A base layer, a polishing pad with a base layer and a polishing method are provided. The polishing pad includes a polishing layer and a base layer. The base layer, underlaid below the polishing layer, is a three-dimensional fabric. The three-dimensional fabric comprises a top woven layer, a bottom woven layer, and a supporting woven layer disposed between the top woven layer and the bottom woven layer. The top woven layer and the bottom woven layer are respectively woven by a plurality of first set of yarns and a plurality of second set of yarns. The supporting woven layer comprises a plurality of supporting yarns interconnecting the top woven layer and the bottom woven layer, so that a space exists between the top woven layer and the bottom woven layer.

A structured abrasive article comprises a plurality of shaped abrasive composites disposed on and secured to a major surface of a backing. The shaped abrasive composites comprise magnetizable abrasive particles retained in an organic binder. On a respective basis, each of the magnetizable abrasive particles has a ceramic body with a magnetizable layer disposed on at least a portion thereof. Methods of making and using the structured abrasive articles are also disclosed.

A structured abrasive article comprises a plurality of shaped abrasive composites disposed on and secured to a major surface of a backing. The shaped abrasive composites comprise magnetizable abrasive particles retained in an organic binder. On a respective basis, each of the magnetizable abrasive particles has a ceramic body with a magnetizable layer disposed on at least a portion thereof. Methods of making and using the structured abrasive articles are also disclosed.

Disclosed is a non-porous molded article for a polishing layer, the non-porous molded article including a thermoplastic polyurethane, wherein the thermoplastic polyurethane has a maximum value of a loss tangent (tan 5) in a range of −70 to −50° C. of 4.00×10.sup.−2 or less. Preferably, the thermoplastic polyurethane is obtained by polymerization of a polymer diol having a number average molecular weight of 650 to 1400, an organic diisocyanate, and a chain extender, and a content ratio of nitrogen derived from an isocyanate group of the organic diisocyanate is 5.7 to 6.5 mass %.

Disclosed is a non-porous molded article for a polishing layer, the non-porous molded article including a thermoplastic polyurethane, wherein the thermoplastic polyurethane has a maximum value of a loss tangent (tan 5) in a range of −70 to −50° C. of 4.00×10.sup.−2 or less. Preferably, the thermoplastic polyurethane is obtained by polymerization of a polymer diol having a number average molecular weight of 650 to 1400, an organic diisocyanate, and a chain extender, and a content ratio of nitrogen derived from an isocyanate group of the organic diisocyanate is 5.7 to 6.5 mass %.

A polishing article manufacturing system includes a feed section and a take-up section, the take-up section comprising a supply roll having a polishing article disposed thereon for a chemical mechanical polishing process, a print section comprising a plurality of printheads disposed between the feed section and the take-up section, and a curing section disposed between the feed section and the take-up section, the curing section comprising one or both of a thermal curing device and an electromagnetic curing device.

A polishing article manufacturing system includes a feed section and a take-up section, the take-up section comprising a supply roll having a polishing article disposed thereon for a chemical mechanical polishing process, a print section comprising a plurality of printheads disposed between the feed section and the take-up section, and a curing section disposed between the feed section and the take-up section, the curing section comprising one or both of a thermal curing device and an electromagnetic curing device.

The present invention is directed to a method and apparatus for polishing stone and synthetic substrates. The apparatus uses a leather polishing pad to apply a finish to a stone or synthetic substrate. The pad has a specially designed fluid channeling pattern which cools by maintaining a quantity of liquid polishing slurry centrally of the pad for cooling purposes. The grit and amount of the abrasive used with the slurry varies based on the mechanical properties of the substrate.

The present invention is directed to a method and apparatus for polishing stone and synthetic substrates. The apparatus uses a leather polishing pad to apply a finish to a stone or synthetic substrate. The pad has a specially designed fluid channeling pattern which cools by maintaining a quantity of liquid polishing slurry centrally of the pad for cooling purposes. The grit and amount of the abrasive used with the slurry varies based on the mechanical properties of the substrate.

A polishing pad includes a polishing layer stack that has a polishing surface, a bottom surface, and an aperture from the polishing surface to the bottom surface. The polishing layer stack includes a polishing layer that has the polishing surface. A fluid-impermeable layer spans the aperture and the polishing pad. A first adhesive layer of a first adhesive material is in contact with and secures the bottom surface of the polishing layer to the fluid-impermeable layer. The first adhesive layer spans the aperture and the polishing pad. The light-transmitting body is positioned in the aperture and has a lower surface in contact with, is secured to the first adhesive layer, and is spaced apart from a side-wall of the aperture by a gap. An adhesive sealant of a different second material is disposed in and laterally fills the gap.