A robotic system configured to use a multi-mode end effector is disclosed. In various embodiments, a grasp strategy is determined for a robot to grasp an object in a workspace, wherein the determined grasp strategy is associated with a corresponding one of a plurality of grasping modes of operation of a multi-mode robotic end effector associated with the robot. A command to grasp the object using the multi-mode robotic end effector in the grasping mode of operation associated with the determined grasp strategy is sent to the robot.

A multi-mode robotic end effector is disclosed. In various embodiments, a multi-mode robotic end effector includes a first set of structures configured to grasp objects in a first mode of operation; a retraction mechanism configured to retract the first set of structures to a stowed position associated with a second mode of operation in response to a retraction command; and a second set of structures configured to grasp objects in a second mode of operation.

There is provided a conveying apparatus having a holding surface that holds a held surface of a substrate to convey the substrate. The conveying apparatus includes a holding pad that gets contact with an outer circumferential part of the held surface of the substrate or a side surface of the substrate and forms a space to be filled with water between the held surface of the substrate and the holding surface, a movement unit that causes the holding pad to move in such a direction as to get closer to or further away from the held surface, a water supply unit that supplies the water to the space, and a suction unit that sucks the water with which the space is filled and improves a force of holding the substrate. The conveying apparatus holds the substrate by the holding pad and conveys the substrate with the interposition of the water.

A substrate transfer apparatus includes: a body including a first surface to which a semiconductor substrate is suctioned and a second surface opposing the first surface, the first surface including a cavity disposed in a center region of the body and an attaching unit disposed on an edge of the body so as to surround the cavity and form negative pressure to suction the semiconductor substrate, and a connector connected to the second surface of the body and supporting the body, wherein the cavity includes a lower surface with at least one through hole penetrating the first and second surfaces of the body and connecting the cavity to an external space, and the cavity includes a side surface inclined at an angle of 2.9° to 5° with respect to the first surface at the edge of the body.

A suction gripper head comprising at least one carrier and a soleplate (14) for resting against an item to be lifted, the soleplate being arranged in the bottom portion of the carrier. According to the invention, the head comprises a foam body (1) having a suction path arranged therein between the soleplate and an outlet orifice of the gripper head for connection to a suction block, the foam body thus acting on its own, over at least a portion of the path, to form the separation between air sucked through said path and the outside of the gripper head, such that the air that is being sucked comes directly into contact with the foam of the foam body.

A securement apparatus is provided that includes a robotic arm having a plurality of axes of rotation, one or more position cameras, a controller in communication with the robotic arm to control displacement and articulation of the robotic arm using at least in part, position data received from the one or more position cameras, a mirror gripper positioned at a first end of the robotic arm for engaging a mirror, and an air knife having one or more nozzles for providing an air sheet of forceful air.

The present invention relates to a micro LED transfer head transferring micro LEDs from a first substrate to a second substrate. According to the present invention, vacuum pressure of a grip region where the micro LEDs are gripped is uniformized, so that the micro LED transfer head transfers the micro LEDs efficiently. In addition, the vacuum pressure is distributed over a grip surface where the micro LEDs are gripped, thereby improving efficiency of transferring the micro LEDs.

A substrate transfer apparatus includes: a body including a first surface to which a semiconductor substrate is suctioned and a second surface opposing the first surface, the first surface including a cavity disposed in a center region of the body and an attaching unit disposed on an edge of the body so as to surround the cavity and form negative pressure to suction the semiconductor substrate, and a connector connected to the second surface of the body and supporting the body, wherein the cavity includes a lower surface with at least one through hole penetrating the first and second surfaces of the body and connecting the cavity to an external space, and the cavity includes a side surface inclined at an angle of 2.9° to 5° with respect to the first surface at the edge of the body.

A method of applying a label to a transport structure includes receiving the label from a label dispenser with an end effector, in which the label includes information related to a plurality of storage containers secured to the transport structure with a restraining member. The method further includes measuring a position of the end effector relative to an object, moving the end effector with the label to a target position based upon the measured position, and applying the label to the restraining member with the end effector. The method may further include moving the end effector away from the storage containers, and transporting the transport structure with the storage containers and the label based upon the information of the label.

An apparatus, system and method for providing a vacuum grip for an end effector. The apparatus, system and method may include a vacuum draw eyelet connectively associated with a vacuum at a base portion thereof, and having a larger cross-sectional circumference at a topmost portion thereof than at the base portion; an extending cup foam portion including a receiving portion suitable for receiving therewithin the larger cross-sectional circumference of the topmost portion; and a wire clip having two legs inserted along a cross-sectional plane of the extending cup foam portion, the two legs being suitable to compress the receiving portion into frictional contact at two tangent points on a second cross-sectional circumference of the vacuum draw eyelet below the larger cross-sectional circumference.