The present disclosure is directed to a tubular welding electrode with a sheath encapsulating a flux core, where the sheath comprises a number of added pores. The added pores may provide escape paths for the outgassing of moisture and hydrocarbons from the flux core when the tubular welding electrode is baked. In addition, the added pores may be used to hold a liquid, such as a lubricant. The added pores may be introduced using a process such as laser drilling or chemical etching, and may be added to a strip of sheath material prior to forming the strip into a tubular welding electrode.

The present disclosure is directed to a tubular welding electrode with a sheath encapsulating a flux core, where the sheath comprises a number of added pores. The added pores may provide escape paths for the outgassing of moisture and hydrocarbons from the flux core when the tubular welding electrode is baked. In addition, the added pores may be used to hold a liquid, such as a lubricant. The added pores may be introduced using a process such as laser drilling or chemical etching, and may be added to a strip of sheath material prior to forming the strip into a tubular welding electrode.

A flux-cored wire comprising a flux which is a core and a hoop which is an outer skin or sheath is described. The flux includes a strong deoxidizing metal element containing Mg and Al, and a fluoride powder. At least 60 mass % of a strong deoxidizing metal powder related to the strong deoxidizing metal element has a grain size of at most 150 μm. At least 60 mass % of the fluoride powder has a grain size of at most 75 μm. The flux is present at a concentration of 10-30 mass % relative to a total mass of the flux-cored wire. The flux-cored wire also requires a specific composition of elements.

A flux-cored wire comprising a flux which is a core and a hoop which is an outer skin or sheath is described. The flux includes a strong deoxidizing metal element containing Mg and Al, and a fluoride powder. At least 60 mass % of a strong deoxidizing metal powder related to the strong deoxidizing metal element has a grain size of at most 150 μm. At least 60 mass % of the fluoride powder has a grain size of at most 75 μm. The flux is present at a concentration of 10-30 mass % relative to a total mass of the flux-cored wire. The flux-cored wire also requires a specific composition of elements.

The invention relates generally to welding and, more specifically, to welding wires for arc welding, such as Gas Metal Arc Welding (GMAW) or Flux Core Arc Welding (FACW). In one embodiment, a tubular welding wire includes a sheath and a core, and the core comprises a rare earth silicide component (cerium, lanthanum, or a combination thereof). The core may also comprise an organic stabilizer component, a carbon component, and an agglomerate. The organic stabilizer component may comprise an organic molecule or organic polymer bound to one or more Group I or Group II metals. The carbon component may comprise graphite, graphene, carbon black, lamp black, carbon nanotubes, diamond, or a combination thereof. The agglomerate may comprise oxides of one or more Group I or Group II metals, titanium, and manganese.

The invention relates generally to welding and, more specifically, to welding wires for arc welding, such as Gas Metal Arc Welding (GMAW) or Flux Core Arc Welding (FACW). In one embodiment, a tubular welding wire includes a sheath and a core, and the core comprises a rare earth silicide component (cerium, lanthanum, or a combination thereof). The core may also comprise an organic stabilizer component, a carbon component, and an agglomerate. The organic stabilizer component may comprise an organic molecule or organic polymer bound to one or more Group I or Group II metals. The carbon component may comprise graphite, graphene, carbon black, lamp black, carbon nanotubes, diamond, or a combination thereof. The agglomerate may comprise oxides of one or more Group I or Group II metals, titanium, and manganese.

Provided is a metal particle for adhesive paste. The metal particle may include a core including at least one metal; and a shell on at least one surface of the core and including at least one metal and nanoparticles. The metal particle may be a transient liquid phase particle and the at least one metal of the core may have a higher melting point than a melting point of the at least one metal of the shell. In addition, provided are a method of preparing the metal particle for adhesive paste, a composite bonding structure formed from the metal particle for adhesive paste, and a semiconductor device including the composite bonding structure.

Provided is a metal particle for adhesive paste. The metal particle may include a core including at least one metal; and a shell on at least one surface of the core and including at least one metal and nanoparticles. The metal particle may be a transient liquid phase particle and the at least one metal of the core may have a higher melting point than a melting point of the at least one metal of the shell. In addition, provided are a method of preparing the metal particle for adhesive paste, a composite bonding structure formed from the metal particle for adhesive paste, and a semiconductor device including the composite bonding structure.

Provided are flux for resin flux cored solder, flux for flux-coated solder, resin flux cored solder using the flux for resin flux cored solder, flux-coated solder using the flux for flux-coated solder, and a soldering method, which have low residue and are excellent in processability. The flux for resin flux cored solder or flux-coated solder contains a solid solvent in an amount of 70 wt % or more and 99.5 wt % or less, and an activator in an amount of 0.5 wt % or more and 30 wt % or less.

Provided are flux for resin flux cored solder, flux for flux-coated solder, resin flux cored solder using the flux for resin flux cored solder, flux-coated solder using the flux for flux-coated solder, and a soldering method, which have low residue and are excellent in processability. The flux for resin flux cored solder or flux-coated solder contains a solid solvent in an amount of 70 wt % or more and 99.5 wt % or less, and an activator in an amount of 0.5 wt % or more and 30 wt % or less.