A sanding machine for sanding panels, including a supporting structure, a sanding unit supported by the supporting structure, a surface for supporting and sliding of the panels located beneath the sanding unit and along which the panels are fed in a predetermined feed direction; the sanding unit including a trestle supporting a sanding belt, the trestle including a plurality of rollers having respective axes parallel to the supporting surface, the sanding belt being endless and looped around the rollers, one of the rollers being motorized to move the sanding belt during the sanding of the panels, the sanding unit further including at least one opposing member to force the belt against the panel to be sanded.

A sanding machine for sanding panels, including a supporting structure, a sanding unit supported by the supporting structure, a surface for supporting and sliding of the panels located beneath the sanding unit and along which the panels are fed in a predetermined feed direction; the sanding unit including a trestle supporting a sanding belt, the trestle including a plurality of rollers having respective axes parallel to the supporting surface, the sanding belt being endless and looped around the rollers, one of the rollers being motorized to move the sanding belt during the sanding of the panels, the sanding unit further including at least one opposing member to force the belt against the panel to be sanded.

A polishing apparatus polishes a periphery of a substrate by bringing a polishing tool into sliding contact with the substrate. The polishing apparatus includes a substrate-holding mechanism configured to hold a substrate and rotate the substrate, a polishing mechanism configured to press a polishing tool against a periphery of the substrate so as to polish the periphery, and a periphery-supporting mechanism configured to support the periphery of the substrate by a fluid. The periphery-supporting mechanism is configured to support a surface of the substrate from an opposite side or the same side of the periphery of the substrate.

A polishing apparatus polishes a periphery of a substrate by bringing a polishing tool into sliding contact with the substrate. The polishing apparatus includes a substrate-holding mechanism configured to hold a substrate and rotate the substrate, a polishing mechanism configured to press a polishing tool against a periphery of the substrate so as to polish the periphery, and a periphery-supporting mechanism configured to support the periphery of the substrate by a fluid. The periphery-supporting mechanism is configured to support a surface of the substrate from an opposite side or the same side of the periphery of the substrate.

A method of removing material from a workpiece includes moving a coated abrasive over a receiving surface of a platen, the receiving surface having at least one opening configured for the flow of an ejection material therethrough, moving the platen and workpiece relative to each other to contact the coated abrasive to the workpiece and removing material from the workpiece, and controlling a flow pressure for the ejection material through the at least one opening during removing material from the workpiece, where the flow pressure of the ejection material can be adjusted based on at least one of the operation parameters such as a translation rate of the coated abrasive over the receiving surface, the weight of the coated abrasive, a material removal rate, a coefficient of friction between the coated abrasive and the platen, or a combination thereof.

The present invention relates to a substrate polishing apparatus for polishing a substrate, such as a wafer, and more particularly to a substrate polishing apparatus for polishing a notch of a substrate, a bevel portion of the substrate, a device surface of the substrate, and a back surface of the substrate. The substrate polishing apparatus includes: a first polishing module; a second polishing module; and a third polishing module; wherein the first polishing module, the second polishing module, and the third polishing module are configured to polish different regions of a substrate.

The present invention relates to a substrate polishing apparatus for polishing a substrate, such as a wafer, and more particularly to a substrate polishing apparatus for polishing a notch of a substrate, a bevel portion of the substrate, a device surface of the substrate, and a back surface of the substrate. The substrate polishing apparatus includes: a first polishing module; a second polishing module; and a third polishing module; wherein the first polishing module, the second polishing module, and the third polishing module are configured to polish different regions of a substrate.

Equipment (300) for the surface sanding of plate-shaped bodies (101), in particular of tiles, said equipment (300) comprising support and feeding means (100) for supporting said plate-shaped bodies (101) and feeding said plate-shaped bodies (101) along a given feed direction (D), so that during the movement along said given direction (D) the surface of each said plate-shaped body (101) that shall be sanded can be visible and accessed, said equipment (300) including a sanding module (200) provided with sanding means defining a sanding abrasive surface and with moving means for moving said abrasive surface in contact with the visible surface of said plate-shaped bodies (101) in succession during the movement thereof, wherein said sanding means comprise a closed belt (201) that defines said sanding abrasive surface and is suitable to be driven into rotation by means of said moving means.

Equipment (300) for the surface sanding of plate-shaped bodies (101), in particular of tiles, said equipment (300) comprising support and feeding means (100) for supporting said plate-shaped bodies (101) and feeding said plate-shaped bodies (101) along a given feed direction (D), so that during the movement along said given direction (D) the surface of each said plate-shaped body (101) that shall be sanded can be visible and accessed, said equipment (300) including a sanding module (200) provided with sanding means defining a sanding abrasive surface and with moving means for moving said abrasive surface in contact with the visible surface of said plate-shaped bodies (101) in succession during the movement thereof, wherein said sanding means comprise a closed belt (201) that defines said sanding abrasive surface and is suitable to be driven into rotation by means of said moving means.

A method determines state information relating to a belt grinder. The belt grinder has at least one abrasive belt for grinding a workpiece. The method includes providing measurement data relating to the belt grinder, and determining the state information from the measurement data using a machine learning system. The machine learning system is configured to determine the state information based on the provided measurement data.