Coated compressive subpads for polishing pad stacks and methods of fabricating coated compressive subpads for polishing pad stacks are described. In an example, a polishing pad stack for polishing a substrate includes a polishing pad having a polishing surface and a back surface. The polishing pad stack also includes a compressive subpad with a first surface having a first pressure sensitive adhesive layer coated thereon. The first surface of the compressive subpad is coupled directly to the back surface of the polishing pad by the first pressure sensitive adhesive layer.

Coated compressive subpads for polishing pad stacks and methods of fabricating coated compressive subpads for polishing pad stacks are described. In an example, a polishing pad stack for polishing a substrate includes a polishing pad having a polishing surface and a back surface. The polishing pad stack also includes a compressive subpad with a first surface having a first pressure sensitive adhesive layer coated thereon. The first surface of the compressive subpad is coupled directly to the back surface of the polishing pad by the first pressure sensitive adhesive layer.

An object of the present invention is to provide a polishing table capable of preventing peeling or detachment of a coating of the polishing table, thereby to enable an operation for replacement of a polishing pad to be easily conducted. One embodiment of the present invention provides a polishing table having a support surface configured to support a polishing pad, the polishing pad being adapted to be used for polishing a substrate, the polishing table comprising: a stacked body comprising a stack of a porous layer and a non-porous layer, the porous layer including open pores formed in a surface thereof disposed to face a polishing pad; and a resin-based coating material disposed in the open pores so as to form at least a part of the support surface of the polishing table.

An object of the present invention is to provide a polishing table capable of preventing peeling or detachment of a coating of the polishing table, thereby to enable an operation for replacement of a polishing pad to be easily conducted. One embodiment of the present invention provides a polishing table having a support surface configured to support a polishing pad, the polishing pad being adapted to be used for polishing a substrate, the polishing table comprising: a stacked body comprising a stack of a porous layer and a non-porous layer, the porous layer including open pores formed in a surface thereof disposed to face a polishing pad; and a resin-based coating material disposed in the open pores so as to form at least a part of the support surface of the polishing table.

Provided is a manufacturing method for a thin phosphor glass plate by which a thin phosphor glass plate can be more certainly produced. A manufacturing method includes the steps of: preparing a phosphor glass base material 21 having a first principal surface 21a and a second principal surface 21b opposed to each other; placing the phosphor glass base material 21 on a stage 22 and fixing the second principal surface 21b onto the stage 22; and polishing the first principal surface 21a of the phosphor glass base material 21 with a polishing member 23 including an abrasive layer 24.

Provided is a manufacturing method for a thin phosphor glass plate by which a thin phosphor glass plate can be more certainly produced. A manufacturing method includes the steps of: preparing a phosphor glass base material 21 having a first principal surface 21a and a second principal surface 21b opposed to each other; placing the phosphor glass base material 21 on a stage 22 and fixing the second principal surface 21b onto the stage 22; and polishing the first principal surface 21a of the phosphor glass base material 21 with a polishing member 23 including an abrasive layer 24.

A polishing pad including a damping layer made of a resilient material including expanded semi-rigid polyurethane having a microcell structure, an adhesive layer including a layer of a hook-and-loop fastener adapted to interact and connect to a corresponding layer of the hook-and-loop fastener located at a bottom surface of the working element of the machine tool and a polishing layer including microfiber adapted for polishing a surface of a work piece. The polishing layer includes a fabric having a woven mesh of microfibers that define a back side of the polishing layer. The fabric serves as a barrier to the resilient material of the damping layer such that the resilient material does not reach an active side of the polishing layer comprising the microfibers when the damping layer, adhesive layer and polishing layer are combined, and such that the active side of the polishing layer is free of resilient material of the damping layer.

A polishing pad including a damping layer made of a resilient material including expanded semi-rigid polyurethane having a microcell structure, an adhesive layer including a layer of a hook-and-loop fastener adapted to interact and connect to a corresponding layer of the hook-and-loop fastener located at a bottom surface of the working element of the machine tool and a polishing layer including microfiber adapted for polishing a surface of a work piece. The polishing layer includes a fabric having a woven mesh of microfibers that define a back side of the polishing layer. The fabric serves as a barrier to the resilient material of the damping layer such that the resilient material does not reach an active side of the polishing layer comprising the microfibers when the damping layer, adhesive layer and polishing layer are combined, and such that the active side of the polishing layer is free of resilient material of the damping layer.

Method and system for monitoring a polishing pad is provided. The polishing pad includes a bottom layer, a polishing layer disposed on the bottom layer, and a plurality of mark structures disposed on the bottom layer and in the polishing layer to have a top surface coplanar with the polishing layer to indicate consumption level of the polishing layer. The monitoring system includes an acquisition module, a memory module, and a determining module connected to both the acquisition module and the memory module. The determining module, the acquisition module, and the memory module are configured to monitor the consumption level of the polishing layer and to recognize that the polishing pad needs to be replaced.

Method and system for monitoring a polishing pad is provided. The polishing pad includes a bottom layer, a polishing layer disposed on the bottom layer, and a plurality of mark structures disposed on the bottom layer and in the polishing layer to have a top surface coplanar with the polishing layer to indicate consumption level of the polishing layer. The monitoring system includes an acquisition module, a memory module, and a determining module connected to both the acquisition module and the memory module. The determining module, the acquisition module, and the memory module are configured to monitor the consumption level of the polishing layer and to recognize that the polishing pad needs to be replaced.