A valve seat formed within an aluminum engine component includes a valve seat surface machined within the aluminum engine component, a layer of copper alloy material laser clad onto the valve seat surface of the aluminum engine component, the layer of copper alloy material having a thickness of less than 2.0 millimeters, and a layer of copper alloy/tool steel carbide material laser clad onto the layer of copper alloy material, the layer of copper alloy/tool steel carbide material having an average thickness of less than 0.5 millimeters, wherein the layer of copper alloy/tool steel carbide material has an outer surface that is machined to a final valve seat profile.

A solder material for use in electronic assembly, the solder material comprising: solder layers; and a core layer comprising a core material, the core layer being sandwiched between the solder layers, wherein: the thermal conductivity of the core material is greater than the thermal conductivity of the solder.

A steel sheet for the manufacture of a press hardened part is provided, having a composition of: 0.15%≤C≤0.22%, 3.5%≤Mn<4.2%, 0.001%≤Si≤1.5%, 0.020%≤Al≤0.9%, 0.001%≤Cr≤1%, 0.001%≤Mo≤0.3%, 0.001%≤Ti≤0.040%, 0.0003%≤B≤0.004%, 0.001%≤Nb≤0.060%, 0.001%≤N≤0.009%, 0.0005%≤S≤0.003%, 0.001%≤P≤0.020%. A microstructure has less than 50% ferrite, 1% to 20% retained austenite, cementite, such that the surface density of cementite particles larger than 60 nm is lower than 10{circumflex over ( )}7/mm.sup.2, and a complement of bainite and/or martensite, the retained austenite having an average Mn content of at least 1.1*Mn %. Press-hardened steel part obtained by hot forming the steel sheet, and manufacturing methods thereof.

Provided is an austenitic stainless steel weld joint that is excellent in polythionic acid SCC resistance and naphthenic acid corrosion resistance, and is also excellent in creep ductility. An austenitic stainless steel weld joint includes a base material and a weld metal. The weld metal has a chemical composition at its width-center position and at its thickness-center position consisting of, in mass %, C: 0.050% or less, Si: 0.01 to 1.00%, Mn: 0.01 to 3.00%, P: 0.030% or less, S: 0.015% or less, Cr: 15.0 to 25.0%, Ni: 20.0 to 70.0%, Mo: 1.30 to 10.00%, Nb: 0.05 to 3.00%, N: 0.150% or less, and B: 0.0050% or less, with the balance: Fe and impurities.

The present invention relates to new brazing alloys containing copper, silver, zinc, manganese, and indium, and a method for their production and their use.

A composite hard-surface material preparation method and a composite hard-surface material prepared thereby, the preparation method comprising: dispersedly fixing a plurality of cemented carbide sheets (2) to a surface of a metal substrate (1); and surfacing the cemented carbide sheets (2) and the metal substrate (1) with a solder (3) to obtain a composite hard-surface material, the solder (3) comprising nickel-based alloy powder, tungsten carbide particles and boron nitride powder. The solder (3) used in the preparation of the composite hard-surface material comprises nickel-based alloy powder, tungsten carbide particles and boron nitride powder, wherein the nickel-based alloy powder can increase fluidity and corrosion resistance, the tungsten carbide particle can improve hardness, and the boron nitride powder can effectively reduce friction coefficient. The present solder has good fluidity, high hardness and good solderability, using said solder, the obtained composite hard-surface material may enjoy good wear resistance.

A composite hard-surface material preparation method and a composite hard-surface material prepared thereby, the preparation method comprising: dispersedly fixing a plurality of cemented carbide sheets (2) to a surface of a metal substrate (1); and surfacing the cemented carbide sheets (2) and the metal substrate (1) with a solder (3) to obtain a composite hard-surface material, the solder (3) comprising nickel-based alloy powder, tungsten carbide particles and boron nitride powder. The solder (3) used in the preparation of the composite hard-surface material comprises nickel-based alloy powder, tungsten carbide particles and boron nitride powder, wherein the nickel-based alloy powder can increase fluidity and corrosion resistance, the tungsten carbide particle can improve hardness, and the boron nitride powder can effectively reduce friction coefficient. The present solder has good fluidity, high hardness and good solderability, using said solder, the obtained composite hard-surface material may enjoy good wear resistance.

The preparation and use of particulate metallic solder alloy having particles of a single chemical composition is described. The particles of the particulate metallic solder alloy have a bimodal size distribution in which particles in a smaller size range have a largest dimension that is smaller than a smallest dimension of particles in a larger size range of the bimodal distribution. In some examples the particles in the smaller size mode have dimensions in the range of 1 to 100 nm. In some examples, the particles in the larger size mode have dimensions in the range of 2 to 75 microns in dimension. In some examples, a halogen-free flux is used. In some examples, a solvent is used to make a paste.

A method of hardfacing a metal component includes welding a surface area of the metal component using a Cold Metal Transfer (CMT) process. The method of hardfacing the metal component includes performing the CMT welding process in a weaving pattern over the surface area of the component. A consumable, low carbon steel wire electrode is used in the CMT process.

Provided is a preform solder including a first metal containing Sn and a second metal formed of an alloy containing Ni and Fe. Alternatively, provided is a preform solder (1) having a metal structure including a first phase (10) that is a continuous phase and a second phase (20) dispersed in the first phase (10), the first phase (10) contains Sn, the second phase (20) is formed of an alloy containing Ni and Fe, and a grain boundary (15) of a metal is present in the first phase (10).