to 0.08%, and Ge: 0.001% to 0.08%, with the balance being Sn. The alloy composition satisfies the following relations (1) to (3): (Cu+5Ni)≤0.945% (relation (1)), (P+Ge)≤0.15% (relation (2)), 2.0≤(Cu+5Ni)/(P+Ge)≤1000 (relation (3)). In the above relations (1) to (3), Cu, Ni, P, and Ge each represents a content (mass %) thereof in the solder alloy.

A ceramic circuit substrate having high bonding performance and excellent thermal cycling resistance properties, having a circuit pattern provided on a ceramic substrate with a braze material layer interposed therebetween, and a protruding portion formed by the braze material layer protruding from the outer edge of the circuit pattern, wherein: the braze material layer includes Ag, Cu, Ti, and Sn or In; and an Ag-rich phase is formed continuously for 300 μm or more, towards the inside, from an outer edge of the protruding portion, along a bonding interface between the ceramic substrate and the circuit pattern, and has a bonding void ratio of 1.0% or less.

A brazing material for brazing a brazed plate heat exchanger comprising a number of heat exchanger plates being provided with a pressed pattern of ridges and grooves adapted to provide contact points between neighbouring heat exchanger plates, such that the heat exchanger plates are kept on a distance from one another and such that interplate flow channels for media to exchange heat are formed between the heat exchanger plates comprises a brazing alloy comprising at least one melting point depressing element and metals resembling the composition of the heat exchanger plates. The brazing material comprises a mixture between grains of a melting brazing material having solidus and liquidus temperatures lower than a brazing temperature and a non-melting brazing material having solidus and liquidus temperatures above the brazing temperature. The ratio between the melting and non-melting brazing materials is such that an alloy formed by the melting and non-melting brazing materials has a solidus temperature lower than the brazing temperature and a liquidus temperature higher than the brazing temperature.

A layer structure includes a first layer including at least one material selected from a first group consisting of nickel, copper, gold, silver, palladium, tin, zinc, platinum, and an alloy of any of these materials; a third layer including at least one material selected from a second group consisting of nickel, copper, gold, palladium, tin, silver, zinc, platinum, and an alloy of any of these materials; and a second layer between the first layer and the third layer. The second layer consists of or essentially consists of nickel and tin. The second layer includes an intermetallic phase of nickel and tin.

A bonding sheet (X) of the present invention includes a matrix resin, a plurality of solder particles, and a plurality of flux particles, and has a sheet thickness T. In the bonding sheet (X), a particle size D.sub.50 of the solder particles is 12 μm or less, a particle size D.sub.50 of the flux particles is 30 μm or less, and a ratio of a particle size D.sub.90 of the solder particles and a particle size D.sub.90 of the flux particles to the sheet thickness T is 0.95 or less.

Provided are a solder alloy, a solder ball, and a solder joint which have an excellent pin contact performance and a high bonding strength. The solder alloy has an alloy composition consisting of, by mass %, Ag: 0.8 to 1.5%, Cu: 0.1 to 1.0%, Ni: 0.01 to 0.10%, and P: 0.006% to 0.009%, with the balance being Sn. The alloy composition preferably satisfies the following relations (1) and (2): 2.0≤Ag×Cu×Ni/P≤25, 0.500≤Sn×P≤0.778. Ag, Cu, Ni, P, and Sn in the relations (1) and (2) each represent the contents (mass %) in the alloy composition.