A machining head emits a laser beam for cutting sheet metal of stainless steel. A moving mechanism moves the machining head relatively to a surface of the sheet metal. A beam vibrating mechanism vibrates a laser beam in a parallel direction with a cutting advancing direction of the sheet metal. In a machining condition database, a single specific vibration frequency at which cutting of the sheet metal is possible is set to a maximum moving velocity at which cutting of the sheet metal is possible, and a plurality of vibration frequencies from a maximum frequency to a minimum frequency at which cutting of the sheet metal is possible are set to a moving velocity more than or equal to a minimum moving velocity and less than the maximum moving velocity at which cutting of the sheet metal is possible.

A computer-numerically-controlled (CNC) machine is configured to (i) measure a power of a beam of electromagnetic energy at a location between a source of the electromagnetic energy and a destination in the CNC machine, the beam of electromagnetic energy traveling from the source to the destination being susceptible to one or more interferences, and the one or more interferences being capable of altering the power of the beam of electromagnetic energy by at least diverting, away from an intended path for the beam of electromagnetic energy, at least a portion of the beam of electromagnetic energy, (ii) detect, based at least on the measured power of the beam of electromagnetic energy being less than a threshold value, an interference of the beam of electromagnetic energy, and (iii) in response to detecting the interference of the beam of electromagnetic energy, perform one or more actions.

A processing apparatus is a processing apparatus that processes an object by a processing light from a processing light source, includes a first optical system that condenses the processing light from the processing light source on a condensed plane; and a second optical system that condenses the processing light from the first optical system to irradiate the object with it, a position in the condensed plane through which the processing light passes is changeable, a propagating direction of the processing light propagating from the first optical system to the second optical system changes depending on the position in the condensed plane through which the processing light passes.

A method for producing workpiece parts from a plate-shaped workpiece in a processing machine or laser processing machine includes positioning and holding the workpiece on a workpiece support by clamping devices. A plurality of workpiece parts are cut out of the workpiece with a process beam. The process beam is moved relative to the workpiece support by a processing head and/or the workpiece is moved relative to the workpiece support by the clamping devices. A cutting process for processing the workpiece to produce the workpiece parts is interrupted at least once by a relaxation step for the workpiece. During the relaxation step at least one clamping device is released to relax the workpiece. The at least one clamping device is closed following the relaxation and before continuing the cutting process. A data processing program and a processing machine for producing the workpiece parts are also provided.

A protective film applying apparatus includes a protective film forming and cleaning unit for forming a protective film on a surface of a wafer and cleaning the protective film away. A coverage state detector detects a coverage state of the protective film, and a controller determines whether or not the protective film has a film thickness falling within a predetermined range. If the controller decides that the thickness of the protective film does not fall in the predetermined range, the controller operates the protective film forming and cleaning unit to clean away the protective film, performs a pretreating process selected depending on the film thickness on the surface, and operates the protective film forming and cleaning unit to form a protective film again on the surface of the wafer.

The invention relates to a bridge (B) for laser cutting machines. In the latter, a laser cutting head (K) is guided over a workpiece support (W) by means of a guide system. The bridge (B) is configured in the form of a substantially straight and box-like profile (1) which has at least one guide for a cutting carriage carrying the laser cutting head (K). According to the invention, at least two side faces (10, 11) of the profile (1) that are located opposite one another with regard to the vertical plane of symmetry (VSE) of the bridge enclose a non-zero angle (a) of less than 180° that opens in the direction of the machining region, at least over a part of the height of said profile (1).

In an example method, a laser processing head is moved from an entrance region over a workpiece to a starting position above the workpiece. During this time, a distance control system is used to control the distance between the laser processing head and the workpiece based on measurements obtained from one or more distance sensors. Further, the laser processing head is moved from the starting position to a position beyond an edge of the workpiece. During this time, the distance control system is disengaged. When the laser processing head reaches the position beyond an edge of the workpiece, laser emission is initiated, and the laser processing head is moved back towards the starting position. Upon reaching the starting position, the distance control system is reengaged. The laser processing head is subsequently moved along a pre-determined path to cut the workpiece.

Method for cutting objects out of an at least partially two-ply web of material by means of a cutting device, wherein two material plies are connected to one another at least partially in a linear, strip-like and/or areal manner. The position of the respective object to be cut out is detected contactlessly on the basis of changes in structure in the material, these being part of the object which arise on account of those regions in the web of material which are connected to one another in a linear, strip-like and/or areal manner. The position of the object is detected in the web of material at least on the basis of previously determined and stored, prominent and spaced-apart geometrical part shapes of those regions of the object which are connected to one another in a linear, strip-like and/or areal manner.

A method detects a suspension position of a supporting bar in a pallet, having supporting bars along a longitudinal direction, each with multiple supporting bar tips along a main direction of extent. The supporting bar tips define a supporting plane. A two-dimensional contrast-image dataset of the pallet is created, its pixels being assigned a pixel value and a pixel-area unit of the supporting plane. The contrast-image dataset has regions that are assigned to the supporting bar tips as local pixel-value extremes in a uniform pixel-value background. A longitudinal position is determined in the contrast-image dataset of the regions that are assigned to the supporting bar tips a supporting bar using the local pixel-value extremes. The suspension position of the supporting bar in the pallet is deduced based on the longitudinal position in the contrast-image dataset and an extent of the pixel-area unit in the longitudinal direction.

A housing for a laser processing machine is described to treat work pieces. The housing comprises a dividing wall, which separates a first work space having a first length and a second work space having a second length from one another, a first entrance to allow access to the first work space, a second entrance to allow access to the second work space, a closing device, which is configured to selectively open and close the first entrance and the second entrance and a control unit, which is operatively connected to the closing device. The dividing wall is placeable in an operating position, which is variable among at least a first position, a second position and a third position. The control unit is configured to control the closing device as a function of the operating position of the dividing wall.