The present invention provides a pressure detection unit and a pressure sensor using the same that have a high degree of airtightness and that are capable of suppressing bonding defects even when the base is made of ceramics. In the pressure detection unit, a linear expansion coefficient of ceramic that forms the ceramic base 110 is set to 1 (10.sup.6/K) and a linear expansion coefficient of metal that forms the metal ring member 140 is set to 2 (10.sup.6/K), a relationship of 0.721 exists between the linear expansion coefficients 1 and 2, and the metal ring member 140 is formed of a metal such as SUS420J2, SUS410, or SUS444, for example, which does not precipitate aluminum oxide on a brazing surface with a projecting portion.

The present invention provides a pressure detection unit and a pressure sensor using the same that have a high degree of airtightness and that are capable of suppressing bonding defects even when the base is made of ceramics. In the pressure detection unit, a linear expansion coefficient of ceramic that forms the ceramic base 110 is set to 1 (10.sup.6/K) and a linear expansion coefficient of metal that forms the metal ring member 140 is set to 2 (10.sup.6/K), a relationship of 0.721 exists between the linear expansion coefficients 1 and 2, and the metal ring member 140 is formed of a metal such as SUS420J2, SUS410, or SUS444, for example, which does not precipitate aluminum oxide on a brazing surface with a projecting portion.

A display device is provided. The display device includes a substrate and a first metal line and a second metal line disposed on the substrate. The display device includes a first pad and a second pad disposed on the substrate and electrically connected to the first metal line and the second metal line respectively. The display device further includes an electronic device disposed on the first pad and the second pad. The electronic device includes a first connecting post and a second connecting post, wherein a distance between the first connecting post and the second connecting post is in a range from 1 um to 200 um. A portion of the first connecting post is embedded in the first pad and a portion of the second connecting post is embedded in the second pad.

Methods for welding a particle-matrix composite body to another body and repairing particle-matrix composite bodies are disclosed. Additionally, earth-boring tools having a joint that includes an overlapping root portion and a weld groove having a face portion with a first bevel portion and a second bevel portion are disclosed. In some embodiments, a particle-matrix bit body of an earth-boring tool may be repaired by removing a damaged portion, heating the particle-matrix composite bit body, and forming a built-up metallic structure thereon. In other embodiments, a particle-matrix composite body may be welded to a metallic body by forming a joint, heating the particle-matrix composite body, melting a metallic filler material forming a weld bead and cooling the welded particle-matrix composite body, metallic filler material and metallic body at a controlled rate.

A method for low heat welding includes providing short circuit pulse Metal Inert Gas (MIG) welding at less than a rate of about a twenty (20) inch a minute travel speed.

A method of repairing a metallic component (formed from a first material) by powder feeding laser deposition, comprises the step of depositing a plurality of first repair layers onto a repair surface of the component to form a first repair zone, the first of the plurality of first repair layers comprising a mixture of A/B by weight of the first material and a second material, each nth successive one of the plurality of first repair layers comprising a change in the proportion of the second material in the mixture, the last of the plurality of first repair layers comprising a mixture of C/D by weight of the first material and the second material.

A method of repairing a metallic component (formed from a first material) by powder feeding laser deposition, comprises the step of depositing a plurality of first repair layers onto a repair surface of the component to form a first repair zone, the first of the plurality of first repair layers comprising a mixture of A/B by weight of the first material and a second material, each nth successive one of the plurality of first repair layers comprising a change in the proportion of the second material in the mixture, the last of the plurality of first repair layers comprising a mixture of C/D by weight of the first material and the second material.

The present invention relates to a method of bonding at a faying surface two substrates of -titanium aluminide alloy having a -single phase region at elevated temperatures, comprising the steps of applying a braze material of a titanium alloy consisting of from 10 to 35 at. % aluminum, from 5 to 30 at. % iron and/or nickel, and optionally other alloying elements present in the substrate material in quantities (at. %) up to their content in the substrate material, the remainder being titanium, at the faying surface of the substrates, and subjecting the substrates and braze material to an elevated temperature in the -single phase region of the substrate, and joining the substrate at the crack interface by transient liquid phase bonding.

The present invention relates to a method of bonding two substrates of titanium aluminide alloy at a faying surface, comprising the steps of applying a braze material of a titanium alloy consisting of from 10 to 35 at. % aluminum, from 5 to 30 at. % iron and/or nickel, and optionally other alloying elements present in the substrate material in quantities (at. %) up to their content in the substrate material, the remainder being titanium, at the faying surface of the substrates, and subjecting the substrates and braze material to an elevated temperature above the melting point of the braze material and below -solvus temperature of the -titanium aluminide alloy, and joining the substrates by transient liquid phase bonding.

A ceramic circuit substrate according to the present invention includes a ceramic substrate, a copper circuit made of a copper-based material bonded, via a bonding layer, to a surface of the ceramic, and a copper heat sink made of the copper-based material bonded, via a bonding layer, to the other surface of the ceramic. The bonding layers each include a brazing material component including two or more kinds of metals, such as Ag, and an active metal having a predetermined concentration. The bonding layers each include a brazing material layer including the brazing material component, and an active metal compound layer containing the active metal. A ratio of a bonding area of the active metal compound layer in a bonding area of each of the bonding layers is 88% or more.