Patent classifications
B23K35/30
Welding device and welding method
A welding system includes a welding torch that welds a workpiece by using a wire, a suction device that sucks shielding gas, and a sucked shielding gas supply path for allowing the sucked shielding gas to flow, wherein the welding torch includes a contact chip that guides the wire, a shielding gas supply nozzle that supplies the shielding gas to a weld zone, and a suction nozzle that surrounds a periphery of the wire protruding from the contact chip, and is opened toward a tip of the wire to suck the shielding gas.
Bonded structure and bonding material
There is provided a bonding material which forms a bonding portion between two objects, which material contains (1) first metal particles comprising a first metal and having a median particle diameter in the range of 20 nm to 1 μm, and (2) second metal particles comprising, as a second metal, at least one alloy of Sn and at least one selected from Bi, In and Zn and having a melting point of not higher than 200° C.
Multi component solid solution high-entropy alloys
A multi-material component joined by a high entropy alloy is provided, as well as methods of making a multi-material component by joining dissimilar materials with high entropy alloys.
Multi component solid solution high-entropy alloys
A multi-material component joined by a high entropy alloy is provided, as well as methods of making a multi-material component by joining dissimilar materials with high entropy alloys.
SINTERING COMPOSITION
A sintering composition, consisting essentially of: a solvent; and a metal complex dissolved in the solvent, wherein: the sintering composition contains at least 60 wt. % of the metal complex, based on the total weight of the sintering composition; and the sintering composition contains at least 20 wt. % of the metal of the metal complex, based on the total weight of the sintering composition.
WIRE ROD FOR WELDING RODS AND METHOD FOR MANUFACTURING SAME
The purpose of the present invention is to provide, as a wire rod suitable for use as a substance for welding materials and, in particular, for welding rods, a wire rod for welding rods, having high tensile strength at room temperature and excellent drawing characteristics, and a manufacturing method therefor.
LOW MELTING NICKEL-MANGANESE-SILICON BASED BRAZE FILLER METALS FOR HEAT EXCHANGER APPLICATIONS
Ni—Mn—Si based braze filler alloys or metals which may be nickel-rich, manganese-rich, or silicon-rich braze filler alloys, have unexpectedly narrow melting temperature ranges, low solidus and low liquidus temperatures, as determined by Differential Scanning calorimetry (DSC), while exhibiting good wetting, and spreading, without deleterious significant boride formation into the base metal, and can be brazed at lower temperatures. The nickel rich alloys contain 58 wt % to 70 wt % nickel, the manganese-rich alloys contain 55 wt % to 62 wt % manganese, and the silicon-rich alloys contain 25 wt % to 29 wt % silicon. Copper with or without boron to partly replace nickel may be employed without any substantial increase of the melting point, or to reduce the melting point. The braze filler alloys have sufficient brazability to withstand high temperature conditions for thin-walled aeronautical and other heat exchangers.
Manufacturing method for hard-to-weld materials
A method of manufacturing a hard-to-weld material by a beam-assisted additive manufacturing process is presented. The method includes depositing a first layer for the material onto the substrate, the first layer including a major fraction of a base material for the component and a minor fraction of a solder, depositing a second layer of the base material for the component and a thermal treatment of the layer arrangement. The thermal treatment includes a first thermal cycle at a first temperature above 1200° C. for a duration of more than 3 hours, a subsequent second thermal cycle at a second temperature above 1000° C. for more than 2 hours, and a subsequent third thermal cycle and a third temperature above 700° C. for more than 12 hours. A manufactured component is also presented.
METAL JOINTED BODY, SEMICONDUCTOR DEVICE, WAVE GUIDE TUBE, AND METHOD FOR JOINING MEMBERS TO BE JOINED
Provided is a metal jointed body, joined by solid-phase joining in the atmosphere, in which no protrusion of molten joining material occurs, that improves dimensional stability. A metal jointed body is formed by (A) making Ag films of two metal laminated bodies opposed to each other, the metal jointed body being configured by sequentially laminating a Zn film and an Ag film on an Al substrate serving as a member to be joined, and (B) bringing the Ag films into contact with each other, then (C) heating is performed while pressurizing, and closely adhering and solid-phase joining the Ag films to each other. The completed metal jointed body is a portion where Al—Ag alloy layers are provided on both sides of an Ag—Zn—Al alloy layer to join the Al substrates to each other.
Method for producing a metal-ceramic substrate, solder system, and metal-ceramic substrate produced using such a method
A method for manufacturing a metal-ceramic substrate (1) includes providing a ceramic layer (10), a metal layer (20) and a solder layer (30) coating the ceramic layer (10) and/or the metal layer (20) and/or the solder layer (30) with an active metal layer (40), arranging the solder layer (30) between the ceramic layer (10) and the metal layer (20) along a stacking direction (S), forming a solder system (35) comprising the solder layer and the active metal layer (40), wherein a solder material of the solder layer (30) is free of a melting point lowering material and bonding the metal layer (20) to the ceramic layer (10) via the solder system (35) by means of an active solder process.