A synthetic grindstone for performing surface processing includes: abrasive grains; a vitrified-material binder configured to retain the abrasive grains in a dispersed state; and a filler arranged in the binder in a dispersed state. The filler includes at least one of a first filler having an average grain size larger than an abrasive grain size of the abrasive grains, a second filler having an electrical conductivity, or a third filler having a hardness higher than a hardness of an object to be ground.

A method and apparatus for polishing a substrate that includes a polishing article comprising a polymeric sheet having a raised surface texture, which is formed on the surface of the polymeric sheet is provided. According to one or more implementations of the present disclosure, an advanced polishing article has been developed, which does not require abrasive pad conditioning. In some implementations of the present disclosure, the advanced polishing article comprises a polymeric sheet having a polishing surface with a raised surface texture or micro-features and/or a plurality of grooves or macro-features formed in the polishing surface. In some implementations, the raised surface texture is embossed, etched, machined or otherwise formed in the polishing surface prior to installing and using the advanced polishing article in a polishing system. In one implementation, the raised features have a height within one order of magnitude of the features removed from the substrate during polishing.

A method and apparatus for polishing a substrate that includes a polishing article comprising a polymeric sheet having a raised surface texture, which is formed on the surface of the polymeric sheet is provided. According to one or more implementations of the present disclosure, an advanced polishing article has been developed, which does not require abrasive pad conditioning. In some implementations of the present disclosure, the advanced polishing article comprises a polymeric sheet having a polishing surface with a raised surface texture or micro-features and/or a plurality of grooves or macro-features formed in the polishing surface. In some implementations, the raised surface texture is embossed, etched, machined or otherwise formed in the polishing surface prior to installing and using the advanced polishing article in a polishing system. In one implementation, the raised features have a height within one order of magnitude of the features removed from the substrate during polishing.

Disclosed is a polishing pad including a polishing layer that is a molded body of a polyurethane composition, wherein the polyurethane composition contains 90 to 99.9 mass % of a thermoplastic polyurethane including a non-alicyclic diisocyanate unit as an organic diisocyanate unit, and 0.1 to 10 mass % of a hygroscopic polymer, and the molded body has a hardness of 60 or more and less than 75, as measured with a type-D durometer compliant with JIS K 7215.

The present invention provides a method for manufacturing a wafer polishing head, the method comprising the steps of: coupling a guide ring consisting of a plurality of layers to the edge of a base substrate; rounding the edge of the guide ring; forming a first coating layer on the rounded surface of the guide ring through coating; fixing a rubber chuck to the base substrate; and forming a second coating layer on the outer circumferential surfaces of an adhesive and an adhesive material through coating, from the rubber chuck to the first coating layer.

An abrasive article has an abrasive portion with an organic bond and abrasive particles. The abrasive article has a non-abrasive portion (NAP) mounted to the abrasive portion. The NAP includes molding compound (MC) having chopped strand fibers (CSF). The CSF can be coated with a thermoplastic coating having a loss on ignition (LOI) of at least about 2.4 wt %, and the NAP having no abrasive particles. The NAP can include an MC having no abrasive particles with a MOHS scale hardness of at least about 9. The NAP may include CSF coated with a primary coating and a secondary coating on the primary coating. The NAP may have an outer diameter that is at least half of but not greater than an outer diameter of the abrasive article.

An abrasive article has an abrasive portion with an organic bond and abrasive particles. The abrasive article has a non-abrasive portion (NAP) mounted to the abrasive portion. The NAP includes molding compound (MC) having chopped strand fibers (CSF). The CSF can be coated with a thermoplastic coating having a loss on ignition (LOI) of at least about 2.4 wt %, and the NAP having no abrasive particles. The NAP can include an MC having no abrasive particles with a MOHS scale hardness of at least about 9. The NAP may include CSF coated with a primary coating and a secondary coating on the primary coating. The NAP may have an outer diameter that is at least half of but not greater than an outer diameter of the abrasive article.

Implementations disclosed herein generally relate to polishing articles and methods for manufacturing polishing articles used in polishing processes. More specifically, implementations disclosed herein relate to porous polishing pads produced by processes that yield improved polishing pad properties and performance, including tunable performance. Additive manufacturing processes, such as three-dimensional printing processes provides the ability to make porous polishing pads with unique properties and attributes.

A polishing pad is provided with a spiral groove or concentric grooves disposed spanning from a central region to a peripheral edge region of a polishing surface of the polishing pad, and radial grooves including line segment-shaped grooves extending from the central region toward the peripheral edge region. The line segment-shaped grooves have a first end portion and a second end portion, positioned at a distance of 5 to 10% and at a distance of 35 to 70% of the radius of the polishing surface from a center of the radial grooves, respectively, and the line segment-shaped grooves have an average length of 30 to 65% of the radius of the polishing surface. A cross-sectional area Sa (mm.sup.2) of the line segment-shaped grooves and a cross-sectional area Sb (mm.sup.2) of the spiral groove or the concentric grooves satisfy 0.1Sb/Sa<1.0.

An abrasive article can include a body including a bond material, abrasive particles contained in the bond material, and an impact modifier. In an embodiment, the impact modifier can be in a content of at least 1 vol % of and at most 10 vol % for a total volume of the body. In another embodiment, the impact modifier can include particles having an average particle size (D.sub.50) of at least 10 microns, a particle size D.sub.10 of at least 2 microns, a particles size D.sub.90 of at most 2 mm or any combination thereof.