A method of thinning a wafer includes measuring an initial thickness of the wafer. The method further includes calculating a polishing time using the initial thickness. The method further includes polishing the wafer for a first duration equal to the polishing time to obtain a polished wafer. The method further includes measuring a polished thickness of the polished wafer. The method further includes calculating an etching time using the polished thickness. The method further includes etching the polished wafer for a second duration equal to the etching time to obtain an etched wafer, wherein the wafer has a total thickness variation of less than or equal to 0.15 μm after etching the polished wafer.

A method of thinning a wafer includes measuring an initial thickness of the wafer. The method further includes calculating a polishing time using the initial thickness. The method further includes polishing the wafer for a first duration equal to the polishing time to obtain a polished wafer. The method further includes measuring a polished thickness of the polished wafer. The method further includes calculating an etching time using the polished thickness. The method further includes etching the polished wafer for a second duration equal to the etching time to obtain an etched wafer, wherein the wafer has a total thickness variation of less than or equal to 0.15 μm after etching the polished wafer.

To specify a trajectory of an eddy current sensor provided on a polishing table of a substrate polishing apparatus, disclosed is a method of identifying a trajectory of an eddy current sensor as seen from a substrate in a substrate polishing apparatus having a polishing table and a polishing head. The method includes: obtaining a sensor output map as three-dimensional data; polishing the substrate; obtaining a profile of the real-time polishing signal as two-dimensional data; and extracting a trajectory having a profile most similar to the profile of the real-time polishing signal as two-dimensional data from the sensor output map as three-dimensional data and identifying the extracted trajectory as a trajectory of the eddy current sensor as seen from the substrate.

To specify a trajectory of an eddy current sensor provided on a polishing table of a substrate polishing apparatus, disclosed is a method of identifying a trajectory of an eddy current sensor as seen from a substrate in a substrate polishing apparatus having a polishing table and a polishing head. The method includes: obtaining a sensor output map as three-dimensional data; polishing the substrate; obtaining a profile of the real-time polishing signal as two-dimensional data; and extracting a trajectory having a profile most similar to the profile of the real-time polishing signal as two-dimensional data from the sensor output map as three-dimensional data and identifying the extracted trajectory as a trajectory of the eddy current sensor as seen from the substrate.

A method for producing bearing components includes providing a first bearing component, a second bearing component, a first production line, and a second production line. The first production line has a first grinding machine, a first honing machine, a first measuring unit, and a first conveyor unit. The second production line has a second grinding machine, a second honing machine, and a second conveyor unit. The method also includes grinding and honing the first bearing component, measuring a first dimension of the first bearing component, grinding and honing the second bearing component, and combining the first bearing component and the second bearing component to form a roller bearing or a slide bearing. The first production line and the second production line are operated in a synchronized manner such that the second grinding machine or the second honing machine is operated under closed-loop control using the first dimension.

A method for producing bearing components includes providing a first bearing component, a second bearing component, a first production line, and a second production line. The first production line has a first grinding machine, a first honing machine, a first measuring unit, and a first conveyor unit. The second production line has a second grinding machine, a second honing machine, and a second conveyor unit. The method also includes grinding and honing the first bearing component, measuring a first dimension of the first bearing component, grinding and honing the second bearing component, and combining the first bearing component and the second bearing component to form a roller bearing or a slide bearing. The first production line and the second production line are operated in a synchronized manner such that the second grinding machine or the second honing machine is operated under closed-loop control using the first dimension.

The invention concerns a method and a grinding machine (4) for machining a workpiece (1) comprising a desired helical groove. The method comprises a step of grinding a calibration groove (12) on the surface (10) of the workpiece according to a predetermined helix pattern of the desired helical groove and by means of an abrasive wheel (2) of the grinding machine. The calibration groove (12) has a calibration length that is equal or smaller than the predetermined length of the desired helical groove and has a calibration depth (120) that is smaller than the predetermined depth of the desired helical groove. The method comprises steps of: determine an abrasive wheel dimension (22, 23, 24, 25) of the abrasive wheel (2) by measuring the calibration depth; and using the determined wheel dimension (22, 23, 24, 25) for grinding the desired helical groove by means of the abrasive wheel (2).

The invention concerns a method and a grinding machine (4) for machining a workpiece (1) comprising a desired helical groove. The method comprises a step of grinding a calibration groove (12) on the surface (10) of the workpiece according to a predetermined helix pattern of the desired helical groove and by means of an abrasive wheel (2) of the grinding machine. The calibration groove (12) has a calibration length that is equal or smaller than the predetermined length of the desired helical groove and has a calibration depth (120) that is smaller than the predetermined depth of the desired helical groove. The method comprises steps of: determine an abrasive wheel dimension (22, 23, 24, 25) of the abrasive wheel (2) by measuring the calibration depth; and using the determined wheel dimension (22, 23, 24, 25) for grinding the desired helical groove by means of the abrasive wheel (2).

A method of automatically determining optimum recipe parameters constituting an operation recipe of an optical film-thickness measuring device within a short period of time is disclosed. The method includes storing in a memory a plurality of parameter sets each including a plurality of recipe parameters constituting an operation recipe; performing simulation of change in film thickness with polishing time with use of the plurality of parameter sets and data of reference spectra of reflected light from a polished substrate, the reference spectra being stored in a data server; inputting at least one index value for evaluating a manner of the change in film thickness into an evaluation calculation formula to calculate a plurality of comprehensive evaluation values for the plurality of parameter sets; and selecting an optimum one of the plurality of parameter sets based on the plurality of comprehensive evaluation values.

A method of automatically determining optimum recipe parameters constituting an operation recipe of an optical film-thickness measuring device within a short period of time is disclosed. The method includes storing in a memory a plurality of parameter sets each including a plurality of recipe parameters constituting an operation recipe; performing simulation of change in film thickness with polishing time with use of the plurality of parameter sets and data of reference spectra of reflected light from a polished substrate, the reference spectra being stored in a data server; inputting at least one index value for evaluating a manner of the change in film thickness into an evaluation calculation formula to calculate a plurality of comprehensive evaluation values for the plurality of parameter sets; and selecting an optimum one of the plurality of parameter sets based on the plurality of comprehensive evaluation values.