This method for manufacturing a cutting blade includes: a mixing step of adding a liquid dispersion medium to a mixed powder containing a resin powder of a thermocompression-bondable resin, abrasive grains and fibrous fillers; a compression step of cold pressing, in a forming die, the mixed powder to which the dispersion medium has been added to form an original plate of a blade main body; and a sintering step of hot pressing and sintering the original plate.

This method for manufacturing a cutting blade includes: a mixing step of adding a liquid dispersion medium to a mixed powder containing a resin powder of a thermocompression-bondable resin, abrasive grains and fibrous fillers; a compression step of cold pressing, in a forming die, the mixed powder to which the dispersion medium has been added to form an original plate of a blade main body; and a sintering step of hot pressing and sintering the original plate.

A method of processing a polycrystalline diamond element may include providing a protective leaching cup having a rear wall, an opening defined by a portion of the protective leaching cup opposite the rear wall, and a side wall extending between the opening and the rear wall, the side wall and the rear wall defining a cavity within the protective leaching cup. The method may further include positioning a polycrystalline diamond element in the cavity defined within the protective leaching cup. Positioning the polycrystalline diamond element in the cavity may include expanding at least a portion of the opening outward from a center of the opening. The method may additionally include exposing at least a portion of the polycrystalline diamond element to a leaching agent.

A method of processing a polycrystalline diamond element may include providing a protective leaching cup having a rear wall, an opening defined by a portion of the protective leaching cup opposite the rear wall, and a side wall extending between the opening and the rear wall, the side wall and the rear wall defining a cavity within the protective leaching cup. The method may further include positioning a polycrystalline diamond element in the cavity defined within the protective leaching cup. Positioning the polycrystalline diamond element in the cavity may include expanding at least a portion of the opening outward from a center of the opening. The method may additionally include exposing at least a portion of the polycrystalline diamond element to a leaching agent.

Metal bond abrasive articles and methods of making metal bond abrasive articles via a focused beam are disclosed. In an aspect, a metal bond abrasive article includes a metallic binder material having abrasive particles retained therein, where the abrasive particles have at least one coating disposed thereon. The coating includes a metal, a metal oxide, a metal carbide, a metal nitride, a metalloid, or combinations thereof, and the at least one coating has an average thickness of 0.5 micrometers or greater. The metal bond abrasive article includes a number of layers directly bonded to each other. Metal bond abrasive articles prepared by the method can include abrasive articles having arcuate or tortuous cooling channels, abrasive segments, abrasive wheels, and rotary dental tools. Further, methods are provided, including receiving, by a manufacturing device having one or more processors, a digital object comprising data specifying a metal bond abrasive article; and generating, with the manufacturing device by an additive manufacturing process, the metal bond abrasive article based on the digital object. A system is also provided, including a display that displays a 3D model of a metal bond abrasive article; and one or more processors that, in response to the 3D model selected by a user, cause a 3D printer to create a physical object of the metal bond abrasive article.

Metal bond abrasive articles and methods of making metal bond abrasive articles via a focused beam are disclosed. In an aspect, a metal bond abrasive article includes a metallic binder material having abrasive particles retained therein, where the abrasive particles have at least one coating disposed thereon. The coating includes a metal, a metal oxide, a metal carbide, a metal nitride, a metalloid, or combinations thereof, and the at least one coating has an average thickness of 0.5 micrometers or greater. The metal bond abrasive article includes a number of layers directly bonded to each other. Metal bond abrasive articles prepared by the method can include abrasive articles having arcuate or tortuous cooling channels, abrasive segments, abrasive wheels, and rotary dental tools. Further, methods are provided, including receiving, by a manufacturing device having one or more processors, a digital object comprising data specifying a metal bond abrasive article; and generating, with the manufacturing device by an additive manufacturing process, the metal bond abrasive article based on the digital object. A system is also provided, including a display that displays a 3D model of a metal bond abrasive article; and one or more processors that, in response to the 3D model selected by a user, cause a 3D printer to create a physical object of the metal bond abrasive article.

An abrasive article including a substrate, a first bonding material including metal overlying the substrate, abrasive particles overlying the substrate and coupled to the first bonding material, and a second bonding material including a metal and phosphorus overlying at least a portion of the first bonding material.

An abrasive article including a substrate, a first bonding material including metal overlying the substrate, abrasive particles overlying the substrate and coupled to the first bonding material, and a second bonding material including a metal and phosphorus overlying at least a portion of the first bonding material.

A synthetic grindstone (100) for chemo-mechanical grinding a wafer S, comprising: an abrasive (101) that contains cerium oxide having an average particle diameter of 10 μm or less as a main component and has a chemo-mechanical grinding action on the wafer S; a friction promoter (102) that contains a fiber material having a Mohs hardness lower than that of the wafer S and a high friction coefficient as a main component and promotes heat generation; and a binder (103) that contains a phenol resin as a main component and disperses and binds the abrasive (101) and the friction promotor (102).

A synthetic grindstone (100) for chemo-mechanical grinding a wafer S, comprising: an abrasive (101) that contains cerium oxide having an average particle diameter of 10 μm or less as a main component and has a chemo-mechanical grinding action on the wafer S; a friction promoter (102) that contains a fiber material having a Mohs hardness lower than that of the wafer S and a high friction coefficient as a main component and promotes heat generation; and a binder (103) that contains a phenol resin as a main component and disperses and binds the abrasive (101) and the friction promotor (102).