The present disclosure relates to a semiconductor substrate manufacturing method including: forming a catalytic metal film composed of a transition metal on a main surface to be polished of a workpiece substrate composed of any one of diamond, silicon carbide, gallium nitride, and sapphire; and providing relative movement between the workpiece substrate on which the catalytic metal film has been formed and a polishing platen in an oxidant solution to remove a compound generated by chemical reaction of an active radical generated by reaction of the catalytic metal film and the oxidant solution and a surface atom on the main surface of the workpiece substrate to thereby polish the workpiece substrate. The manufacturing method further includes: bonding the polished workpiece substrate to a nitride semiconductor layer by room temperature bonding; and removing a support substrate and a resin adhesive layer.

A polishing pad includes a polyurethane, wherein the polyurethane includes a fluorinated repeating unit represented by Formula 1, wherein the number of defects on a substrate after polishing with the polishing pad and a fumed silica slurry is 40 or less; ##STR00001## wherein R.sub.11 and R.sub.12 are each independently selected from the group consisting of hydrogen, C.sub.1-C.sub.10 alkyl groups, and fluorine, with the proviso that at least one of R.sub.11 and R.sub.12 is fluorine, L is a C.sub.1-C.sub.5 alkylene group or —O—, R.sub.13 and R.sub.14 are each independently selected from the group consisting of hydrogen, C.sub.1-C.sub.10 alkyl groups, and fluorine, with the proviso that at least one of R.sub.13 and R.sub.14 is fluorine, and n and m are each independently an integer from 0 to 20, with the proviso that n and m are not simultaneously 0.

A polishing pad includes a polyurethane, wherein the polyurethane includes a fluorinated repeating unit represented by Formula 1, wherein the number of defects on a substrate after polishing with the polishing pad and a fumed silica slurry is 40 or less; ##STR00001## wherein R.sub.11 and R.sub.12 are each independently selected from the group consisting of hydrogen, C.sub.1-C.sub.10 alkyl groups, and fluorine, with the proviso that at least one of R.sub.11 and R.sub.12 is fluorine, L is a C.sub.1-C.sub.5 alkylene group or —O—, R.sub.13 and R.sub.14 are each independently selected from the group consisting of hydrogen, C.sub.1-C.sub.10 alkyl groups, and fluorine, with the proviso that at least one of R.sub.13 and R.sub.14 is fluorine, and n and m are each independently an integer from 0 to 20, with the proviso that n and m are not simultaneously 0.

An elastic membrane having a physical property required for each portion of the elastic membrane and capable of uniformly polishing a workpiece is disclosed. The elastic membrane includes: a contact portion having a workpiece pressing surface for pressing a workpiece against a polishing surface; and a partition wall extending upward from the contact portion and forming a pressure chamber. The contact portion and at least a part of the partition wall are composed of a first rubber structure and a second rubber structure which are integrally formed, the first rubber structure has a first hardness, and the second rubber structure has a second hardness lower than the first hardness, the first rubber structure includes the workpiece pressing surface, and the second rubber structure includes the at least a part of the partition wall.

An elastic membrane having a physical property required for each portion of the elastic membrane and capable of uniformly polishing a workpiece is disclosed. The elastic membrane includes: a contact portion having a workpiece pressing surface for pressing a workpiece against a polishing surface; and a partition wall extending upward from the contact portion and forming a pressure chamber. The contact portion and at least a part of the partition wall are composed of a first rubber structure and a second rubber structure which are integrally formed, the first rubber structure has a first hardness, and the second rubber structure has a second hardness lower than the first hardness, the first rubber structure includes the workpiece pressing surface, and the second rubber structure includes the at least a part of the partition wall.

This invention relates to a polishing pad and a method for manufacturing the same. The polishing pad may include a top pad layer and a window block. The top pad layer may include a groove pattern formed on an upper surface of the top pad layer. A first hole may be formed through the top pad layer. The window block may be inserted into the first hole. The top pad layer and the window block may have a structure coincided with following Formula 1.

[00001]$\begin{array}{cc}1.1\le \frac{\mathrm{Gap}+{\mathrm{Thk}}_{\mathrm{RTPC}}}{{\mathrm{Thk}}_{\mathrm{grv}}}\le 3.& \mathrm{Formula}1\end{array}$

In Formula 1, the gap may indicate a height difference between an upper surface of the top pad layer and an upper surface of the window block, the Thk.sub.RTPC may indicate a thickness of the window block, and the Thk.sub.grv may indicate a depth of the groove pattern.

This invention relates to a polishing pad and a method for manufacturing the same. The polishing pad may include a top pad layer and a window block. The top pad layer may include a groove pattern formed on an upper surface of the top pad layer. A first hole may be formed through the top pad layer. The window block may be inserted into the first hole. The top pad layer and the window block may have a structure coincided with following Formula 1.

[00001]$\begin{array}{cc}1.1\le \frac{\mathrm{Gap}+{\mathrm{Thk}}_{\mathrm{RTPC}}}{{\mathrm{Thk}}_{\mathrm{grv}}}\le 3.& \mathrm{Formula}1\end{array}$

In Formula 1, the gap may indicate a height difference between an upper surface of the top pad layer and an upper surface of the window block, the Thk.sub.RTPC may indicate a thickness of the window block, and the Thk.sub.grv may indicate a depth of the groove pattern.

A lapping material having a knitted fabric constituted by warp knitting or weft knitting, and a resin with which the knitted fabric is impregnated.

A lapping material having a knitted fabric constituted by warp knitting or weft knitting, and a resin with which the knitted fabric is impregnated.

The present disclosure is to provide a polishing pad which is capable of providing physical properties corresponding to various polishing purposes for various polishing objects through the subdivided structural design in a thickness direction, and of securing environmental friendliness by applying a recycled or recyclable material to at least some components, in relation to disposal after use, unlike the conventional polishing pad. Specifically, it includes a polishing layer, wherein the polishing layer includes a polishing variable layer having a polishing surface; and a polishing constant layer disposed on a rear surface side of the polishing variable layer opposite to the polishing surface.