A method of processing a wafer having a first surface and a second surface opposite the first surface is provided. The method includes the steps of: holding the second surface of the wafer such that the first surface thereof is exposed; processing an exposed first surface side of an outer circumferential edge portion of the wafer with a processing tool including a grinding stone made of abrasive grains bound together by a bonding material, thereby forming on the outer circumferential edge portion a slanted surface that is inclined to the first surface so as to be progressively closer to the second surface in a direction from a central area of the wafer toward an outer circumferential edge thereof; and coating the first surface of the wafer with a liquid material according to a spin coating process, thereby forming a resist film on the first surface of the wafer.

Methods of making metal bond abrasive articles via powder bed jetting are disclosed. Metal bond abrasive articles prepared by the method include abrasive articles having arcuate or tortuous cooling channels, abrasive segments, abrasive wheels, and rotary dental tools.

Methods of making metal bond abrasive articles via powder bed jetting are disclosed. Metal bond abrasive articles prepared by the method include abrasive articles having arcuate or tortuous cooling channels, abrasive segments, abrasive wheels, and rotary dental tools.

A method of making a coated abrasive article includes disposing abrasive composite precursors on a major surface of a water-soluble film. The abrasive composite precursors are lightly contacted with a porous fibrous backing, and the abrasive composite precursor are hardened to form abrasive composites. Dissolving the water-soluble film provides the coated abrasive article.

A method of making a coated abrasive article includes disposing abrasive composite precursors on a major surface of a water-soluble film. The abrasive composite precursors are lightly contacted with a porous fibrous backing, and the abrasive composite precursor are hardened to form abrasive composites. Dissolving the water-soluble film provides the coated abrasive article.

A bonded abrasive wheel is disclosed comprising a plurality of abrasive particles disposed in a binder, a first grinding surface, a second surface opposing the first grinding surface, and an outer circumference. The wheel comprises a rotational axis extending through a central hub and a circuit configured as a Radio Frequency Identification (RFID) unit coupled to the abrasive wheel. The circuit comprises an antenna configured to communicate with one or more external devices and comprising a first end and a second end, wherein antenna has a radius of curvature about an axis along at least a portion thereof such that the first end is disposed adjacent to but is spaced from the second end, and an integrated circuit (IC) operably coupled to the antenna and configured to store at least a first data.

A lapping material having a knitted fabric constituted by warp knitting or weft knitting, and a resin with which the knitted fabric is impregnated.

A lapping material having a knitted fabric constituted by warp knitting or weft knitting, and a resin with which the knitted fabric is impregnated.

The present invention concerns a chemical mechanical polishing pad having a polishing layer. The polishing layer contains an extruded sheet. The extruded sheet is a photopolymerizable composition containing a block copolymer, a UV curable acrylate, and a photoinitiator.

The present invention concerns a chemical mechanical polishing pad having a polishing layer. The polishing layer contains an extruded sheet. The extruded sheet is a photopolymerizable composition containing a block copolymer, a UV curable acrylate, and a photoinitiator.