B23K35/365

Soldering material

The present invention accurately distinguishes a soldering material less likely to oxidize. A Cu core ball has a Cu ball having a predetermined size, and a solder layer coating the Cu ball. The Cu ball provides a space between a semiconductor package and a printed circuit board. The Cu core ball has the soldering material having lightness greater than or equal to 62.5 in L*a*b* color space subsequent to a heating storage test performed for 72 hours in a temperature-controlled bath at 150 C. with a temperature of 25 C. and 40% humidity, and the soldering material, prior to the heating storage test, having lightness greater than or equal to 65 in the L*a*b* color space and yellowness less than or equal to 7.0 in the L*a*b* color space.

Flux, and Solder Paste
20200384581 · 2020-12-10 ·

A flux which imparts thixotropy, and which exhibits excellent printability, printing sagging-inhibiting ability, and heating sagging-inhibiting ability; and a solder paste which uses said flux. This flux includes a thixotropic agent, a rosin, an organic acid, and a solvent. The thixotropic agent includes a cyclic amide compound obtained by polycondensing a dicarboxylic acid and/or a tricarboxylic acid, and a diamine and/or a triamine into a cyclic shape; and an acyclic amide compound which is obtained by polycondensing a monocarboxylic acid, a dicarboxylic acid and/or a tricarboxylic acid into an acyclic shape. The flux includes at least 0.1 wt % but not more than 8.0 wt % of the cyclic amide compound, and at least 0.5 wt % but not more than 8.0 wt % of the acyclic amide compound. The total amount of the cyclic amide compound and the acyclic amide compound is at least 1.5 wt % but not more than 10.0 wt %.

Methods And Applications Of Wear Resistant Material Enhanced Via Matrix And Hard-Phase Optimization

Hardfacing is used to protect wear surfaces of drill bits and other downhole tools. A hardfacing member can be formed by heating a metal matrix material, e.g., via a laser process, injecting a plurality of particles into the heated metal matrix material, disposing the mixture on at least a portion of a substrate thereby forming a hardfacing member having a particle-embedded metal matrix material, and attaching the hardfacing member to a main body.

Methods And Applications Of Wear Resistant Material Enhanced Via Matrix And Hard-Phase Optimization

Hardfacing is used to protect wear surfaces of drill bits and other downhole tools. A hardfacing member can be formed by heating a metal matrix material, e.g., via a laser process, injecting a plurality of particles into the heated metal matrix material, disposing the mixture on at least a portion of a substrate thereby forming a hardfacing member having a particle-embedded metal matrix material, and attaching the hardfacing member to a main body.

High performance organic, inorganic or hybrid seals

The present invention describes a new method for creating hybrid edge seals using metal, alloy, powder coated metal and other conductive surfaces in between two substrates. The methods utilize various materials, seal designs, and geometries of hybrid seals based on polymeric powder coatings and glass powder coatings.

High performance organic, inorganic or hybrid seals

The present invention describes a new method for creating hybrid edge seals using metal, alloy, powder coated metal and other conductive surfaces in between two substrates. The methods utilize various materials, seal designs, and geometries of hybrid seals based on polymeric powder coatings and glass powder coatings.

Mounting Method of a semiconductor device using a colored auxiliary joining agent

The purpose is, in mounting a semiconductor device onto a substrate, to make it easy to identify the remaining amount of an auxiliary joining agent, to stabilize the dispensing amount of the auxiliary joining agent, and to prevent a shortage of the auxiliary joining agent. Also for the purpose of efficient maintenance of a mounting machine, provided is an auxiliary joining agent adapted to aid joining of metals and prepared by dissolving a colorant in a solvent having a reducing property of removing an oxide film on a metal surface. The auxiliary joining agent is produced by a method including a step of mixing a solvent having a reducing property of removing an oxide film on a metal surface, and a colorant having a property of dissolving in the solvent.

Mounting Method of a semiconductor device using a colored auxiliary joining agent

The purpose is, in mounting a semiconductor device onto a substrate, to make it easy to identify the remaining amount of an auxiliary joining agent, to stabilize the dispensing amount of the auxiliary joining agent, and to prevent a shortage of the auxiliary joining agent. Also for the purpose of efficient maintenance of a mounting machine, provided is an auxiliary joining agent adapted to aid joining of metals and prepared by dissolving a colorant in a solvent having a reducing property of removing an oxide film on a metal surface. The auxiliary joining agent is produced by a method including a step of mixing a solvent having a reducing property of removing an oxide film on a metal surface, and a colorant having a property of dissolving in the solvent.

COATED WELDING WIRE

The disclosed technology generally relates welding wires, and more particularly to coated welding wires. A consumable welding wire comprises a base wire comprising a steel composition and a coating comprising an iron surrounding the base wire, wherein the iron oxide has an oxygen to iron (O/Fe) ratio such that an outer surface of the welding wire has a dark gray to black color.

COATED WELDING WIRE

The disclosed technology generally relates welding wires, and more particularly to coated welding wires. A consumable welding wire comprises a base wire comprising a steel composition and a coating comprising an iron surrounding the base wire, wherein the iron oxide has an oxygen to iron (O/Fe) ratio such that an outer surface of the welding wire has a dark gray to black color.