To accurately detect a polishing end point even if a change in a polishing frictional force is small. A polishing apparatus includes a polishing table for holding a polishing pad, a holder for holding a polishing target object such that the polishing target object faces the polishing pad, and an end point detector that detects, based on a signal indicating a state of polishing of the polishing target object by the polishing pad, a polishing end point indicating an end of the polishing. The end point detector is configured to remove noise of the signal, exponentiate the signal subjected to the noise removal with an exponent greater than 1, and detect the polishing end point based on the exponentiated signal.

An apparatus for chemical mechanical polishing includes a support for a polishing pad having a polishing surface, and an electromagnetic induction monitoring system to generate a magnetic field to monitor a substrate being polished by the polishing pad. The electromagnetic induction monitoring system includes a core and a coil wound around a portion of the core. The core includes a back portion, a center post extending from the back portion in a first direction normal to the polishing surface, and an annular rim extending from the back portion in parallel with the center post and surrounding and spaced apart from the center post by a gap. A width of the gap is less than a width of the center post, and a surface area of a top surface of the annular rim is at least two times greater than a surface area of a top surface of the center post.

A substrate processing apparatus 1 is configured to supply a processing liquid to a peripheral portion of a wafer W being rotated. The substrate processing apparatus 1 includes a rotating/holding unit 21 configured to rotate and hold the wafer W; a processing liquid discharging unit 73 configured to discharge the processing liquid toward the peripheral portion of the wafer W held by the rotating/holding unit 21; a variation width acquiring unit configured to acquire information upon a variation width of a deformation amount of the peripheral portion of the wafer W; and a discharge controller 7 configured to control a discharge angle and a discharge position of the processing liquid from the processing liquid discharging unit 73 onto the peripheral portion based on the information upon the variation width of the deformation amount of the peripheral portion acquired by the variation width acquiring unit.

An apparatus for checking the diameter of crankpins (15) of a crankshaft during the working on a grinding machine comprises a V-shaped reference device (10), a measuring device (6), and a support device (4) with a first coupling element (9) rotating with respect to a support element (5) connected to the grinding wheel slide (2), and a second coupling element (12) rotating with respect to the first one and carrying the V-shaped reference device. Guiding means with a constraining linkage (20) connected to the support device, guide the engagement of the reference device with a crankpin, during the orbital motion of the latter, binding a part of the movement along a trajectory substantially parallel to the profile of the grinding wheel (1), while not interfering with the movements of the support device in the checking condition. A control device to bring the apparatus to the checking condition comprises a thrust element (40) that cooperates with the support device.

A clamping device for holding a workpiece, in particular a cutting tool, during machining in a grinding machine, wherein peripheral grinding of the workpiece is performed by means of a particularly approximately cup-shaped grinding wheel, wherein the clamping device comprises a support unit provided to be mounted on the grinding machine, a clamping unit comprising a clamping anvil supported in a clamping anvil holding element and translationally drivable to apply a clamping force parallel to a clamping axis, and a drive unit comprising a drive anvil supported in a drive axis and rotationally drivable for rotary orientating the workpiece by means of the drive axis. The clamping unit and the drive unit are provided as individual components, which are releasably or slidably attached to the support unit to form a workpiece spindle headstock of the grinding machine.

A computer-implemented method of generating reference spectra includes polishing a first substrate in a polishing apparatus having a rotatable platen, measuring a sequence of spectra from the substrate during polishing with an in-situ monitoring system, associating each spectrum in the sequence of spectra with a index value equal to a number of platen rotations at which the each spectrum was measured, and storing the sequence of spectra as reference spectra.

A device for automatically measuring a side length of a monocrystal after grinding may include a detection table, a first driver, a mechanical arm and a probe assembly, the detection table is used for placing the monocrystal to be detected, the measuring devices are symmetrically arranged on both sides of the detection table, one end of the first driver is connected to a side of the detection table, an column is disposed above another end of the first driver, and the first driver is capable of driving the column to move horizontally, the mechanical arm is arranged at a side of the column close to the detection table, and the probe assembly is arranged at one end of the mechanical arm away from the column.

A computer-implemented method of generating reference spectra includes polishing a first substrate in a polishing apparatus having a rotatable platen, measuring a sequence of spectra from the substrate during polishing with an in-situ monitoring system, associating each spectrum in the sequence of spectra with a index value equal to a number of platen rotations at which the each spectrum was measured, and storing the sequence of spectra as reference spectra.

The present disclosure relates to a machine tool, such as a grinding machine, and to a method for measuring a workpiece in a machine tool. The machine tool may comprise a workpiece mount (14), a tool unit (28), a measuring device (48) and a control device (56) that is connectable to the measuring device (48) and the tool unit (28), wherein the measuring device (48) is received at the tool unit (28) and comprises at least one toggle measurement head (66; 68), wherein the at least one toggle measurement head (66; 68) is received at a support piece (80) that provides a plurality of defined predetermined locations for the at least one toggle measurement head (66; 68), and wherein the control device (56) is arranged to detect signals that are triggered by the at least one toggle measurement head (66; 68) when touching a workpiece (96), and to determine on the basis of an actual location of the tool unit (28) an actual position of the at least one toggle measurement head (66; 68).

A measuring device for in-process measurement of test pieces during a machining operation on a machine tool, in particular a grinding machine, has a base body, and a measuring head movable between a neutral position and a measuring position and which is connected to the base body via a rod assembly which is configured and set up in such a way that the measuring head in the measuring position follows orbital rotations of a test piece about a rotational axis. The measuring head has a measuring sensor which is deflectable along a linear axis for recording measured values during a measuring operation. A control apparatus is provided for controlling the measuring operation. The control apparatus is configured and set up in such a way that the measuring device may be calibrated in a calibration mode.