The present disclosure involves a method of making a lapping plate by electrostatically coating a platen with solid resin powder and abrasive particles followed by curing the solid resin powder to form an abrasive coating. The present disclosure also involves related lapping plates.

The present disclosure involves a method of making a lapping plate by electrostatically coating a platen with solid resin powder and abrasive particles followed by curing the solid resin powder to form an abrasive coating. The present disclosure also involves related lapping plates.

A tool (1) for surface finish machining, having a cushion (6) made of an elastic plastics foam, on the underside of which there is formed a working medium face (2) having working media or adhesives (8, 11, 12, 13) for the releasable attachment of working medium discs and on the top side of which there is formed a drive receptacle (4, 5) for application of work, is created as a product that is producible easily and non-critically in high volume, is extremely robust in use, is moisture-resistant and is able to withstand high rotational speeds, in that the elastic plastics foam consists of closed-cell expanded and fused-together particles of a thermoplastic elastomer (TPE).

The present disclosure involves apparatuses and methods for coating a lapping plate with an aqueous composition. The apparatus can be configured and the aqueous composition can be formulated so that the aqueous composition can flow to a spray nozzle device solely due to gravity in a batchwise manner.

The present disclosure involves apparatuses and methods for coating a lapping plate with an aqueous composition. The apparatus can be configured and the aqueous composition can be formulated so that the aqueous composition can flow to a spray nozzle device solely due to gravity in a batchwise manner.

A double-side polishing method including: disposing a wafer between a polishing pad attached to an upper surface of a lower turn table and a polishing pad attached to a lower surface of an upper turn table provided above the lower turn table; and polishing both sides of the wafer. An absolute value of a difference between a gap at inner circumferential portions of the two polishing pads and a gap at outer circumferential portions thereof is defined as a pad gap. The pad gap is larger when the both sides of the wafer are polished than when the two polishing pads are dressed. This provides a double-side polishing method that simultaneously achieves enhancement of quality level (processing precision) and extension of cloth life.

An abrasive article includes a plurality of abrasive features disposed on one or more abrasive elements. Each of the one or more abrasive elements includes a base having a first major surface from which the plurality of abrasive features extends. A first set of the plurality of abrasive features (i) has an average height, H.sub.1avg, (ii) a standard deviation of less than 10% of H.sub.2avg, and (iii) comprises between 5 and 130 abrasive features.

A synthetic grindstone (100) for chemo-mechanical grinding a wafer W, comprising: an abrasive grain (101) having a chemo-mechanical grinding action on the wafer W and having a particle diameter of less than 5 μm; a spherical filler (102) formed of a material as hard as or softer than the wafer W and having a particle diameter larger than that of the abrasive grain (101); and a resin binder (103) that integrally binds the abrasive grain (101) and the spherical filler (102).

To provide an automated apparatus for conveying a rectangular substrate. According to one embodiment, there is provided a substrate conveying apparatus for conveying the rectangular substrate. The substrate conveying apparatus includes a plurality of conveyance rollers, a plurality of roller shafts, a motor, and a pusher. The plurality of conveyance rollers are configured to support a lower surface of the substrate. To the plurality of roller shafts, the plurality of conveyance rollers are mounted. The motor is configured to rotate the plurality of roller shafts. The pusher is for lifting the substrate on the plurality of conveyance rollers such that the substrate is separated away from the plurality of conveyance rollers. The pusher includes a stage configured to pass through a clearance between the plurality of roller shafts.

To provide an automated apparatus for conveying a rectangular substrate. According to one embodiment, there is provided a substrate conveying apparatus for conveying the rectangular substrate. The substrate conveying apparatus includes a plurality of conveyance rollers, a plurality of roller shafts, a motor, and a pusher. The plurality of conveyance rollers are configured to support a lower surface of the substrate. To the plurality of roller shafts, the plurality of conveyance rollers are mounted. The motor is configured to rotate the plurality of roller shafts. The pusher is for lifting the substrate on the plurality of conveyance rollers such that the substrate is separated away from the plurality of conveyance rollers. The pusher includes a stage configured to pass through a clearance between the plurality of roller shafts.