A double-head grinding machine includes: a spindle driving portion configured to rotate a spindle to which a grinding wheel is attachable; a moving portion configured to move the spindle driving portions toward and away from a wafer; and an inclination measuring portion configured to measure a change in an inclination of the spindle in association with a movement of the spindle driving portions.

A double-head grinding machine includes: a spindle driving portion configured to rotate a spindle to which a grinding wheel is attachable; a moving portion configured to move the spindle driving portions toward and away from a wafer; and an inclination measuring portion configured to measure a change in an inclination of the spindle in association with a movement of the spindle driving portions.

The invention is directed to a double-disc grinding apparatus including: a rotatable ring holder configured to support a sheet workpiece along a circumferential direction from an outer circumference side of the workpiece; a pair of grinding wheels for grinding surfaces of the workpiece supported by the ring holder; and a hydrostatic bearing for supporting the ring holder without contact from both of a direction of a rotational axis of the ring holder and a direction perpendicular to the rotational axis by hydrostatic pressure of fluid supplied from both directions, wherein supply pressures at which the fluid is supplied from the direction of the rotational axis and from the direction perpendicular to the rotational axis can be independently controlled. The invention provides a double-disc grinding apparatus and a workpiece double-disc grinding method that can improve variation in nanotopography depending on the lot of workpieces or grinding wheels to obtain nanotopography stably.

The invention is directed to a double-disc grinding apparatus including: a rotatable ring holder configured to support a sheet workpiece along a circumferential direction from an outer circumference side of the workpiece; a pair of grinding wheels for grinding surfaces of the workpiece supported by the ring holder; and a hydrostatic bearing for supporting the ring holder without contact from both of a direction of a rotational axis of the ring holder and a direction perpendicular to the rotational axis by hydrostatic pressure of fluid supplied from both directions, wherein supply pressures at which the fluid is supplied from the direction of the rotational axis and from the direction perpendicular to the rotational axis can be independently controlled. The invention provides a double-disc grinding apparatus and a workpiece double-disc grinding method that can improve variation in nanotopography depending on the lot of workpieces or grinding wheels to obtain nanotopography stably.

The present invention is a workpiece double-disc grinding method including supporting a sheet workpiece along a circumferential direction from an outer circumference side of the workpiece by a ring holder, and simultaneously grinding both surfaces of the workpiece supported by the ring holder with a pair of grinding wheels while rotating the ring holder, wherein the surfaces of the workpiece are simultaneously ground such that a wear amount of the grinding wheels per 1 m of a grinding stock removal of the workpiece ranges from 0.10 m to 0.33 m. This workpiece double-disc grinding method can reduce nanotopography formed in previous steps such as a slicing step without degrading the flatness in the double-disc grinding step.

The present invention is a workpiece double-disc grinding method including supporting a sheet workpiece along a circumferential direction from an outer circumference side of the workpiece by a ring holder, and simultaneously grinding both surfaces of the workpiece supported by the ring holder with a pair of grinding wheels while rotating the ring holder, wherein the surfaces of the workpiece are simultaneously ground such that a wear amount of the grinding wheels per 1 m of a grinding stock removal of the workpiece ranges from 0.10 m to 0.33 m. This workpiece double-disc grinding method can reduce nanotopography formed in previous steps such as a slicing step without degrading the flatness in the double-disc grinding step.

A method for manufacturing a roller, adapted to equip a mechanical system forming a cam follower or a rocker arm. The roller is centered on a central axis and comprising: an outer cylindrical surface adapted to roll on a cam, an inner cylindrical bore adapted to receive a pin belonging to the mechanical system, and two lateral faces extending radially to the central axis. The method includes a machining step forming circular grooves that are concentric with each other on at least one of the lateral faces of the roller. The roller can be installed within a mechanical system.

A method for manufacturing a roller, adapted to equip a mechanical system forming a cam follower or a rocker arm. The roller is centered on a central axis and comprising: an outer cylindrical surface adapted to roll on a cam, an inner cylindrical bore adapted to receive a pin belonging to the mechanical system, and two lateral faces extending radially to the central axis. The method includes a machining step forming circular grooves that are concentric with each other on at least one of the lateral faces of the roller. The roller can be installed within a mechanical system.

Problem: To provide an abrasive pad and abrading method using same that are capable of extending the life of the abrasive pad when applied to abrading the surface of glass substrates, and that can ensure abrading capability that is appropriate for abrading the surface of glass substrates. Resolution Means: An abrasive pad used for abrading the surface of a glass substrate, that includes a base material layer, and an abrasive layer provided on one side of the base material layer, the abrasive layer including a plurality of pillar shaped abrading portions arranged separated from each other on the base material layer, the abrading portions being made from abrasive material that includes polishing abrasive particles, a filler, and a binder resin, the polishing abrasive particles including abrasive particles and a glass matrix, and the filler including a first filler that fractures or drops out when the surface is being abraded, forming approximately spherical crown shaped recesses in the top face of the abrading portions.

Disclosure relates to a fixed abrasive-grain processing device and a method of fixed abrasive-grain processing used for producing a semiconductor wafer, and a method for producing a semiconductor wafer which make the surface of the semiconductor wafer possible to have preferable flatness and which can prevent the number of steps and the installation area of facilities from increasing. The producing of semiconductor wafers uses a fixed abrasive-grain processing device including a lower fixed abrasive-grain layer that is adjacent to the top surface of the lower surface-plate and that grinds the top surfaces of the plurality of semiconductor wafers; an upper fixed abrasive-grain layer that is adjacent to the bottom surface of the upper surface-plate and that grinds the bottom surfaces of the plurality of semiconductor wafers; a carrier plate that is horizontally interposed between the lower surface-plate and the upper surface-plate and that includes a plurality of holes each accommodating one of the plurality of semiconductor wafers; and a carrier rotating device that circularly moves the carrier plate, wherein the lower fixed abrasive-grain layer and the upper fixed abrasive-grain layer include fixed abrasive grain having a diameter of 4 m or less and being dispersed and fixed in elastic members.