A retaining ring is provided by fitting several parts. The parts comprises a fixing ring, a grinding ring, and an adhesive part. The fixing ring has a first fixing part, a second fixing part, and an abutting surface. The grinding ring has a first retaining part, a second retaining part, and a corresponding abutting surface. After assembling the first retaining part and first fixing part and assembling the second retaining part and second fixing part, a gap is separately formed between the first retaining part and first fixing part and between the second retaining part and second fixing part. When the adhesive part is adhered between the abutting surface and corresponding abutting surface, the gaps are tightly closed. Thus, the fixing ring and grinding ring are easy to be assembled and solidly combined, and obtain reinforced structural strength.

Provided are a membrane and carrier head using the membrane for polishing apparatus. The membrane comprises a first fixing flap extending inwards from the upper part of a side portion, a second fixing flap extending upwards from the upper part of the side portion, wherein the second fixing flap has a first inclined part, a second inclined part and a third extending part of extending upwards whereby a compensation force generated by the inclined parts realize the constant pressing force to the edge of a substrate during a polishing process.

Provided are a membrane and carrier head using the membrane for polishing apparatus. The membrane comprises a first fixing flap extending inwards from the upper part of a side portion, a second fixing flap extending upwards from the upper part of the side portion, wherein the second fixing flap has a first inclined part, a second inclined part and a third extending part of extending upwards whereby a compensation force generated by the inclined parts realize the constant pressing force to the edge of a substrate during a polishing process.

The present invention discloses a wafer polishing device, which comprises a second pressure medium cavity for detecting pressure changes; a porous disc with a plurality of through holes, and its lower surface is covered with a flexible single cavity film; a conduction valve unit for conduction or isolation between the second pressure medium cavity and the third pressure medium cavity, which at least includes a conduction valve seat, a conduction valve and an elastic part. The lower end of the conduction valve seat extends into the through hole, and protrudes from the lower end face of the conduction valve seat; The conduction valve seat, the porous disc and the covered flexible single cavity membrane combined to form the third pressure medium cavity; a first pressure medium cavity.

Chemically impregnated applicators used to provide hydrophobic surfaces on chemical mechanical polishing system components and related application methods are shown. A method of forming a hydrophobic coating on a surface of a polishing system component includes cleaning the surface of the polishing system component to remove a polishing fluid residue therefrom and applying a hydrophobicity causing chemical solution to the surface of the polishing system component.

A chemical mechanical polishing touch-up tool includes a pedestal configured to support a substrate, a plurality of jaws configured to center the substrate on the pedestal, a loading ring to apply pressure to an annular region on a back side of the substrate on the pedestal, a polishing ring to bring a polishing material into contact with an annular region on a front side of the substrate that is aligned with the annular region on the back side of the substrate, and a polishing ring actuator to rotate the polishing ring to cause relative motion between the polishing ring and the substrate.

A chemical mechanical polishing touch-up tool includes a pedestal configured to support a substrate, a plurality of jaws configured to center the substrate on the pedestal, a loading ring to apply pressure to an annular region on a back side of the substrate on the pedestal, a polishing ring to bring a polishing material into contact with an annular region on a front side of the substrate that is aligned with the annular region on the back side of the substrate, and a polishing ring actuator to rotate the polishing ring to cause relative motion between the polishing ring and the substrate.

An apparatus for polishing a wafer is provided. The apparatus includes a wafer carrier assembly including a head body and a retainer arrangement. The retainer arrangement includes a first retainer segment coupled to an underside of the head body and adjacent an outer sidewall of the wafer carrier and a second retainer segment, separate from the first retainer segment, coupled to the underside of the head body and adjacent the outer sidewall of the wafer carrier. Undersides of the first retainer segment and the second retainer segment are below an underside of the wafer carrier.

An apparatus for polishing a wafer is provided. The apparatus includes a wafer carrier assembly including a head body and a retainer arrangement. The retainer arrangement includes a first retainer segment coupled to an underside of the head body and adjacent an outer sidewall of the wafer carrier and a second retainer segment, separate from the first retainer segment, coupled to the underside of the head body and adjacent the outer sidewall of the wafer carrier. Undersides of the first retainer segment and the second retainer segment are below an underside of the wafer carrier.

A substrate carrier configured to be attached to a polishing system for polishing a substrate is described herein. The substrate carrier includes a housing including a plurality of load couplings and a retaining ring coupled to the housing. The retaining ring can include an annular body having a central axis, an inner edge facing the central axis of the annular body, the inner edge having a diameter configured to surround a substrate, and an outer edge opposite the inner edge, wherein the plurality of load couplings contact the retaining ring at different radial distances measured from the central axis, and wherein the plurality of load couplings are configured to apply a radially differential force to the retaining ring.